Hunt; John Richard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hunt; John Richard.The latest application filed is for "semiconductor device packages and stacked package assemblies including high density interconnections".

Company Profile

9.8.9

Hunt; John Richard - Kaohsiung TW
Hunt; John Richard - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,916,429 - Hunt , et al. February 9, 2	2021-02-09
Stacked semiconductor package assemblies including double sided redistribution layers Grant 10,886,263 - Chen , et al. January 5, 2	2021-01-05
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20200111671 - HUNT; John Richard ; et al.	2020-04-09
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,535,521 - Hunt , et al. Ja	2020-01-14
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,515,806 - Hunt , et al. Dec	2019-12-24
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20190206683 - HUNT; John Richard ; et al.	2019-07-04
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20190206684 - HUNT; John Richard ; et al.	2019-07-04
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,276,382 - Hunt , et al.	2019-04-30
Stacked Semiconductor Package Assemblies Including Double Sided Redistribution Layers App 20190103386 - CHEN; William T. ; et al.	2019-04-04
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20180047571 - HUNT; John Richard ; et al.	2018-02-15
Wafer Level Semiconductor Package And Manufacturing Methods Thereof App 20160233169 - Hunt; John Richard	2016-08-11
Wafer level semiconductor package and manufacturing methods thereof Grant 9,343,333 - Hunt May 17, 2	2016-05-17
Wafer Level Semiconductor Package And Manufacturing Methods Thereof App 20150140737 - Hunt; John Richard	2015-05-21
Wafer level semiconductor package and manufacturing methods thereof Grant 8,941,222 - Hunt January 27, 2	2015-01-27
Wafer Level Semiconductor Package And Manufacturing Methods Thereof App 20120119373 - HUNT; JOHN RICHARD	2012-05-17
Semiconductor Package and Manufacturing Methods Thereof App 20110127654 - Weng; Chaofu ; et al.	2011-06-02

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