Hur; Sungpil
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hur; Sungpil.The latest application filed is for "integrated circuit package system with molding vents".
- Hur; Sungpil - Icheon-si N/A KR
- Hur; Sungpil - Yeouju-kun KR
| Patent | Date |
|---|---|
| Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof Grant 9,129,978 - Kim , et al. September 8, 2 | 2015-09-08 |
| Integrated circuit package system with molding vents Grant 7,863,761 - Lee , et al. January 4, 2 | 2011-01-04 |
| Integrated Circuit Package System With Molding Vents App 20080029873 - Lee; Dal Jae ; et al. | 2008-02-07 |
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