Hurtubise; Richard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hurtubise; Richard.The latest application filed is for "copper deposition in wafer level packaging of integrated circuits".

Company Profile

6.28.35

Hurtubise; Richard - Clinton CT
Hurtubise; Richard - West Haven CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper electrodeposition in microelectronics Grant RE49,202 - Paneccasio, Jr. , et al. September 6, 2	2022-09-06
Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20210388519 - Richardson; Thomas ; et al.	2021-12-16
Copper deposition in wafer level packaging of integrated circuits Grant 11,124,888 - Richardson , et al. September 21, 2	2021-09-21
Copper Electrodeposition in Microelectronics App 20190390356 - Paneccasio, Jr.; Vincent ; et al.	2019-12-26
Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20190368064 - Richardson; Thomas ; et al.	2019-12-05
Copper filling of through silicon vias Grant 10,221,496 - Richardson , et al.	2019-03-05
Copper Filling Of Through Silicon Vias App 20190003068 - Richardson; Thomas B. ; et al.	2019-01-03
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 9,613,858 - Paneccasio, Jr. , et al. April 4, 2	2017-04-04
Copper Electrodeposition in Microelectronics App 20170029972 - Paneccasio, JR.; Vincent ; et al.	2017-02-02
Copper electrodeposition in microelectronics Grant 9,493,884 - Paneccasio, Jr. , et al. November 15, 2	2016-11-15
Electrodeposition of Copper App 20160281251 - Paneccasio; Vincent ; et al.	2016-09-29
Defect reduction in electrodeposited copper for semiconductor applications Grant 9,222,188 - Commander , et al. December 29, 2	2015-12-29
Method And Composition For Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20140322912 - Paneccasio, JR.; Vincent ; et al.	2014-10-30
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 8,771,495 - Paneccasio, Jr. , et al. July 8, 2	2014-07-08
Copper Electrodeposition In Microelectronics App 20140102909 - Paneccasio, JR.; Vincent ; et al.	2014-04-17
Copper electrodeposition in microelectronics Grant 8,608,933 - Paneccasio, Jr. , et al. December 17, 2	2013-12-17
Method And Composition For Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20130241060 - Paneccasio, JR.; Vincent ; et al.	2013-09-19
Copper Filling Of Through Silicon Vias App 20130199935 - Richardson; Thomas B. ; et al.	2013-08-08
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 8,388,824 - Paneccasio, Jr. , et al. March 5, 2	2013-03-05
Copper Electrodeposition In Microelectronics App 20120043218 - Paneccasio, JR.; Vincent ; et al.	2012-02-23
Copper electrodeposition in microelectronics Grant 8,002,962 - Paneccasio , et al. August 23, 2	2011-08-23
Surface preparation process for damascene copper deposition Grant 7,998,859 - Chen , et al. August 16, 2	2011-08-16
Copper deposition for filling features in manufacture of microelectronic devices Grant 7,968,455 - Lin , et al. June 28, 2	2011-06-28
Copper Deposition For Filling Features In Manufacture Of Microelectronic Devices App 20100285660 - Lin; Xuan ; et al.	2010-11-11
Copper electrodeposition in microelectronics Grant 7,815,786 - Paneccasio, Jr. , et al. October 19, 2	2010-10-19
Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20100126872 - Paneccasio, JR.; Vincent ; et al.	2010-05-27
Manufacture of electroless cobalt deposition compositions for microelectronics applications Grant 7,704,306 - Chen , et al. April 27, 2	2010-04-27
Surface Preparation Process For Damascene Copper Deposition App 20100075496 - Chen; Qingyun ; et al.	2010-03-25
Copper metallization of through silicon via Grant 7,670,950 - Richardson , et al. March 2, 2	2010-03-02
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,615,491 - Chen , et al. November 10, 2	2009-11-10
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,611,987 - Chen , et al. November 3, 2	2009-11-03
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,611,988 - Chen , et al. November 3, 2	2009-11-03
Metrology In Electroless Cobalt Plating App 20090155468 - Petrov; Nicolai ; et al.	2009-06-18
Copper Metallization Of Through Silicon Via App 20090035940 - Richardson; Thomas B. ; et al.	2009-02-05
Self-initiated Alkaline Metal Ion Free Electroless Deposition Composition For Thin Co-based And Ni-based Alloys App 20080254205 - Petrov; Nicolai ; et al.	2008-10-16
Cobalt Capping Surface Preparation In Microelectronics Manufacture App 20080236619 - Chen; Qingyun ; et al.	2008-10-02
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,410,899 - Chen , et al. August 12, 2	2008-08-12
Capping of metal interconnects in integrated circuit electronic devices Grant 7,393,781 - Yakobson , et al. July 1, 2	2008-07-01
Defect Reduction In Electrodeposited Copper For Semiconductor Applications App 20080121527 - Commander; John ; et al.	2008-05-29
Manufacture Of Electroless Cobalt Deposition Compositions For Microelectronics Applications App 20080090414 - Chen; Qingyun ; et al.	2008-04-17
Cobalt and nickel electroless plating in microelectronic devices Grant 7,332,193 - Valverde , et al. February 19, 2	2008-02-19
Defect reduction in electrodeposited copper for semiconductor applications Grant 7,316,772 - Commander , et al. January 8, 2	2008-01-08
Capping Of Metal Interconnects In Integrated Circuit Electronic Devices App 20070298609 - Yakobson; Eric ; et al.	2007-12-27
Copper Electrodeposition In Microelectronics App 20070289875 - Paneccasio; Vincent JR. ; et al.	2007-12-20
Copper electrodeposition in microelectronics Grant 7,303,992 - Paneccasio , et al. December 4, 2	2007-12-04
Capping of metal interconnects in integrated circuit electronic devices Grant 7,268,074 - Yakobson , et al. September 11, 2	2007-09-11
Copper electrodeposition in microelectronics App 20070178697 - Paneccasio; Vincent JR. ; et al.	2007-08-02
Defectivity and process control of electroless deposition in microelectronics applications App 20070062408 - Chen; Qingyun ; et al.	2007-03-22
Defectivity and process control of electroless deposition in microelectronics applications App 20070066058 - Chen; Qingyun ; et al.	2007-03-22
Defectivity and process control of electroless deposition in microelectronics applications App 20070066057 - Chen; Qingyun ; et al.	2007-03-22
Cobalt electroless plating in microelectronic devices App 20060280860 - Paneccasio; Vincent JR. ; et al.	2006-12-14
Cobalt self-initiated electroless via fill for stacked memory cells App 20060188659 - Chen; Qingyun ; et al.	2006-08-24
Copper electrodeposition in microelectronics App 20060141784 - Paneccasio; Vincent JR. ; et al.	2006-06-29
Cobalt and nickel electroless plating in microelectronic devices App 20060083850 - Valverde; Charles ; et al.	2006-04-20
Capping of metal interconnects in integrated circuit electronic devices App 20050275100 - Yakobson, Eric ; et al.	2005-12-15
Copper electrodeposition in microelectronics App 20050045488 - Paneccasio, Vincent JR. ; et al.	2005-03-03
Defect reduction in electrodeposited copper for semiconductor applications App 20030168343 - Commander, John ; et al.	2003-09-11