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Patent applications and USPTO patent grants for Hung; Chia-Lin.The latest application filed is for "thermal compression head for flip chip bonding".
Patent | Date |
---|---|
Positionable mechanism with an optical image stabilizing unit Grant 8,976,290 - Chen , et al. March 10, 2 | 2015-03-10 |
Semiconductor package with through silicon vias and method for making the same Grant 8,643,167 - Hung , et al. February 4, 2 | 2014-02-04 |
Thermal Compression Head For Flip Chip Bonding App 20130175324 - Chang; Hui-Shan ;   et al. | 2013-07-11 |
Package structure and package process Grant 8,446,000 - Shen , et al. May 21, 2 | 2013-05-21 |
Positionable Mechanism With An Optical Image Stabilizing Unit App 20130120599 - Chen; Tsung-Tse ;   et al. | 2013-05-16 |
Semiconductor Package With Through Silicon Vias And Method For Making The Same App 20120175767 - Hung; Chia-Lin ;   et al. | 2012-07-12 |
Method for Making Die Assemblies App 20110300669 - Shen; Chi-Chih ;   et al. | 2011-12-08 |
Package Structure And Package Process App 20110121442 - Shen; Chi-Chih ;   et al. | 2011-05-26 |
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