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name:-0.0024688243865967
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Hung; Jeng-Nan Patent Filings

Hung; Jeng-Nan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Jeng-Nan.The latest application filed is for "semiconductor structure".

Company Profile
7.6.11
  • Hung; Jeng-Nan - Taichung City TW
  • Hung; Jeng-Nan - Taichung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Structure
App 20220302068 - Yu; Chen-Hua ;   et al.
2022-09-22
Package Structure And Manufacturing Method Thereof
App 20220262703 - Yu; Chen-Hua ;   et al.
2022-08-18
Semiconductor Device
App 20220238408 - Yu; Chen-Hua ;   et al.
2022-07-28
Semiconductor structure comprising at least one system-on-integrated-circuit component
Grant 11,380,645 - Yu , et al. July 5, 2
2022-07-05
Package structure and manufacturing method thereof
Grant 11,355,418 - Yu , et al. June 7, 2
2022-06-07
Semiconductor device
Grant 11,328,975 - Yu , et al. May 10, 2
2022-05-10
Semiconductor Device
App 20210407887 - Yu; Chen-Hua ;   et al.
2021-12-30
Semiconductor device and manufacturing method thereof
Grant 11,139,223 - Yu , et al. October 5, 2
2021-10-05
Semiconductor Package Structure
App 20210217728 - HUNG; JENG-NAN ;   et al.
2021-07-15
Semiconductor Device
App 20210159139 - Yu; Chen-Hua ;   et al.
2021-05-27
Semiconductor Structure
App 20210159201 - Yu; Chen-Hua ;   et al.
2021-05-27
Semiconductor package structure
Grant 10,971,475 - Hung , et al. April 6, 2
2021-04-06
Package Structure And Manufacturing Method Thereof
App 20210098335 - Yu; Chen-Hua ;   et al.
2021-04-01
Semiconductor Device And Manufacturing Method Thereof
App 20200176357 - Yu; Chen-Hua ;   et al.
2020-06-04
Semiconductor Package Structure
App 20190363066 - HUNG; JENG-NAN ;   et al.
2019-11-28
Semiconductor package structure and method of manufacturing the same
Grant 10,373,931 - Hung , et al.
2019-08-06
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20180151538 - HUNG; JENG-NAN ;   et al.
2018-05-31

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