Hung; Chin-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hung; Chin-Yuan.The latest application filed is for "multi-chip semiconductor package".
- Hung; Chin-Yuan - Taichung Hsien TW
- Hung; Chin-Yuan - Taichung TW
- Hung; Chin Yuan - Fengyuan TW
| Patent | Date |
|---|---|
| Package structure having tapering support bars and leads Grant 6,696,749 - Hung , et al. February 24, 2 | 2004-02-24 |
| Multi-chip semiconductor package Grant 6,680,531 - Hsu , et al. January 20, 2 | 2004-01-20 |
| Multi-chip semiconductor package App 20030047754 - Hsu, Chin-Teng ; et al. | 2003-03-13 |
| Semiconductor package Grant 6,509,636 - Tsai , et al. January 21, 2 | 2003-01-21 |
| Multi-chip semiconductor package Grant 6,495,908 - Yang , et al. December 17, 2 | 2002-12-17 |
| Quad flat non-leaded package structure for housing CMOS sensor Grant 6,476,469 - Hung , et al. November 5, 2 | 2002-11-05 |
| Dual-die package structure and method for fabricating the same Grant 6,476,474 - Hung November 5, 2 | 2002-11-05 |
| Multi-chip Semiconductor Package App 20020149103 - Yang, Cheng-Hsung ; et al. | 2002-10-17 |
| Dual-sided chip package without a die pad Grant 6,437,447 - Huang , et al. August 20, 2 | 2002-08-20 |
| Package of an image sensor device App 20020060358 - Hung, Chin-Yuan ; et al. | 2002-05-23 |
| Quad flat non-leaded package structure for housing CMOS sensor App 20020060357 - Hung, Chin-Yuan ; et al. | 2002-05-23 |
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