Hung; Tsung-Tai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Tsung-Tai.The latest application filed is for "composition and solution for temporary bonding".

Company Profile

3.3.9

Hung; Tsung-Tai - Kaohsiung TW
HUNG; Tsung-Tai - KAOHSIUNG CITY TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition and solution for temporary bonding Grant 10,633,569 - Chang , et al.	2020-04-28
Composition And Solution For Temporary Bonding App 20190292429 - Chang; Hsiu-Ming ; et al.	2019-09-26
Polyimide Precursor And Lithography Pattern Formed By The Same App 20190163061 - CHEN; Chi-Shian ; et al.	2019-05-30
Method Of Transferring Micro Device App 20190103274 - Chang; Hsiu-Ming ; et al.	2019-04-04
Polyimide polymer, polyimide film, and flexible copper-coated laminate Grant 9,955,572 - Fang , et al. April 24, 2	2018-04-24
Adhesive Composition And Laminated Film App 20180086952 - Teng; I-Ling ; et al.	2018-03-29
Polyimide And Polyimide Film App 20170152348 - Fang; Yi-Kai ; et al.	2017-06-01
Polyimide Polymer, Polyimide Film, And Flexible Copper-coated Laminate App 20170034910 - Fang; Yi-Kai ; et al.	2017-02-02
Polyimide polymer, polyimide film, and flexible copper-coated laminate Grant 9,505,887 - Fang , et al. November 29, 2	2016-11-29
Polyimide Polymer, Polyimide Film, And Flexible Copper-coated Laminate App 20160115277 - Fang; Yi-Kai ; et al.	2016-04-28
Insulation Film Of A Signal Transmission Line And Signal Transmission Line Comprising The Same App 20160088728 - Wang; Fu-Min ; et al.	2016-03-24
Thermally Conductive Encapsulate And Solar Cell Module Comprising The Same App 20150194553 - WANG; FU-MIN ; et al.	2015-07-09

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