Hupe; Jurgen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hupe; Jurgen.The latest application filed is for "direct metallization of electrically non-conductive polyimide substrate surfaces".

Company Profile

0.6.4

Hupe; Jurgen - Langenfeld DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Direct metallization of electrically non-conductive polyimide substrate surfaces Grant 7,815,785 - Kronenberg , et al. October 19, 2	2010-10-19
Direct Metallization Of Electrically Non-conductive Polyimide Substrate Surfaces App 20070298170 - Kronenberg; Walter ; et al.	2007-12-27
Method for metallizing plastic surfaces App 20050266165 - Mobius, Andreas ; et al.	2005-12-01
Process for the non-galvanic tin plating of copper or copper alloys Grant 6,821,323 - Bell , et al. November 23, 2	2004-11-23
Method for selectively metalizing dieletric materials App 20040026254 - Hupe, Jurgen ; et al.	2004-02-12
Method for metal coating of substrates Grant 6,589,593 - Hupe , et al. July 8, 2	2003-07-08
Process for electroplating a work piece coated with an electrically conducting polymer App 20020157959 - Kronenberg, Walter ; et al.	2002-10-31
Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards Grant 6,007,866 - Hupe , et al. December 28, 1	1999-12-28
Through-hole plate printed circuit board with resist and process for manufacturing same Grant 5,373,629 - Hupe , et al. * December 20, 1	1994-12-20
Through-hole plated printed circuit board and process for manufacturing same Grant 5,194,313 - Hupe , et al. March 16, 1	1993-03-16

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