Humbel; Oliver

Patent Applications and Registrations

Patent applications and USPTO patent grants for Humbel; Oliver.The latest application filed is for "semiconductor device including bonding pad metal layer structure".

Company Profile

7.10.15

Humbel; Oliver - Maria Elend AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ppower semiconductor device with anticorrosive edge termination structure Grant 11,387,359 - Humbel , et al. July 12, 2	2022-07-12
Semiconductor Device Including Bonding Pad Metal Layer Structure App 20220059477 - Napetschnig; Evelyn ; et al.	2022-02-24
Semiconductor Device With First And Second Portions That Include Silicon And Nitrogen App 20210287954 - Kahn; Markus ; et al.	2021-09-16
Semiconductor device with a portion including silicon and nitrogen and method of manufacturing Grant 11,075,134 - Kahn , et al. July 27, 2	2021-07-27
High Voltage Semiconductor Device with Step Topography Passivation Layer Stack App 20210151391 - Koprowski; Angelika ; et al.	2021-05-20
Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device Grant 10,777,506 - Hille , et al. Sept	2020-09-15
Power Semiconductor Device App 20200194585 - Humbel; Oliver ; et al.	2020-06-18
Semiconductor Device with a Portion Including Silicon and Nitrogen and Method of Manufacturing App 20200083133 - Kahn; Markus ; et al.	2020-03-12
Silicon Carbide Semiconductor Device Having a Metal Adhesion and Barrier Structure and a Method of Forming Such a Semiconductor App 20200013722 - Hille; Frank ; et al.	2020-01-09
Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device Grant 10,475,743 - Hille , et al. Nov	2019-11-12
Semiconductor Device and Manufacturing App 20190333765 - Kahn; Markus ; et al.	2019-10-31
Semiconductor device with a passivation layer Grant 9,859,395 - Schmidt , et al. January 2, 2	2018-01-02
Semiconductor Device Having a Metal Adhesion and Barrier Structure and a Method of Forming Such a Semiconductor Device App 20170271268 - Hille; Frank ; et al.	2017-09-21
Semiconductor device and method for forming a semiconductor device Grant 9,418,850 - Humbel , et al. August 16, 2	2016-08-16
Semiconductor device having a corrosion-resistant metallization and method for manufacturing thereof Grant 9,355,958 - Schaffer , et al. May 31, 2	2016-05-31
Adjusting the charge carrier lifetime in a bipolar semiconductor device Grant 9,349,799 - Schmidt , et al. May 24, 2	2016-05-24
Semiconductor Device and Method for Forming a Semiconductor Device App 20160111289 - Humbel; Oliver ; et al.	2016-04-21
Adjusting the Charge Carrier Lifetime in a Bipolar Semiconductor Device App 20160049474 - Schmidt; Gerhard ; et al.	2016-02-18
Power Semiconductor Device,power Electronic Module, And Method For Processing A Power Semiconductor Device App 20150262814 - Plappert; Mathias ; et al.	2015-09-17
Semiconductor Device Having a Corrosion-Resistant Metallization and Method for Manufacturing Thereof App 20150115449 - Schaffer; Carsten ; et al.	2015-04-30
Semiconductor Device with a Passivation Layer App 20150056788 - Schmidt; Gerhard ; et al.	2015-02-26
Semiconductor device with a passivation layer Grant 8,884,342 - Schmidt , et al. November 11, 2	2014-11-11
Semiconductor Device with a Passivation Layer App 20140061733 - Schmidt; Gerhard ; et al.	2014-03-06

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