Hung; Cheng-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Cheng-Yu.The latest application filed is for "linearization of non-linearly transformed signals".

Company Profile

3.6.8

Hung; Cheng-Yu - Changhua County TW
Hung; Cheng-Yu - San Diego CA
Hung; Cheng-Yu - New Taipei TW
Hung; Cheng-Yu - New Taipei City TW
Hung; Cheng-Yu - Taipei TW
Hung, Cheng-Yu - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and manufacturing method thereof Grant 11,164,937 - Ho , et al. November 2, 2	2021-11-02
Linearization Of Non-linearly Transformed Signals App 20210151064 - KIM; Lae-Hoon ; et al.	2021-05-20
Acoustic path modeling for signal enhancement Grant 10,957,334 - Kim , et al. March 23, 2	2021-03-23
Semiconductor Device And Manufacturing Method Thereof App 20200235199 - HO; Yi-Chen ; et al.	2020-07-23
Acoustic Path Modeling For Signal Enhancement App 20200194021 - KIM; Lae-Hoon ; et al.	2020-06-18
Acoustic gesture detection for control of a hearable device Grant 10,623,845 - Kim , et al.	2020-04-14
Electronic apparatus and display backlight control method Grant 9,552,779 - Yu , et al. January 24, 2	2017-01-24
Electronic Apparatus And Display Backlight Control Method App 20160163269 - Yu; Chung-Cheng ; et al.	2016-06-09
Gradient barrier layer for copper back-end-of-line technology Grant 7,067,917 - Liou , et al. June 27, 2	2006-06-27
Gradient barrier layer for copper back-end-of-line technology App 20030186541 - Liou, Fu-Tai ; et al.	2003-10-02
Gradient barrier layer for copper back-end-of-line technology App 20030186087 - Liou, Fu-Tai ; et al.	2003-10-02
Metal interconnect structure Grant 6,621,167 - Lin , et al. September 16, 2	2003-09-16
Bonding pad structure for copper/low-k dielectric material BEOL process App 20030020163 - Hung, Cheng-Yu ; et al.	2003-01-30
Method of fabricating a self-align contact with a disposable spacer App 20020132403 - Hung, Cheng-Yu ; et al.	2002-09-19

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