Hung; Tzung-Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hung; Tzung-Yu.The latest application filed is for "method of removing material layer and remnant metal".
- Hung; Tzung-Yu - Tainan Hsien TW
- Hung; Tzung-Yu - Tainan County TW
- Hung; Tzung-Yu - Sinshih Township Tainan County TW
| Patent | Date |
|---|---|
| Method of removing material layer and remnant metal Grant 7,884,028 - Chen , et al. February 8, 2 | 2011-02-08 |
| Method for fabricating semiconductor MOS device Grant 7,785,972 - Chang , et al. August 31, 2 | 2010-08-31 |
| Semiconductor device Grant 7,649,263 - Chang , et al. January 19, 2 | 2010-01-19 |
| Fabrication method of semiconductor device Grant 7,595,264 - Chang , et al. September 29, 2 | 2009-09-29 |
| Method of fabricating nickel silicide Grant 7,572,722 - Chen , et al. August 11, 2 | 2009-08-11 |
| Method for forming metal silicide layer Grant 7,553,762 - Hung , et al. June 30, 2 | 2009-06-30 |
| Semiconductor device Grant 7,482,668 - Hsieh , et al. January 27, 2 | 2009-01-27 |
| Method Of Removing Material Layer And Remnant Metal App 20080254640 - Chen; Yi-Wei ; et al. | 2008-10-16 |
| Silicidation Process For Mos Transistor And Transistor Structure App 20080224232 - Hsieh; Chao-Ching ; et al. | 2008-09-18 |
| Method For Forming Metal Silicide Layer App 20080194100 - Hung; Tzung-Yu ; et al. | 2008-08-14 |
| Method For Cleaning Salicide App 20080171449 - Hsieh; Chao-Ching ; et al. | 2008-07-17 |
| Method of fabricating a semiconductor device Grant 7,390,729 - Hsieh , et al. June 24, 2 | 2008-06-24 |
| Method of forming a silicide Grant 7,390,754 - Chang , et al. June 24, 2 | 2008-06-24 |
| Semiconductor device having nickel silicide and method of fabricating nickel silicide Grant 7,385,294 - Chen , et al. June 10, 2 | 2008-06-10 |
| Fabrication Method Of Semiconductor Device App 20080132063 - Chang; Yu-Lan ; et al. | 2008-06-05 |
| Semiconductor Device App 20080073727 - Hsieh; Chao-Ching ; et al. | 2008-03-27 |
| Method Of Fabricating A Semiconductor Device App 20080076213 - Hsieh; Chao-Ching ; et al. | 2008-03-27 |
| Semiconductor Device App 20080067684 - Chang; Yu-Lan ; et al. | 2008-03-20 |
| Fabrication method of semiconductor device Grant 7,344,978 - Chang , et al. March 18, 2 | 2008-03-18 |
| Method For Fabricating Semiconductor Mos Device App 20080038887 - Chang; Yu-Lan ; et al. | 2008-02-14 |
| Method Of Stripping Remnant Metal App 20080020587 - Chang; Chun-Chieh ; et al. | 2008-01-24 |
| Method Of Fabricating Nickel Silicide App 20070167009 - Chen; Yi-Wei ; et al. | 2007-07-19 |
| Method of fabricating metal silicide layer Grant 7,229,920 - Chen , et al. June 12, 2 | 2007-06-12 |
| Pre-treatment method for physical vapor deposition of metal layer and method of forming metal silicide layer App 20070087573 - Chiang; Yi-Yiing ; et al. | 2007-04-19 |
| Method For Forming Silicide Layer App 20070082494 - Chen; Yi-Wei ; et al. | 2007-04-12 |
| Salicide process App 20070059878 - Chang; Yu-Lan ; et al. | 2007-03-15 |
| Semiconductor Device Having Nickel Silicide And Method Of Fabricating Nickel Silicide App 20070054481 - Chen; Yi-Wei ; et al. | 2007-03-08 |
| Method Of Manufacturing Metal Plug And Contact App 20070032077 - Hung; Tzung-Yu ; et al. | 2007-02-08 |
| Method Of Forming A Nickel Platinum Silicide App 20070020925 - Hsieh; Chao-Ching ; et al. | 2007-01-25 |
| Semiconductor Device And Fabrication Method Thereof App 20060284263 - Chang; Yu-Lan ; et al. | 2006-12-21 |
| Method of fabricating metal silicide layer App 20060154474 - Chen; Yi-Wei ; et al. | 2006-07-13 |
| Method of fabricating a dual damascene copper wire Grant 6,849,541 - Hu , et al. February 1, 2 | 2005-02-01 |
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