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Patent applications and USPTO patent grants for Hunrath; Christopher A.The latest application filed is for "structures for z-axis interconnection of multilayer electronic substrates".
Patent | Date |
---|---|
Structures for z-axis interconnection of multilayer electronic substrates Grant 9,545,017 - Hunrath , et al. January 10, 2 | 2017-01-10 |
Structures For Z-axis Interconnection Of Multilayer Electronic Substrates App 20140231126 - Hunrath; Christopher A ;   et al. | 2014-08-21 |
Flexible Benzoxazine Resin App 20130317155 - Hunrath; Christopher A. ;   et al. | 2013-11-28 |
Multiple Layer Z-axis Interconnect Apparatus And Method Of Use App 20130062099 - Hunrath; Christopher A. | 2013-03-14 |
Insulating Layer For Rigid Printed Circuit Boards App 20120227258 - Hunrath; Christopher A. | 2012-09-13 |
Adhesive Film Layer For Printed Circuit Board Applications App 20120141753 - Hunrath; Christopher A. | 2012-06-07 |
Insulating layer for rigid printed circuit boards Grant 8,188,373 - Hunrath May 29, 2 | 2012-05-29 |
Insulating Layer For Rigid Printed Circuit Boards App 20090151989 - Hunrath; Christopher A. | 2009-06-18 |
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