Hung; Chih-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Chih-Cheng.The latest application filed is for "semiconductor device packages and methods of manufacturing the same".

Company Profile

2.8.9

Hung; Chih-Cheng - Marietta GA
HUNG; Chih-Cheng - Kaohsiung TW
Hung; Chih Cheng - Kaohsiung City TW
Hung; Chih-Cheng - Kao-Hsiung City TW
Hung; Chih-Cheng - Kaohsiung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Identification and classification of traffic conflicts Grant 11,380,105 - Yang , et al. July 5, 2	2022-07-05
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210130163 - LIN; Yueh-Ju ; et al.	2021-05-06
Moran's / for impulse noise detection and removal in color images Grant 10,902,563 - Hung January 26, 2	2021-01-26
Identification And Classification Of Traffic Conflicts App 20210004607 - Yang; Jidong J. ; et al.	2021-01-07
Identification and classification of traffic conflicts using live video images Grant 10,713,500 - Yang , et al.	2020-07-14
Moran's I For Impulse Noise Detection And Removal In Color Images App 20200118251 - Hung; Chih-Cheng	2020-04-16
Moran's / for impulse noise detection and removal in color images Grant 10,572,978 - Hung Feb	2020-02-25
Moran's / For Impulse Noise Detection And Removal In Color Images App 20180158176 - HUNG; Chih-Cheng	2018-06-07
Identification And Classification Of Traffic Conflicts Using Live Video Images App 20180089515 - YANG; Jidong J. ; et al.	2018-03-29
Wirebonded semiconductor package Grant 8,357,998 - Huang , et al. January 22, 2	2013-01-22
Semiconductor package and method for processing and bonding a wire Grant 8,053,906 - Chang , et al. November 8, 2	2011-11-08
Semiconductor Package And Method Of Manufacturing The Same App 20100200969 - HUANG; Wen Pin ; et al.	2010-08-12
Semiconductor Package And Method Of Manufacturing The Same App 20100200981 - HUANG; Wen Pin ; et al.	2010-08-12
Semiconductor Package And Method For Processing And Bonding A Wire App 20100007009 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Cavity-down Package and Method for Fabricating the same App 20060091567 - Lin; Yu-Liang ; et al.	2006-05-04
Brake mechanism Grant 6,216,825 - Hung April 17, 2	2001-04-17

Company Registrations

NCAGE Code	48YS2	HUNG CHIH-CHENG
CAGE Code	48YS2	HUNG, CHIH-CHENG

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