loadpatents
name:-0.033721923828125
name:-0.026987075805664
name:-0.011291027069092
Hung; Shih-Ting Patent Filings

Hung; Shih-Ting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Shih-Ting.The latest application filed is for "adjustable multi-angle grip for firearms".

Company Profile
11.27.28
  • Hung; Shih-Ting - New Taipei TW
  • Hung; Shih-Ting - Sanchong TW
  • Hung; Shih-Ting - Taoyuan City TW
  • Hung; Shih-Ting - New Taipei City TW
  • Hung; Shih-Ting - Taoyuan TW
  • Hung; Shih-Ting - Sanchong City TW
  • Hung; Shih-Ting - Taipei County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Structure and formation method of package structure with fan-out structure
Grant 11,430,739 - Tsai , et al. August 30, 2
2022-08-30
Semiconductor devices and methods of manufacturing
Grant 11,430,776 - Wu , et al. August 30, 2
2022-08-30
Adjustable Multi-Angle Grip For Firearms
App 20220244013 - Lee; Shanyao ;   et al.
2022-08-04
Package Structure And Method Of Fabricating The Same
App 20220238456 - Wu; Yi-Wen ;   et al.
2022-07-28
Package structure and method of fabricating the same
Grant 11,302,650 - Wu , et al. April 12, 2
2022-04-12
Bipod Grip For Firearms
App 20220107155 - Lee; Shanyao ;   et al.
2022-04-07
Multi-Function Touch-Free Tool
App 20220072693 - Lee; Shanyao ;   et al.
2022-03-10
Modular magazine release for firearms
Grant 11,248,867 - Lee , et al. February 15, 2
2022-02-15
Modular Magazine Release For Firearms
App 20220011064 - Lee; Shanyao ;   et al.
2022-01-13
Semiconductor Devices And Methods Of Manufacturing
App 20210391317 - Wu; Yi-Wen ;   et al.
2021-12-16
Semiconductor Package With Improved Interposer Structure
App 20210375755 - Wu; Yi-Wen ;   et al.
2021-12-02
Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof
App 20210358824 - Jeng; Shin-Puu ;   et al.
2021-11-18
Modular bolt catch for firearms
Grant 11,175,108 - Lee , et al. November 16, 2
2021-11-16
Dual-finger operable safety selector for firearms
Grant 11,175,109 - Lee , et al. November 16, 2
2021-11-16
Adjustable multi-angle grip for firearms
Grant 11,162,758 - Lee , et al. November 2, 2
2021-11-02
Fan-out packages and methods of forming the same
Grant 11,164,754 - Tsai , et al. November 2, 2
2021-11-02
Chip package structure and method for forming the same
Grant 11,114,311 - Tsai , et al. September 7, 2
2021-09-07
Semiconductor package with improved interposer structure
Grant 11,094,625 - Wu , et al. August 17, 2
2021-08-17
Semiconductor Package And Method Of Manufacturing The Same
App 20210242117 - Hung; Shih-Ting ;   et al.
2021-08-05
Integrated fan-out package, package-on-package structure, and manufacturing method thereof
Grant 11,075,132 - Jeng , et al. July 27, 2
2021-07-27
Package Structure And Method Of Fabricating The Same
App 20210225776 - Wu; Yi-Wen ;   et al.
2021-07-22
Integrated fan-out packages
Grant 10,879,162 - Jeng , et al. December 29, 2
2020-12-29
Semiconductor Package With Improved Interposer Structure
App 20200211956 - WU; Yi-Wen ;   et al.
2020-07-02
Structure And Formation Method Of Package Structure With Fan-out Structure
App 20200135653 - TSAI; Po-Hao ;   et al.
2020-04-30
Fan-Out Packages And Methods Of Forming The Same
App 20200105544 - Tsai; Po-Hao ;   et al.
2020-04-02
Chip Package Structure And Method For Forming The Same
App 20200075350 - TSAI; Po-Hao ;   et al.
2020-03-05
Integrated Fan-out Packages And Methods Of Forming The Same
App 20200013707 - Jeng; Shin-Puu ;   et al.
2020-01-09
Integrated fan-out packages
Grant 10,347,574 - Jeng , et al. July 9, 2
2019-07-09
Integrated Fan-out Packages And Methods Of Forming The Same
App 20190096791 - Jeng; Shin-Puu ;   et al.
2019-03-28
Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof
App 20190067144 - Jeng; Shin-Puu ;   et al.
2019-02-28
Silicon recess etch and epitaxial deposit for shallow trench isolation (STI)
Grant 9,911,805 - Chuang , et al. March 6, 2
2018-03-06
Channel epitaxial regrowth flow (CRF)
Grant 9,831,322 - Fu , et al. November 28, 2
2017-11-28
Dielectric punch-through stoppers for forming FinFETs having dual Fin heights
Grant 9,735,042 - Hung , et al. August 15, 2
2017-08-15
Silicon Recess Etch And Epitaxial Deposit For Shallow Trench Isolation (sti)
App 20170062559 - Chuang; Harry-Hak-Lay ;   et al.
2017-03-02
Method of cutting metal gate
Grant 9,520,482 - Chang , et al. December 13, 2
2016-12-13
Silicon recess etch and epitaxial deposit for shallow trench isolation (STI)
Grant 9,502,533 - Chuang , et al. November 22, 2
2016-11-22
Channel Epitaxial Regrowth Flow (CRF)
App 20160300931 - Fu; Ching-Feng ;   et al.
2016-10-13
Channel epitaxial regrowth flow (CRF)
Grant 9,391,203 - Fu , et al. July 12, 2
2016-07-12
Silicon Recess Etch And Epitaxial Deposit For Shallow Trench Isolation (sti)
App 20150364575 - Chuang; Harry-Hak-Lay ;   et al.
2015-12-17
Dielectric Punch-Through Stoppers for Forming FinFETs Having Dual Fin Heights
App 20150262861 - Hung; Shih-Ting ;   et al.
2015-09-17
Silicon recess ETCH and epitaxial deposit for shallow trench isolation (STI)
Grant 9,129,823 - Chuang , et al. September 8, 2
2015-09-08
Dielectric punch-through stoppers for forming FinFETs having dual fin heights
Grant 9,048,259 - Hung , et al. June 2, 2
2015-06-02
Channel Epitaxial Regrowth Flow (CRF)
App 20150097242 - Fu; Ching-Feng ;   et al.
2015-04-09
Germanium FinFETs having dielectric punch-through stoppers
Grant 8,957,477 - Chang , et al. February 17, 2
2015-02-17
Channel epitaxial regrowth flow (CRF)
Grant 8,927,352 - Fu , et al. January 6, 2
2015-01-06
Silicon Recess Etch And Epitaxial Deposit For Shallow Trench Isolation (sti)
App 20140264725 - Chuang; Harry-Hak-Lay ;   et al.
2014-09-18
Channel Epitaxial Regrowth Flow (CRF)
App 20140252488 - Fu; Ching-Feng ;   et al.
2014-09-11
Dielectric Punch-Through Stoppers for Forming FinFETs Having Dual Fin Heights
App 20120299110 - Hung; Shih-Ting ;   et al.
2012-11-29
Dielectric punch-through stoppers for forming FinFETs having dual fin heights
Grant 8,263,462 - Hung , et al. September 11, 2
2012-09-11
Germanium FinFETs Having Dielectric Punch-Through Stoppers
App 20120025313 - Chang; Cheng-Hung ;   et al.
2012-02-02
Germanium FinFETs having dielectric punch-through stoppers
Grant 8,048,723 - Chang , et al. November 1, 2
2011-11-01
Dielectric Punch-Through Stoppers for Forming FinFETs Having Dual Fin Heights
App 20100163971 - Hung; Shih-Ting ;   et al.
2010-07-01
Germanium FinFETs Having Dielectric Punch-Through Stoppers
App 20100144121 - Chang; Cheng-Hung ;   et al.
2010-06-10

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