loadpatents
Patent applications and USPTO patent grants for Hung; Chia-Yu.The latest application filed is for "touch control device and stylus thereof".
Patent | Date |
---|---|
Touch Control Device And Stylus Thereof App 20220276727 - Lin; Yifan ;   et al. | 2022-09-01 |
Package structure and manufacturing method thereof Grant 11,367,678 - Chang Chien , et al. June 21, 2 | 2022-06-21 |
Package Structure And Manufacturing Method Thereof App 20210202364 - Chang Chien; Shang-Yu ;   et al. | 2021-07-01 |
Molded Interconnecting Substrate And The Method For Manufacturing The Same App 20170117263 - YEH; Yun-Hsin ;   et al. | 2017-04-27 |
Signal processing apparatus Grant 9,161,127 - Hung , et al. October 13, 2 | 2015-10-13 |
Signal processing apparatus having voice activity detection unit and related signal processing methods Grant 8,972,252 - Hung , et al. March 3, 2 | 2015-03-03 |
Method and processing circuit for dealing with galois field computation Grant 8,649,511 - Hung , et al. February 11, 2 | 2014-02-11 |
Signal Processing Apparatus Having Voice Activity Detection Unit And Related Signal Processing Methods App 20140012573 - Hung; Chia-Yu ;   et al. | 2014-01-09 |
Signal Processing Apparatus App 20130034236 - Hung; Chia-Yu ;   et al. | 2013-02-07 |
Method And Processing Circuit For Dealing With Galois Field Computation App 20100322412 - Hung; Chia-Yu ;   et al. | 2010-12-23 |
Flexable Audio Data Transmission Method For Transmitting Encrypted Audio Data, Audio Processing System And Computer System Thereof App 20090254743 - Chiu; Shu-Yeh ;   et al. | 2009-10-08 |
Golf club App 20090233731 - Hsu; Yen-Chi ;   et al. | 2009-09-17 |
Golf Club App 20090137336 - Hsu; Yen-Chi ;   et al. | 2009-05-28 |
Land grid array semiconductor package App 20080272480 - Hung; Chia-Yu ;   et al. | 2008-11-06 |
IC package encapsulating a chip under asymmetric single-side leads Grant 7,408,245 - Hung , et al. August 5, 2 | 2008-08-05 |
Ic Package Encapsulating A Chip Under Asymmetric Single-side Leads App 20080150100 - Hung; Chia-Yu ;   et al. | 2008-06-26 |
Stacking structure of chip package App 20070290332 - Chiu; Tseng Shin ;   et al. | 2007-12-20 |
Photosensitive semiconductor package and method for fabricating the same Grant 7,084,474 - Hung , et al. August 1, 2 | 2006-08-01 |
Photosensitive semiconductor package and method for fabricating the same App 20050139946 - Hung, Chia-Yu ;   et al. | 2005-06-30 |
Micro BGA package Grant 6,650,005 - Hung , et al. November 18, 2 | 2003-11-18 |
Micro BGA package App 20020190366 - Hung, Chia-Yu ;   et al. | 2002-12-19 |
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