Hung; Liang-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Liang-Yi.The latest application filed is for "short interfering rna for treating cancer".

Company Profile

2.11.19

Hung; Liang-Yi - Tainan TW
Hung; Liang-Yi - Taichung TW
HUNG; Liang-Yi - Tainan City TW
Hung; Liang-Yi - Taichung Hsien TW
Hung; Liang-Yi - Kaohsiung TW
Hung, Liang-Yi - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Short interfering RNA for treating cancer Grant 10,174,322 - Hung , et al. J	2019-01-08
Method of fabricating a packaging substrate including a carrier having two carrying portions Grant 10,096,491 - Pai , et al. October 9, 2	2018-10-09
Short Interfering Rna For Treating Cancer App 20180037888 - HUNG; Liang-Yi ; et al.	2018-02-08
Electronic device having a thermal conductor made of silver between a heat sink and an electronic element, and fabrication method thereof Grant 9,607,923 - Hung , et al. March 28, 2	2017-03-28
Package structure and fabrication method thereof Grant 9,542,598 - Teng , et al. January 10, 2	2017-01-10
Electronic device and fabrication method thereof App 20160329261 - Hung; Chung-Jen ; et al.	2016-11-10
Package Structure And Fabrication Method Thereof App 20160172264 - Teng; Wen-Yu ; et al.	2016-06-16
Method Of Fabricating A Packaging Substrate App 20150303073 - Pai; Yu-Cheng ; et al.	2015-10-22
Fabrication method of semiconductor package Grant 9,112,063 - Hsiao , et al. August 18, 2	2015-08-18
Flip-chip Packaging Structure App 20150179598 - Chiu; Shih-Chao ; et al.	2015-06-25
Package Structure And Fabrication Method Thereof App 20150102484 - Chen; Chia-Cheng ; et al.	2015-04-16
Substrate Structure And Semiconductor Package Having The Same App 20150028485 - Hung; Liang-Yi ; et al.	2015-01-29
Fabrication Method Of Semiconductor Package App 20140308780 - Hsiao; Wei Chung ; et al.	2014-10-16
Semiconductor package and fabrication method thereof Grant 8,796,867 - Hsiao , et al. August 5, 2	2014-08-05
Method Of Fabricating A Packaging Substrate App 20140057410 - Pai; Yu-Cheng ; et al.	2014-02-27
Semiconductor Package And Fabrication Method Thereof App 20130307152 - Hsiao; Wei Chung ; et al.	2013-11-21
Substrate Structure And Fabrication Method Thereof App 20130228921 - Hung; Liang-Yi ; et al.	2013-09-05
Semiconductor package and fabrication method thereof Grant 8,471,383 - Hung , et al. June 25, 2	2013-06-25
Semiconductor Package And Method Of Fabricating The Same App 20130026657 - Hsiao; Wei-Chung ; et al.	2013-01-31
Semiconductor Package And Fabrication Method Thereof App 20120326305 - Hung; Liang-Yi ; et al.	2012-12-27
Methods and compositions for destabilizing microtubules Grant 7,449,563 - Tang , et al. November 11, 2	2008-11-11
Heat dissipating semiconductor package App 20080164604 - Hung; Liang-Yi ; et al.	2008-07-10
Heat dissipating chip structure and fabrication method thereof and package having the same App 20080150128 - Hung; Liang-Yi ; et al.	2008-06-26
Methods and compositions for destabilizing microtubules App 20050089921 - Tang, Tang K. ; et al.	2005-04-28
Methods and compositions for destabilizing microtubules Grant 6,864,238 - Tang , et al. March 8, 2	2005-03-08

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