Hummel; John P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hummel; John P..The latest application filed is for "formation of vertical devices by electroplating".

Company Profile

0.14.13

Hummel; John P. - Millbrook NY
Hummel; John P. - Verbank NY
Hummel, John P. - Milbrook NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Formation of vertical devices by electroplating Grant 8,247,905 - Deligianni , et al. August 21, 2	2012-08-21
Method of forming vertical contacts in integrated circuits Grant 7,803,639 - Assefa , et al. September 28, 2	2010-09-28
Formation Of Vertical Devices By Electroplating App 20090294989 - Deligianni; Hariklia ; et al.	2009-12-03
Formation of vertical devices by electroplating Grant 7,608,538 - Deligianni , et al. October 27, 2	2009-10-27
Utilizing sidewall spacer features to form magnetic tunnel junctions in an integrated circuit Grant 7,531,367 - Assefa , et al. May 12, 2	2009-05-12
Utilizing Sidewall Spacer Features to Form Magnetic Tunnel Junctions in an Integrated Circuit App 20080211055 - Assefa; Solomon ; et al.	2008-09-04
Formation Of Vertical Devices By Electroplating App 20080166874 - Deligianni; Hariklia ; et al.	2008-07-10
Method of Forming Vertical Contacts in Integrated Circuits App 20080164617 - Assefa; Solomon ; et al.	2008-07-10
Utilizing sidewall spacer features to form magnetic tunnel junctions in an integrated circuit App 20070166840 - Assefa; Solomon ; et al.	2007-07-19
Magnetic switching device Grant 7,097,777 - Costrini , et al. August 29, 2	2006-08-29
Encapsulation of conductive lines of semiconductor devices Grant 7,087,438 - Kasko , et al. August 8, 2	2006-08-08
Encapsulation of conductive lines of semiconductor devices App 20060019431 - Kasko; Ihar ; et al.	2006-01-26
Magnetic switching device App 20050207064 - Costrini, Gregory ; et al.	2005-09-22
Method for improved alignment of magnetic tunnel junction elements Grant 6,933,204 - Sarma , et al. August 23, 2	2005-08-23
Method For Improved Alignment Of Magnetic Tunnel Junction Elements App 20050079683 - Sarma, Chandrasekhar ; et al.	2005-04-14
Patterning metal stack layers of magnetic switching device, utilizing a bilayer metal hardmask App 20040084400 - Costrini, Gregory ; et al.	2004-05-06
Dual damascene flowable oxide insulation structure and metallic barrier Grant 6,727,589 - Greco , et al. April 27, 2	2004-04-27
Insulating Cap Layer And Conductive Cap Layer For Semiconductor Devices With Magnetic Material Layers App 20040021188 - Low, Kia-Seng ; et al.	2004-02-05
Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers Grant 6,680,500 - Low , et al. January 20, 2	2004-01-20
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same Grant 6,577,011 - Buchwalter , et al. June 10, 2	2003-06-10
Post metalization chem-mech polishing dielectric etch Grant 6,551,924 - Dalton , et al. April 22, 2	2003-04-22
Plasma treatment to enhance inorganic dielectric adhesion to copper App 20010053591 - Buchwalter, Leena P. ; et al.	2001-12-20
Interim oxidation of silsesquioxane dielectric for dual damascene process App 20010036739 - Cook, Robert ; et al.	2001-11-01
Plasma treatment to enhance inorganic dielectric adhesion to copper Grant 6,261,951 - Buchwalter , et al. July 17, 2	2001-07-17
Dual damascene flowable oxide insulation structure and metallic barrier App 20010000115 - Greco, Stephen E. ; et al.	2001-04-05
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same Grant 6,184,121 - Buchwalter , et al. February 6, 2	2001-02-06
Process for forming a circuit assembly Grant 5,633,034 - Carter , et al. May 27, 1	1997-05-27

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