HUNSTIG; Matthias

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUNSTIG; Matthias.The latest application filed is for "method for producing an electrically conductive connection".

Company Profile

3.2.11

HUNSTIG; Matthias - Paderborn DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ultrasonic Tool And Ultrasonic Connection Device Therefor App 20220193814 - UNGER; Andreas ; et al.	2022-06-23
Device For Heating And Determining An Actual Temperature Of A Bonding Tool Of An Ultrasonic Bonding Device App 20220193812 - UNGER; Andreas ; et al.	2022-06-23
Bonding Arrangement And Bonding Tool App 20220193815 - UNGER; Andreas ; et al.	2022-06-23
Apparatus And Method For Detecting The Temperature Of A Bonding Tool During Laser-assisted Ultrasonic Bonding App 20220193811 - UNGER; Andreas ; et al.	2022-06-23
Ultrasonic Tool And Ultrasonic Connection Device Herein App 20220193816 - UNGER; Andreas ; et al.	2022-06-23
Method For Producing An Electrically Conductive Connection App 20220194014 - UNGER; Andreas ; et al.	2022-06-23
Method For Electrically Contacting A Battery Block App 20210194102 - BROEKELMANN; Michael ; et al.	2021-06-24
Bonding Arrangement And Bonding Tool App 20210178515 - UNGER; Andreas ; et al.	2021-06-17
Device for establishing a bonding connection and transducer therefor Grant 11,007,601 - Hunstig , et al. May 18, 2	2021-05-18
Operating method for an ultrasonic wire bonder with active and passive vibration damping Grant 10,960,488 - Hunstig , et al. March 30, 2	2021-03-30
Bonding Tool And Method For Producing A Bonding Tool App 20200282488 - HESSE; Hans-Juergen ; et al.	2020-09-10
Operating Method For An Ultrasonic Wire Bonder With Active And Passive Vibration Damping App 20180369952 - Hunstig; Matthias ; et al.	2018-12-27
Device For Establishing A Bonding Connection And Transducer Therefor App 20170129046 - Hunstig; Matthias ; et al.	2017-05-11

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