Humpston; Giles

Patent Applications and Registrations

Patent applications and USPTO patent grants for Humpston; Giles.The latest application filed is for "rear-face illuminated solid state image sensors".

Company Profile

1.52.82

Humpston; Giles - Buckinghamshire GB
Humpston; Giles - San Jose CA US
Humpston; Giles - Aylesbury N/A GB
Humpston; Giles - Ayles Bury GB
Humpston, Giles - Aylsbury Bucks

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Rear-face illuminated solid state image sensors Grant 10,249,673 - Humpston , et al.	2019-04-02
Optical imaging apparatus and methods of making the same Grant 10,147,750 - Kriman , et al. De	2018-12-04
Rear-face illuminated solid state image sensors App 20170117318 - Humpston; Giles ; et al.	2017-04-27
Microelectronic assembly with multi-layer support structure Grant 9,548,145 - Nystrom , et al. January 17, 2	2017-01-17
Rear-face illuminated solid state image sensors Grant 9,484,379 - Humpston , et al. November 1, 2	2016-11-01
Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same Grant 9,029,759 - Singh , et al. May 12, 2	2015-05-12
Rear-face Illuminated Solid State Image Sensors App 20150091120 - Humpston; Giles ; et al.	2015-04-02
Rear-face illuminated solid state image sensors Grant 8,900,910 - Humpston , et al. December 2, 2	2014-12-02
Reconstituted wafer stack packaging with after-applied pad extensions Grant 8,883,562 - Haba , et al. November 11, 2	2014-11-11
Microelectronic Assembly With Multi-layer Support Structure App 20140224419 - Nystrom; Michael J. ; et al.	2014-08-14
Semiconductor packaging process using through silicon vias Grant 8,735,287 - Haba , et al. May 27, 2	2014-05-27
Rear-face Illuminated Solid State Image Sensors App 20140120650 - Humpston; Giles ; et al.	2014-05-01
Stack Packages Using Reconstituted Wafers App 20140027931 - Avsian; Osher ; et al.	2014-01-30
Rear-face illuminated solid state image sensors Grant 8,624,342 - Humpston , et al. January 7, 2	2014-01-07
Electrohydrodynamic (ehd) Air Mover Configuration With Flow Path Expansion And/or Spreading For Improved Ozone Catalysis App 20130340981 - Jewell-Larsen; Nels ; et al.	2013-12-26
Reconstituted Wafer Stack Packaging With After-applied Pad Extensions App 20130344652 - Haba; Belgacem ; et al.	2013-12-26
Microelectronic assembly with multi-layer support structure Grant 8,604,605 - Nystrom , et al. December 10, 2	2013-12-10
Multi-State Electrostatic Actuator and Digital Camera Therewith App 20130314587 - Kriman; Moshe ; et al.	2013-11-28
Compact Camera Module App 20130270419 - Singh; Harpuneet ; et al.	2013-10-17
Stack packages using reconstituted wafers Grant 8,551,815 - Avsian , et al. October 8, 2	2013-10-08
Electrohydrodynamic device components employing solid solutions Grant 8,545,599 - Humpston October 1, 2	2013-10-01
Stacked microelectronic assemblies having vias extending through bond pads Grant 8,466,542 - Kriman , et al. June 18, 2	2013-06-18
Reconstituted wafer stack packaging with after-applied pad extensions Grant 8,461,672 - Haba , et al. June 11, 2	2013-06-11
Emitter Wire With Layered Cross-section App 20130056241 - Gao; Guilian ; et al.	2013-03-07
Semiconductor Packaging Process Using Through Silicon Vias App 20120241976 - Haba; Belgacem ; et al.	2012-09-27
Microelectronic packages fabricated at the wafer level and methods therefor Grant 8,241,959 - Haba , et al. August 14, 2	2012-08-14
Wafer-Scale Emitter Package Including Thermal Vias App 20120199857 - Humpston; Giles ; et al.	2012-08-09
Microelectronic package comprising offset conductive posts on compliant layer Grant 8,207,604 - Haba , et al. June 26, 2	2012-06-26
Semiconductor packaging process using through silicon vias Grant 8,193,615 - Haba , et al. June 5, 2	2012-06-05
Rear-face Illuminated Solid State Image Sensors App 20120112301 - Humpston; Giles ; et al.	2012-05-10
Electrohydrodynamic Device Components Employing Solid Solutions App 20120103196 - Humpston; Giles	2012-05-03
Optical Imaging Apparatus And Methods Of Making The Same App 20110273600 - Kriman; Moshe ; et al.	2011-11-10
Stack Packages Using Reconstituted Wafers App 20110248410 - Avsian; Osher ; et al.	2011-10-13
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating Grant 7,935,568 - Oganesian , et al. May 3, 2	2011-05-03
Wafer level chip packaging Grant 7,936,062 - Humpston , et al. May 3, 2	2011-05-03
Reconstituted Wafer Stack Packaging With After-applied Pad Extensions App 20110006432 - Haba; Belgacem ; et al.	2011-01-13
Wire bonded wafer level cavity package Grant 7,858,445 - Honer , et al. December 28, 2	2010-12-28
Microelectronic Packages Fabricated At The Wafer Level And Methods Therefor App 20100270679 - Haba; Belgacem ; et al.	2010-10-28
Compact Lens Turret Assembly App 20100242269 - Humpston; Giles ; et al.	2010-09-30
Stacked Microelectronic Assemblies Having Vias Extending Through Bond Pads App 20100230795 - Kriman; Moshe ; et al.	2010-09-16
Methods for forming connection structures for microelectronic devices Grant 7,793,414 - Haba , et al. September 14, 2	2010-09-14
Compact lens turret assembly Grant 7,768,574 - Humpston August 3, 2	2010-08-03
Microelectronic packages fabricated at the wafer level and methods therefor Grant 7,759,166 - Haba , et al. July 20, 2	2010-07-20
Microelectronic packages and methods therefor Grant 7,719,121 - Humpston , et al. May 18, 2	2010-05-18
Pin referenced image sensor to reduce tilt in a camera module Grant 7,593,636 - Nystrom , et al. September 22, 2	2009-09-22
Method of forming a wall structure in a microelectronic assembly Grant 7,569,424 - Nystrom , et al. August 4, 2	2009-08-04
Stack microelectronic assemblies Grant 7,545,029 - Wilson , et al. June 9, 2	2009-06-09
Compliant terminal mountings with vented spaces and methods Grant 7,521,276 - Nystrom , et al. April 21, 2	2009-04-21
Microelectronic component with foam-metal posts Grant 7,510,401 - Humpston , et al. March 31, 2	2009-03-31
Semiconductor packaging process using through silicon vias App 20090065907 - Haba; Belgacem ; et al.	2009-03-12
Microelectronic package optionally having differing cover and device thermal expansivities Grant 7,485,956 - Tuckerman , et al. February 3, 2	2009-02-03
Wire bonded wafer level cavity package App 20090023249 - Honer; Kenneth Allen ; et al.	2009-01-22
Packages and assemblies including lidded chips App 20080296717 - Beroz; Masud ; et al.	2008-12-04
Compliant terminal mountings with vented spaces and methods Grant 7,453,139 - Nystrom , et al. November 18, 2	2008-11-18
Wire bonded wafer level cavity package Grant 7,449,779 - Honer , et al. November 11, 2	2008-11-11
Liquid lens with piezoelectric voltage converter Grant 7,443,597 - Humpston October 28, 2	2008-10-28
Pin referenced image sensor to reduce tilt in a camera module App 20080191300 - Nystrom; Michael J. ; et al.	2008-08-14
Microelectronic packages and methods therefor App 20080185705 - Osborn; Philip R. ; et al.	2008-08-07
Microelectronic assembly with multi-layer support structure App 20080165519 - Nystrom; Michael J. ; et al.	2008-07-10
Method of forming a wall structure in a microelectronic assembly App 20080113470 - Nystrom; Michael J. ; et al.	2008-05-15
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating App 20080099900 - Oganesian; Vage ; et al.	2008-05-01
Microelectronic component with foam-metal posts App 20080090427 - Humpston; Giles ; et al.	2008-04-17
Microelectronic packages fabricated at the wafer level and methods therefor App 20080090333 - Haba; Belgacem ; et al.	2008-04-17
Microelectronic packages and methods therefor App 20080088033 - Humpston; Giles ; et al.	2008-04-17
Stacked microelectronic assemblies and methods therefor App 20080042250 - Wilson; Stuart E. ; et al.	2008-02-21
Solder elements with columnar structures and methods of making the same App 20080036100 - McWilliams; Bruce M. ; et al.	2008-02-14
Structure and method of making sealed capped chips App 20080032457 - McWilliams; Bruce M. ; et al.	2008-02-07
Structure and method of making lidded chips App 20080029879 - Tuckerman; David B. ; et al.	2008-02-07
Microelectronic package having stacked semiconductor devices and a process for its fabrication Grant 7,317,249 - Crisp , et al. January 8, 2	2008-01-08
Structure and method of making lidded chips App 20080002460 - Tuckerman; David B. ; et al.	2008-01-03
Structure and method of making lidded chips App 20080001241 - Tuckerman; David B. ; et al.	2008-01-03
Wafer level semiconductor chip packages and methods of making the same App 20070267730 - Liew; Victor ; et al.	2007-11-22
Structure and method of making sealed capped chips Grant 7,298,030 - McWilliams , et al. November 20, 2	2007-11-20
Connection structures for microelectronic devices and methods for forming such structures Grant 7,262,368 - Haba , et al. August 28, 2	2007-08-28
Wafer level chip packaging App 20070190691 - Humpston; Giles ; et al.	2007-08-16
Wafer level packaging to lidded chips App 20070190747 - Humpston; Giles ; et al.	2007-08-16
Liquid lens with piezoelectric voltage converter App 20070146894 - Humpston; Giles	2007-06-28
Compliant terminal mountings with vented spaces and methods App 20070145536 - Nystrom; Michael J. ; et al.	2007-06-28
Compliant terminal mountings with vented spaces and methods App 20070148824 - Nystrom; Michael J. ; et al.	2007-06-28
Camera modules with liquid optical elements App 20070147816 - Humpston; Giles ; et al.	2007-06-28
Structure and method of making capped chip having discrete article assembled into vertical interconnect App 20070138644 - McWilliams; Bruce M. ; et al.	2007-06-21
Back-face and edge interconnects for lidded package Grant 7,224,056 - Burtzlaff , et al. May 29, 2	2007-05-29
Methods for forming connection structures for microelectronic devices App 20070094874 - Haba; Belgacem ; et al.	2007-05-03
Structure and method of making capped chips having vertical interconnects App 20070096311 - Humpston; Giles ; et al.	2007-05-03
Back-face and edge interconnects for lidded package App 20070096295 - Burtzlaff; Robert ; et al.	2007-05-03
Structure and self-locating method of making capped chips App 20070096312 - Humpston; Giles ; et al.	2007-05-03
Microelectronic package optionally having differing cover and device thermal expansivities App 20070042527 - Tuckerman; David B. ; et al.	2007-02-22
Manufacture of microelectronic fold packages Grant 7,157,309 - Colella , et al. January 2, 2	2007-01-02
Soldered assemblies and methods of making the same App 20060278997 - Gibson; David ; et al.	2006-12-14
Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps Grant 7,129,576 - Humpston October 31, 2	2006-10-31
Wire bonded wafer level cavity package App 20060220234 - Honer; Kenneth Allen ; et al.	2006-10-05
Tools and methods for forming conductive bumps on microelectronic elements App 20060183270 - Humpston; Giles	2006-08-17
Microelectronic packages using a ceramic substrate having a window and a conductive surface region App 20060138626 - Liew; Victor ; et al.	2006-06-29
Microelectronic package having stacked semiconductor devices and a process for its fabrication App 20060138647 - Crisp; Richard Dewitt ; et al.	2006-06-29
Compact lens turret assembly App 20060109366 - Humpston; Giles ; et al.	2006-05-25
Solder ball formation and transfer method App 20060108402 - Crisp; Richard Dewitt ; et al.	2006-05-25
Wafer Level Microelectronic Packaging With Double Isolation App 20060081983 - Humpston; Giles ; et al.	2006-04-20
Remote control and power system Grant 7,026,744 - Humpston , et al. April 11, 2	2006-04-11
Connection structures for microelectronic devices and methods for forming such structures App 20060032670 - Haba; Belgacem ; et al.	2006-02-16
Structure with spherical contact pins App 20060027899 - Humpston; Giles ; et al.	2006-02-09
Compact lens turret assembly App 20050248680 - Humpston, Giles	2005-11-10
Compliant and hermetic solder seal Grant 6,958,446 - Humpston , et al. October 25, 2	2005-10-25
Manufacture of microelectronic fold packages App 20050227410 - Colella, Nicholas J. ; et al.	2005-10-13
Packaged acoustic and electromagnetic transducer chips App 20050189622 - Humpston, Giles ; et al.	2005-09-01
Packaged acoustic and electromagnetic transducer chips App 20050189635 - Humpston, Giles ; et al.	2005-09-01
Micro pin grid array with wiping action App 20050181655 - Haba, Belgacem ; et al.	2005-08-18
Package element and packaged chip having severable electrically conductive ties App 20050139984 - Tuckerman, David B. ; et al.	2005-06-30
Microelectronic element having trace formed after bond layer App 20050116344 - Humpston, Giles	2005-06-02
Structure and method of making capped chips having vertical interconnects App 20050095835 - Humpston, Giles ; et al.	2005-05-05
Back-face and edge interconnects for lidded package App 20050087861 - Burtzlaff, Robert ; et al.	2005-04-28
Structure and method of making sealed capped chips App 20050082653 - McWilliams, Bruce M. ; et al.	2005-04-21
Structure and method of making capped chips using sacrificial layer App 20050085016 - McWilliams, Bruce M. ; et al.	2005-04-21
Structure and self-locating method of making capped chips App 20050082654 - Humpston, Giles ; et al.	2005-04-21
Package having integral lens and wafer-scale fabrication method therefor App 20050067681 - De Villeneuve, Catherine ; et al.	2005-03-31
Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps App 20050067688 - Humpston, Giles	2005-03-31
Method of soldering App 20040173660 - Lodge, Kevin Joseph ; et al.	2004-09-09
Vented cavity, hermetic solder seal Grant 6,732,905 - Humpston , et al. May 11, 2	2004-05-11
Remote control and power system App 20040056562 - Humpston, Giles ; et al.	2004-03-25
Compliant and hermetic solder seal App 20030198428 - Humpston, Giles ; et al.	2003-10-23
Vented cavity, hermetic solder seal App 20030192942 - Humpston, Giles ; et al.	2003-10-16
Electrical apparatus Grant 6,493,231 - Nicholson , et al. December 10, 2	2002-12-10
Electrical Apparatus App 20020054482 - NICHOLSON, BRIAN F ; et al.	2002-05-09