Hung; Chi-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Chi-Wen.The latest application filed is for "wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the same".

Company Profile

0.12.9

Hung; Chi-Wen - Changhua County N/A TW
HUNG; CHI-WEN - TAO YUAN HSIEN TW
Hung; Chi-Wen - Chung Li TW
Hung; Chi-Wen - Hsinchu TW
Hung; Chi-Wen - Hsin Chu City TW
Hung; Chi-Wen - Chung Li City TW
Hung, Chi-Wen - Chungli City TW
Hung; Chi-Wen - Chungli TW
Hung; Chi-Wen - San Rafael CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interchangeable nasal cannula Grant D745,141 - Hung December 8, 2	2015-12-08
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20120094407 - WANG; BILY ; et al.	2012-04-19
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20100301349 - WANG; BILY ; et al.	2010-12-02
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same Grant 7,655,997 - Wang , et al. February 2, 2	2010-02-02
LED package structure for increasing light-emitting efficiency and method of packaging the same Grant 7,515,061 - Wang , et al. April 7, 2	2009-04-07
LED package structure for increasing light-emitting effiency and method of packaging the same App 20080099778 - Wang; Bily ; et al.	2008-05-01
Package structure for semiconductor Grant 7,276,782 - Wang , et al. October 2, 2	2007-10-02
Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same App 20060261488 - Wang; Bily ; et al.	2006-11-23
Wafer-level electro-optical semiconductor manufacture fabrication method App 20060258031 - Wang; Bily ; et al.	2006-11-16
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same App 20060166477 - Wang; Bily ; et al.	2006-07-27
Package structure for semiconductor App 20050139855 - Wang, Bily ; et al.	2005-06-30
Light source structure of light emitting diode App 20050128767 - Wang, Bily ; et al.	2005-06-16
Ic Package With Stacked Sheet Metal Substrate App 20050093010 - Wang, Bily ; et al.	2005-05-05
IC package with stacked sheet metal substrate Grant 6,885,037 - Wang , et al. April 26, 2	2005-04-26
Catalyst system for removal of calcium from a hydrocarbon feedstock Grant 5,102,852 - Hung , et al. April 7, 1	1992-04-07
Graded catalyst system for removal of calcium and sodium from a hydrocarbon feedstock Grant 4,830,736 - Hung , et al. May 16, 1	1989-05-16
Dehydrogenation catalyst composition Grant 4,506,032 - Imai , et al. March 19, 1	1985-03-19
Indium-containing dehydrogenation catalyst Grant 4,486,547 - Imai , et al. December 4, 1	1984-12-04
Dehydrogenation of hydrocarbons with a halogen contacting step Grant 4,438,288 - Imai , et al. March 20, 1	1984-03-20
Dehydrogenation process using a catalytic composition Grant 4,430,517 - Imai , et al. February 7, 1	1984-02-07

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