Hur; Hyungjun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hur; Hyungjun.The latest application filed is for "improving substrate wettability for plating operations".
- Hur; Hyungjun - Tigard OR
| Patent | Date |
|---|---|
| Controlling plating electrolyte concentration on an electrochemical plating apparatus Grant 11,401,623 - He , et al. August 2, 2 | 2022-08-02 |
| Improving Substrate Wettability For Plating Operations App 20210366768 - HE; Zhian ; et al. | 2021-11-25 |
| Controlling Plating Electrolyte Concentration On An Electrochemical Plating Apparatus App 20210130976 - He; Zhian ; et al. | 2021-05-06 |
| Controlling plating electrolyte concentration on an electrochemical plating apparatus Grant 10,927,475 - He , et al. February 23, 2 | 2021-02-23 |
| Controlling Plating Electrolyte Concentration On An Electrochemical Plating Apparatus App 20190127872 - He; Zhian ; et al. | 2019-05-02 |
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