HUNG; Chin-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUNG; Chin-Hsien.The latest application filed is for "method and composition for treating pain".

Company Profile

10.11.12

HUNG; Chin-Hsien - Kaohsiung City TW
Hung; Chin-Hsien - Chupei TW
HUNG; Chin-Hsien - Chupei City TW
Hung; Chin-Hsien - Taichung County N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And Composition For Treating Pain App 20220288075 - Chen; Chin-Cheng ; et al.	2022-09-15
Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same Grant 11,345,813 - Liu , et al. May 31, 2	2022-05-31
Flexible prepreg and uses thereof Grant 11,312,829 - Liu , et al. April 26, 2	2022-04-26
Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same Grant 11,124,614 - Liu , et al. September 21, 2	2021-09-21
Resin composition and uses of the same Grant 11,124,613 - Liu , et al. September 21, 2	2021-09-21
Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same Grant 11,015,052 - Liu , et al. May 25, 2	2021-05-25
Resin Composition And Uses Of The Same App 20200377676 - LIU; Shur-Fen ; et al.	2020-12-03
Solvent-free resin composition and uses of the same Grant 10,836,919 - Liu , et al. November 17, 2	2020-11-17
Flexible Prepreg And Uses Thereof App 20200216626 - LIU; Shur-Fen ; et al.	2020-07-09
Halogen-free Low Dielectric Resin Composition, And Prepreg, Metal-clad Laminate, And Printed Circuit Board Prepared Using The Sa App 20200181402 - LIU; SHUR-FEN ; et al.	2020-06-11
Adhesive composition and uses of the same Grant 10,662,352 - Liu , et al.	2020-05-26
Solvent-free Resin Composition And Uses Of The Same App 20200115572 - LIU; Shur-Fen ; et al.	2020-04-16
Halogen-free Low Dielectric Resin Composition, And Pre-preg, Metal-clad Laminate, And Printed Circuit Board Using The Same App 20200071477 - LIU; Shur-Fen ; et al.	2020-03-05
Dielectric composite and uses thereof Grant 10,575,401 - Liu , et al. Feb	2020-02-25
Dielectric Composite And Uses Thereof App 20200053877 - LIU; Shur-Fen ; et al.	2020-02-13
Resin Composition, Pre-preg, Metal-clad Laminate, And Printed Circuit Board Using The Same App 20190367727 - LIU; Shur-Fen ; et al.	2019-12-05
Adhesive Composition And Uses Of The Same App 20190194505 - LIU; Shur-fen ; et al.	2019-06-27
Solvent-free resin composition and uses of the same Grant 10,246,588 - Liu , et al.	2019-04-02
Solvent-free Resin Composition And Uses Of The Same App 20190085166 - Liu; Shur-Fen ; et al.	2019-03-21
Capacitor structure Grant 8,488,299 - Wu , et al. July 16, 2	2013-07-16
Capacitor Structure App 20110019335 - WU; Shih-Hsien ; et al.	2011-01-27
Curable High Dielectric Constant Ink Composition and High Dielectric Film App 20090227719 - Hung; Chin-Hsien ; et al.	2009-09-10

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