HUNG; Chih-Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUNG; Chih-Pin.The latest application filed is for "assembly structure and method for manufacturing the same".

Company Profile

21.48.65

HUNG; Chih-Pin - Kaohsiung TW
HUNG; CHIH-PIN - TAINAN CITY TW
Hung; Chih-Pin - Koahsiung TW
Hung; Chih-Pin - Kaohsiung City TW
Hung; Chih-Pin - Kaoshiung TW
Hung; Chih-Pin - Kao-Hsiung TW
Hung; Chih-Pin - Kao-Hsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Assembly Structure And Method For Manufacturing The Same App 20220310500 - CHANG; Yung-Shun ; et al.	2022-09-29
Semiconductor Device Package And Method Of Manufacturing The Same App 20220200130 - Ho; Cheng-Yu ; et al.	2022-06-23
Electronic Device Package And Method For Manufacturing The Same App 20220084972 - LU; Mei-Ju ; et al.	2022-03-17
Package Structure And Method For Manufacturing The Same App 20220068839 - KE; Po-Hsien ; et al.	2022-03-03
Electroless Semiconductor Bonding Structure, Electroless Plating System And Electroless Plating Method Of The Same App 20220056589 - CHIANG; Chun-Wei ; et al.	2022-02-24
Wiring structure Grant 11,227,823 - Chen , et al. January 18, 2	2022-01-18
Semiconductor device packages and methods of manufacturing the same Grant 11,217,502 - Hu , et al. January 4, 2	2022-01-04
Electronic device package and method for manufacturing the same Grant 11,183,474 - Lu , et al. November 23, 2	2021-11-23
Wiring Structure App 20210327796 - CHEN; Tang-Yuan ; et al.	2021-10-21
Electronic device comprising heat pipe contacting a cover structure for heat dissipation Grant 11,139,222 - Tsai , et al. October 5, 2	2021-10-05
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210288024 - CHEN; Tang-Yuan ; et al.	2021-09-16
Substrate structure and semiconductor package structure Grant 11,081,420 - Chen , et al. August 3, 2	2021-08-03
Semiconductor package Grant 11,075,186 - Hu , et al. July 27, 2	2021-07-27
Semiconductor device packages and methods of manufacturing the same Grant 11,011,496 - Chen , et al. May 18, 2	2021-05-18
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210134696 - HU; Ian ; et al.	2021-05-06
Electronic Device Package And Method For Manufacturing The Same App 20210134751 - LU; Mei-Ju ; et al.	2021-05-06
Semiconductor device package and method for manufacturing the same Grant 10,985,085 - Hu , et al. April 20, 2	2021-04-20
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210074676 - CHEN; Tang-Yuan ; et al.	2021-03-11
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,916,429 - Hunt , et al. February 9, 2	2021-02-09
Substrate Structure And Semiconductor Package Structure App 20210013118 - Chen; Hsin-En ; et al.	2021-01-14
Stacked semiconductor package assemblies including double sided redistribution layers Grant 10,886,263 - Chen , et al. January 5, 2	2021-01-05
Semiconductor packages Grant 10,872,861 - Chiu , et al. December 22, 2	2020-12-22
Semiconductor Device Package And Method For Manufacturing The Same App 20200381338 - CHEN; Tang-Yuan ; et al.	2020-12-03
Semiconductor Device Package And Method For Manufacturing The Same App 20200365485 - HU; Ian ; et al.	2020-11-19
Semiconductor device package Grant 10,770,369 - Hung , et al. Sep	2020-09-08
Semiconductor devices and semiconductor packages Grant 10,658,319 - Hung , et al.	2020-05-19
Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process Grant 10,658,257 - Chen , et al.	2020-05-19
Semiconductor Package Structure, Semiconductor Wafer Level Package And Semiconductor Manufacturing Process App 20200144143 - CHEN; Dao-Long ; et al.	2020-05-07
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20200111671 - HUNT; John Richard ; et al.	2020-04-09
Power and ground design for through-silicon via structure Grant 10,600,759 - Hung , et al.	2020-03-24
Electronic Device App 20200083143 - TSAI; Jung-Che ; et al.	2020-03-12
Semiconductor Device Package App 20200066612 - HUNG; Chih-Pin ; et al.	2020-02-27
Substrate and semiconductor device package Grant 10,553,527 - Chen , et al. Fe	2020-02-04
Semiconductor package device and method of manufacturing the same Grant 10,541,198 - Chang Chien , et al. Ja	2020-01-21
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,535,521 - Hunt , et al. Ja	2020-01-14
Semiconductor device package and a method of manufacturing the same Grant 10,522,508 - Hu , et al. Dec	2019-12-31
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,515,806 - Hunt , et al. Dec	2019-12-24
Semiconductor Device Package And A Method Of Manufacturing The Same App 20190341368 - HU; Ian ; et al.	2019-11-07
Semiconductor Packages App 20190244909 - CHIU; Yong-Da ; et al.	2019-08-08
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20190206683 - HUNT; John Richard ; et al.	2019-07-04
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20190206684 - HUNT; John Richard ; et al.	2019-07-04
Semiconductor Devices And Semiconductor Packages App 20190148326 - HUNG; Chih-Pin ; et al.	2019-05-16
Polylactic Acid Resin Composition And Application Thereof App 20190127573 - SU; Chean-Cheng ; et al.	2019-05-02
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,276,382 - Hunt , et al.	2019-04-30
Stacked Semiconductor Package Assemblies Including Double Sided Redistribution Layers App 20190103386 - CHEN; William T. ; et al.	2019-04-04
Semiconductor package structure and method of manufacturing the same Grant 10,236,208 - Kuo , et al.	2019-03-19
Substrate And Semiconductor Device Package App 20190080993 - CHEN; Dao-Long ; et al.	2019-03-14
Semiconductor device package having an underfill barrier Grant 10,217,649 - Lai , et al. Feb	2019-02-26
Semiconductor devices and semiconductor packages Grant 10,181,448 - Hung , et al. Ja	2019-01-15
Semiconductor Device Package Having An Underfill Barrier App 20180358238 - LAI; Jin-Yuan ; et al.	2018-12-13
Semiconductor Package App 20180226320 - HU; Ian ; et al.	2018-08-09
Semiconductor devices Grant 10,014,250 - Hsieh , et al. July 3, 2	2018-07-03
Semiconductor Package Device And Method Of Manufacturing The Same App 20180158766 - CHANG CHIEN; Chien Lin ; et al.	2018-06-07
Semiconductor package device and method of manufacturing the same Grant 9,917,043 - Chang Chien , et al. March 13, 2	2018-03-13
Semiconductor packages Grant 9,917,071 - Chiu , et al. March 13, 2	2018-03-13
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20180047571 - HUNT; John Richard ; et al.	2018-02-15
Semiconductor Package Structure And Method Of Manufacturing The Same App 20170365515 - KUO; Chin-Cheng ; et al.	2017-12-21
Semiconductor Devices And Semiconductor Packages App 20170278814 - HUNG; Chih-Pin ; et al.	2017-09-28
Semiconductor Devices App 20170229393 - HSIEH; Sheng-Chi ; et al.	2017-08-10
Semiconductor Package Device And Method Of Manufacturing The Same App 20170207153 - CHANG CHIEN; Chien Lin ; et al.	2017-07-20
Power And Ground Design For Through-silicon Via Structure App 20170200702 - HUNG; Chih-Pin ; et al.	2017-07-13
Semiconductor device packages with electromagnetic interference shielding Grant 8,653,633 - Liao , et al. February 18, 2	2014-02-18
Data Processing Module Of Digital Audio Processing Device, Digital Audio Processing Controller Module Of Portable Device, And Control System App 20130150991 - LIU; SHEN-CHI ; et al.	2013-06-13
Semiconductor device packages with electromagnetic interference shielding Grant 8,350,367 - Chiu , et al. January 8, 2	2013-01-08
Semiconductor device packages with electromagnetic interference shielding Grant 8,212,339 - Liao , et al. July 3, 2	2012-07-03
Semiconductor Device Packages With Electromagnetic Interference Shielding App 20110260301 - Liao; Kuo-Hsien ; et al.	2011-10-27
Semiconductor device packages with electromagnetic interference shielding Grant 8,022,511 - Chiu , et al. September 20, 2	2011-09-20
Carrier with embedded component and method for fabricating the same Grant 8,000,107 - Wang , et al. August 16, 2	2011-08-16
Semiconductor device packages with electromagnetic interference shielding Grant 7,989,928 - Liao , et al. August 2, 2	2011-08-02
Package structure for connection with output/input module Grant 7,944,707 - Hung , et al. May 17, 2	2011-05-17
Stacked Lc Resonator And Bandpass Filter Of Using The Same App 20100265009 - Horng; Tzyy-Sheng ; et al.	2010-10-21
Semiconductor Device Packages With Electromagnetic Interference Shielding App 20100207259 - Liao; Kuo-Hsien ; et al.	2010-08-19
Semiconductor Device Packages With Electromagnetic Interference Shielding App 20090256244 - Liao; Kuo-Hsien ; et al.	2009-10-15
Electronic package Grant 7,586,184 - Hung , et al. September 8, 2	2009-09-08
Structure of wafer level package with area bump Grant 7,576,436 - Hung August 18, 2	2009-08-18
Semiconductor Device Packages With Electromagnetic Interference Shielding App 20090194851 - Chiu; Chi-Tsung ; et al.	2009-08-06
Semiconductor Device Packages With Electromagnetic Interference Shielding App 20090194852 - Chiu; Chi-Tsung ; et al.	2009-08-06
Carrier with embedded component and method for fabricating the same App 20080273313 - Wang; Yung-Hui ; et al.	2008-11-06
Package Structure For Connection With Output/input Module App 20080218981 - Hung; Chih-pin ; et al.	2008-09-11
Package Structure With Embedded Capacitor, Fabricating Process Thereof And Applications Of The Same App 20080180878 - Wang; Yung-Hui ; et al.	2008-07-31
Substrate With Embedded Passive Element And Methods For Manufacturing The Same App 20080164562 - Wang; Yung-Hui ; et al.	2008-07-10
Electronic Package App 20080145589 - Hung; Chih Pin ; et al.	2008-06-19
Stacked Chip Package Structure And Fabricating Method Thereof App 20080122059 - Chou; Che-Ya ; et al.	2008-05-29
Chip Package Structure And Heat Sink For Chip Package App 20080054450 - Chiu; Chi-Tsung ; et al.	2008-03-06
Structure Of Wafer Level Package With Area Bump App 20080054460 - Hung; Chih-Pin	2008-03-06
Bridge connection type of chip package and fabricating method thereof Grant 7,312,102 - Hung December 25, 2	2007-12-25
Lead frame package structure with high density of lead pins arrangement Grant 7,256,480 - Hung , et al. August 14, 2	2007-08-14
Inductor and capacitor formed of build-up vias Grant 7,248,134 - Wu , et al. July 24, 2	2007-07-24
Lead Frame Package Structure With High Density Of Lead Pins Arrangement App 20070080431 - Hung; Chih-Pin ; et al.	2007-04-12
Circuit substrate and fabrication method thereof Grant 7,060,595 - Ou , et al. June 13, 2	2006-06-13
Circuit board with reduced simultaneous switching noise App 20060108690 - Wu; Sung-Mao ; et al.	2006-05-25
Inductor and capacitor formed of build-up vias App 20060103483 - Wu; Sung-Mao ; et al.	2006-05-18
Semiconductor package with connector Grant 6,974,334 - Hung December 13, 2	2005-12-13
Flip-chip package substrate with a high-density layout App 20050248037 - Hung, Chih-Pin ; et al.	2005-11-10
Multi-chip package with electrical interconnection Grant 6,927,480 - Lee , et al. August 9, 2	2005-08-09
Structure Of Wafer Level Package With Area Bump App 20050082580 - Hung, Chih-Pin	2005-04-21
Bridge Connection Type Of Chip Package And Fabricating Method Thereof App 20050062171 - Hung, Chih-Pin	2005-03-24
MCM package with bridge connection Grant 6,864,588 - Hung March 8, 2	2005-03-08
Packaging mold with electrostatic discharge protection Grant 6,844,617 - Hung , et al. January 18, 2	2005-01-18
Bridge connection type of chip package and fabricating method thereof Grant 6,833,610 - Hung December 21, 2	2004-12-21
Packaging substrate with electrostatic discharge protection Grant 6,828,664 - Hung , et al. December 7, 2	2004-12-07
Flip chip package structure and flip chip device with area bump Grant 6,825,568 - Hung November 30, 2	2004-11-30
Multi-chip package with electrical interconnection App 20040222503 - Lee, Bau-Nan ; et al.	2004-11-11
MCM package with bridge connection App 20040135250 - Hung, Chih-Pin	2004-07-15
[structure Of Flip Chip Package With Area Bump] App 20040113282 - HUNG, CHIH-PIN	2004-06-17
Semiconductor package with connector App 20040087191 - Hung, Chih-Pin	2004-05-06
Circuit substrate and fabrication method thereof App 20040080052 - Ou, In-De ; et al.	2004-04-29
[bridge Connection Type Of Chip Packageand Fabricating Method Thereof] App 20040065946 - Hung, Chih-Pin	2004-04-08
Packaging mold with electrostatic discharge protection App 20030094680 - Hung, Chih-Pin ; et al.	2003-05-22
Packaging substrate with electrostatic discharge protection App 20030091673 - Hung, Chih-Pin ; et al.	2003-05-15
Integrated circuit pakage substrate integrating with decoupling capacitor App 20020024801 - Hung, Chih-Pin ; et al.	2002-02-28

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