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Hung; Wei-Chou Patent Filings

Hung; Wei-Chou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Wei-Chou.The latest application filed is for "wire bonding package".

Company Profile
0.3.3
  • Hung; Wei-Chou - Taipei Hsien TW
  • Hung; Wei-Chou - Taipei TW
  • Hung, Wei-Chou - Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Data slicer capable of automatically removing current mismatch between current pumps incorporated therein and its operating method
Grant 7,065,026 - Hung , et al. June 20, 2
2006-06-20
Wire bonding package
Grant 7,064,421 - Chiu , et al. June 20, 2
2006-06-20
Wire Bonding Package
App 20050133911 - Chiu, Yu-Ling ;   et al.
2005-06-23
Data Slicer Capable Of Automatically Removing Current Mismatch Between Current Pumps Incorporated Therein And Its Operating Method
App 20040141450 - Hung, Wei-Chou ;   et al.
2004-07-22
Long seek control system and method in an optical storage device
Grant 6,606,282 - Hung , et al. August 12, 2
2003-08-12
Long seek control system and method in an optical storage device
App 20020196715 - Hung, Wei-Chou ;   et al.
2002-12-26

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