HUNEKE; JAMES T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUNEKE; JAMES T..The latest application filed is for "heat and moisture resistant anaerobic adhesives and sealants".

Company Profile

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HUNEKE; JAMES T. - SAN DIEGO CA
Huneke; James T - San Diego CA
Huneke; James T. - Irvine CA
Huneke; James T. - Lower Makefield Township Bucks County

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat And Moisture Resistant Anaerobic Adhesives And Sealants App 20140275413 - DERSHEM; STEPHEN M. ; et al.	2014-09-18
Materials and methods for stress reduction in semiconductor wafer passivation layers Grant 8,710,682 - Dershem , et al. April 29, 2	2014-04-29
Materials And Methods For Stress Reduction In Semiconductor Wafer Passivation Layers App 20130228901 - Dershem; Stephen M. ; et al.	2013-09-05
Materials and methods for stress reduction in semiconductor wafer passivation layers Grant 8,415,812 - Dershem , et al. April 9, 2	2013-04-09
Methods of dicing stacked shingled strip constructions to form stacked die packages Grant 8,399,974 - Huneke March 19, 2	2013-03-19
Materials And Methods For Stress Reduction In Semiconductor Wafer Passivation Layers App 20110049731 - Dershem; Stephen M. ; et al.	2011-03-03
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices Grant 7,582,510 - Todd , et al. September 1, 2	2009-09-01
Interlayer dielectric and pre-applied die attach adhesive materials Grant 7,550,825 - Santos , et al. June 23, 2	2009-06-23
Electronic Packaging Materials for Use with Low-K Dielectric-Containing Semiconductor Devices App 20080122088 - Todd; Michael G. ; et al.	2008-05-29
Interlayer dielectric and pre-applied die attach adhesive materials Grant 7,312,534 - delos Santos , et al. December 25, 2	2007-12-25
Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials App 20070278683 - Santos; Benedicto delos ; et al.	2007-12-06
Interlayer dielectric and pre-applied die attach adhesive materials App 20050008832 - Santos, Benedicto de los ; et al.	2005-01-13
Additive processing electroless metal plating using aqueous photoresist Grant 4,574,031 - Dorey, II , et al. March 4, 1	1986-03-04

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