Hurwitz; Dror

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hurwitz; Dror.The latest application filed is for "packaged electronic components".

Company Profile

7.59.65

Hurwitz; Dror - Zhuhai CN
Hurwitz; Dror - Guangdong CN
Hurwitz; Dror - Gongbei CN
Hurwitz; Dror - Gilboa IL
Hurwitz; Dror - D.N. Gilboa IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packages with organic back ends for electronic components Grant 11,245,383 - Hurwitz , et al. February 8, 2	2022-02-08
Packaged Electronic Components App 20210297054 - Hurwitz; Dror ; et al.	2021-09-23
Packaged electronic components Grant 11,063,571 - Hurwitz , et al. July 13, 2	2021-07-13
Packaged Electronic Components App 20210028754 - Hurwitz; Dror ; et al.	2021-01-28
Method for Packaging an Electronic Component in a Package with an Organic Back End App 20210028751 - Hurwitz; Dror ; et al.	2021-01-28
Packages with Organic Back Ends for Electronic Components App 20210028766 - Hurwitz; Dror ; et al.	2021-01-28
Method of fabricating novel packages for electronic components Grant 10,797,681 - Hurwitz , et al. October 6, 2	2020-10-06
Substrates with ultra fine pitch flip chip bumps Grant 10,779,417 - Hurwitz , et al. Sept	2020-09-15
Method for fabricating single crystal piezoelectric RF resonators and filters with improved cavity definition Grant 10,771,031 - Hurwitz Sep	2020-09-08
Single crystal piezoelectric RF resonators and filters with improved cavity definition Grant 10,630,259 - Hurwitz	2020-04-21
RF resonator electrode and membrane combinations and method of fabrication Grant 10,601,397 - Hurwitz	2020-03-24
RF resonator membranes and methods of construction Grant 10,508,364 - Hurwitz Dec	2019-12-17
Method of fabrication for single crystal piezoelectric RF resonators and filters Grant 10,466,572 - Hurwitz No	2019-11-05
Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor Grant 10,446,335 - Hurwitz , et al. Oc	2019-10-15
Method for fabricating RF resonators and filters Grant 10,439,581 - Hurwitz O	2019-10-08
Method for fabricating RF resonators and filters Grant 10,439,580 - Hurwitz O	2019-10-08
Single crystal piezoelectric RF resonators and filters Grant 10,389,331 - Hurwitz A	2019-08-20
Single Crystal Piezoelectric Rf Resonators And Filters With Improved Cavity Definition App 20190245515 - Hurwitz; Dror	2019-08-08
Method For Fabricating Single Crystal Piezoelectric Rf Resonators And Filters With Improved Cavity Definition App 20190245509 - Hurwitz; Dror	2019-08-08
Multilayer electronic structures with embedded filters Grant 10,236,854 - Hurwitz , et al.	2019-03-19
Multilayer Electronic Structures with Embedded Filters App 20180367114 - Hurwitz; Dror ; et al.	2018-12-20
RF resonators and filters Grant 10,153,750 - Hurwitz Dec	2018-12-11
RF resonators and filters Grant 10,141,912 - Hurwitz Nov	2018-11-27
Novel Rf Resonator Electrode And Membrane Combinations & Method Of Fabrication App 20180278233 - Hurwitz; Dror	2018-09-27
Single Crystal Piezoelectric RF Resonators and Filters App 20180278231 - Hurwitz; Dror	2018-09-27
Rf Resonators And Filters App 20180278236 - Hurwitz; Dror	2018-09-27
Rf Resonators And Filters App 20180278234 - Hurwitz; Dror	2018-09-27
Novel Rf Resonator Membranes And Methods Of Construction App 20180274127 - Hurwitz; Dror	2018-09-27
Method For Fabricating Rf Resonators And Filters App 20180278227 - Hurwitz; Dror	2018-09-27
Method Of Fabrication For Single Crystal Piezoelectric Rf Resonators And Filters App 20180275485 - Hurwitz; Dror	2018-09-27
Method For Fabricating Rf Resonators And Filters App 20180278228 - Hurwitz; Dror	2018-09-27
Multilayer electronic structures with embedded filters Grant 10,014,843 - Hurwitz , et al. July 3, 2	2018-07-03
Interposer frame with polymer matrix and methods of fabrication Grant 9,949,373 - Hurwitz , et al. April 17, 2	2018-04-17
Embedded packages Grant 9,911,700 - Hurwitz , et al. March 6, 2	2018-03-06
Substrates with Ultra Fine Pitch Flip Chip Bumps App 20170374747 - Hurwitz; Dror ; et al.	2017-12-28
Chip package Grant 9,779,940 - Hurwitz , et al. October 3, 2	2017-10-03
Novel Embedded Packages App 20170213793 - HURWITZ; Dror ; et al.	2017-07-27
Terminations Grant 9,673,063 - Hurwitz , et al. June 6, 2	2017-06-06
Interposer Frame With Polymer Matrix And Methods Of Fabrication App 20170127527 - Hurwitz; Dror ; et al.	2017-05-04
Composite electronic structure with partially exposed and protruding copper termination posts Grant 9,642,261 - Hurwitz , et al. May 2, 2	2017-05-02
Novel Terminations App 20170117161 - HURWITZ; Dror ; et al.	2017-04-27
Multilayer electronic support structure with integral constructional elements Grant 9,615,447 - Hurwitz , et al. April 4, 2	2017-04-04
Chip package Grant 9,589,920 - Hurwitz , et al. March 7, 2	2017-03-07
Method of fabricating a polymer frame with a rectangular array of cavities Grant 9,554,469 - Hurwitz , et al. January 24, 2	2017-01-24
Chip Package App 20170005058 - Hurwitz; Dror ; et al.	2017-01-05
Chip Package App 20170005057 - Hurwitz; Dror ; et al.	2017-01-05
Multilayer electronic structures with integral vias extending in in-plane direction Grant 9,440,135 - Hurwitz September 13, 2	2016-09-13
Method For Fabricating Film Bulk Acoustic Resonator Filters App 20160197593 - Hurwitz; Dror ; et al.	2016-07-07
Film Bulk Acoustic Resonator Filter App 20160197596 - Hurwitz; Dror ; et al.	2016-07-07
Film bulk acoustic resonator filter Grant 9,374,059 - Hurwitz , et al. June 21, 2	2016-06-21
Method Of Fabricating A Polymer Frame With A Rectangular Array Of Cavities App 20160165731 - Hurwitz; Dror ; et al.	2016-06-09
Thin film capacitors embedded in polymer dielectric Grant 9,349,788 - Hurwitz , et al. May 24, 2	2016-05-24
Multilayer electronic structure with novel transmission lines Grant 9,312,593 - Hurwitz April 12, 2	2016-04-12
Multilayer Electronic Structure With Integral Faraday Shielding App 20160081201 - Hurwitz; Dror	2016-03-17
Multilayer electronic structure with integral stepped stacked structures Grant 9,269,593 - Hurwitz February 23, 2	2016-02-23
Method for fabricating embedded chips Grant 9,240,392 - Hurwitz , et al. January 19, 2	2016-01-19
Multilayer electronic structure with through thickness coaxial structures Grant 9,185,793 - Hurwitz , et al. November 10, 2	2015-11-10
Interposer Frame With Polymer Matrix And Methods Of Fabrication App 20150296617 - Hurwitz; Dror ; et al.	2015-10-15
Method For Fabricating Embedded Chips App 20150294896 - Hurwitz; Dror ; et al.	2015-10-15
Multilayer electronic structure with stepped holes Grant 9,161,461 - Hurwitz , et al. October 13, 2	2015-10-13
Embedded Chips App 20150279814 - Hurwitz; Dror ; et al.	2015-10-01
Alignment between layers of multilayer electronic support structures Grant 9,137,905 - Hurwitz , et al. September 15, 2	2015-09-15
Polymer Frame for a Chip, Such That the Frame Comprises at Least One Via in Series with a Capacitor App 20150228416 - Hurwitz; Dror ; et al.	2015-08-13
Substrates with Protruding Copper Termination Posts App 20150214171 - Hurwitz; Dror ; et al.	2015-07-30
Substrates With Ultra Fine Pitch Flip Chip Bumps App 20150195912 - Hurwitz; Dror ; et al.	2015-07-09
Terminations and couplings between chips and substrates Grant 9,049,791 - Hurwitz , et al. June 2, 2	2015-06-02
Method of fabrication, a multilayer electronic structure and structures in accordance with the method Grant 8,997,342 - Hurwitz , et al. April 7, 2	2015-04-07
Multilayer electronic support structure with cofabricated metal core Grant 8,987,602 - Hurwitz , et al. March 24, 2	2015-03-24
Thin Film Capacitors Embedded in Polymer Dielectric App 20150043126 - Hurwitz; Dror ; et al.	2015-02-12
Multilayer Electronic Structures with Embedded Filters App 20150042415 - Hurwitz; Dror ; et al.	2015-02-12
Single layer coreless substrate Grant 8,945,994 - Hurwitz , et al. February 3, 2	2015-02-03
Single Layer Coreless Substrate App 20140377914 - Hurwitz; Dror ; et al.	2014-12-25
Novel Terminations and Couplings Between Chips and Substrates App 20140363927 - Hurwitz; Dror ; et al.	2014-12-11
Single layer coreless substrate Grant 8,866,286 - Hurwitz , et al. October 21, 2	2014-10-21
Multilayer electronic structures with vias having different dimensions Grant 8,816,218 - Hurwitz August 26, 2	2014-08-26
Single Layer Coreless Substrate App 20140167234 - Hurwitz; Dror ; et al.	2014-06-19
Multilayer Electronic Structures with Improved Control of Dielectric Thickness App 20140102765 - Hurwitz; Dror ; et al.	2014-04-17
Multilayer Electronic Support Structure with Integral Constructional Elements App 20140020945 - Hurwitz; Dror ; et al.	2014-01-23
Alignment Between Layers Of Multilayer Electronic Support Structures App 20130344628 - HURWITZ; DROR ; et al.	2013-12-26
Multilayer Electronic Support Structure With Integral Metal Core App 20130333924 - Hurwitz; Dror ; et al.	2013-12-19
Multilayer Electronic Structure With Stepped Holes App 20130333934 - Hurwitz; Dror ; et al.	2013-12-19
Multilayer Electronic Structure With Integral Faraday Shielding App 20130322029 - HURWITZ; DROR	2013-12-05
Multilayer Electronic Structure With Through Thickness Coaxial Structures App 20130319738 - HURWITZ; DROR ; et al.	2013-12-05
Multilayer Electronic Structure With Novel Transmission Lines App 20130321104 - HURWITZ; DROR	2013-12-05
Multilayer Electronic Structure With Integral Stepped Stacked Structures App 20130319737 - HURWITZ; DROR	2013-12-05
Multilayer Electronic Structures With Vias Having Different Dimensions App 20130319747 - HURWITZ; DROR	2013-12-05
Multilayer Electronic Structures With Integral Vias Extending In In-plane Direction App 20130319736 - HURWITZ; DROR	2013-12-05
Advanced multilayer coreless support structures and method for their fabrication Grant 7,682,972 - Hurwitz , et al. March 23, 2	2010-03-23
Coreless cavity substrates for chip packaging and their fabrication Grant 7,669,320 - Hurwitz , et al. March 2, 2	2010-03-02
Integrated circuit support structures and their fabrication Grant 7,635,641 - Hurwitz , et al. December 22, 2	2009-12-22
Coreless Cavity Substrates For Chip Packaging And Their Fabrication App 20070289127 - HURWITZ; Dror ; et al.	2007-12-20
Advanced Multilayered Coreless Support Structures and their Fabrication App 20070281471 - Hurwitz; Dror ; et al.	2007-12-06
Novel integrated circuit support structures and their fabrication App 20070082501 - Hurwitz; Dror ; et al.	2007-04-12
Process for manufacturing a chip carrier substrate Grant 6,280,640 - Hurwitz , et al. August 28, 2	2001-08-28
Electronic interconnect structure and method for manufacturing it Grant 6,262,478 - Hurwitz , et al. July 17, 2	2001-07-17
Chip carrier substrate Grant 6,262,376 - Hurwitz , et al. July 17, 2	2001-07-17
Method for manufacturing an electronic structure Grant 5,946,600 - Hurwitz , et al. August 31, 1	1999-08-31