Hung; Chang-Ying

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hung; Chang-Ying.The latest application filed is for "semiconductor device having shielded conductive vias and method for manufacturing the same".

Company Profile

0.6.7

Hung; Chang-Ying - Kaohsiung N/A TW
Hung; Chang-Ying - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having shielded conductive vias Grant 8,541,883 - Cheng , et al. September 24, 2	2013-09-24
Semiconductor Device Having Shielded Conductive Vias And Method For Manufacturing The Same App 20130134601 - Cheng; Hung-Hsiang ; et al.	2013-05-30
Wafer and semiconductor package Grant 8,110,931 - Chang , et al. February 7, 2	2012-02-07
Semiconductor package and method for packaging a semiconductor package Grant 8,076,786 - Hung , et al. December 13, 2	2011-12-13
Semiconductor package and method for processing and bonding a wire Grant 8,053,906 - Chang , et al. November 8, 2	2011-11-08
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Grant 8,018,075 - Chang , et al. September 13, 2	2011-09-13
Semiconductor Package Structure Using The Same App 20100200974 - Weng; Chao-Fu ; et al.	2010-08-12
Semiconductor Package And Method For Packaging A Semiconductor Package App 20100007011 - HUNG; Chang Ying ; et al.	2010-01-14
Semiconductor Package And Method For Processing And Bonding A Wire App 20100007009 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package App 20100007010 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Wafer And Semiconductor Package App 20100007004 - CHANG; Hsiao Chuan ; et al.	2010-01-14

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