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name:-0.19734597206116
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Humayun; Raashina Patent Filings

Humayun; Raashina

Patent Applications and Registrations

Patent applications and USPTO patent grants for Humayun; Raashina.The latest application filed is for "low resistivity films containing molybdenum".

Company Profile
20.76.68
  • Humayun; Raashina - Los Altos CA
  • Humayun; Raashina - Fremont CA
  • Humayun; Raashina - Sunnyvale CA
  • Humayun; Raashina - Freemont CA
  • Humayun; Raashina - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tungsten feature fill with nucleation inhibition
Grant 11,410,883 - Chandrashekar , et al. August 9, 2
2022-08-09
Low Resistivity Films Containing Molybdenum
App 20220223471 - THOMBARE; Shruti Vivek ;   et al.
2022-07-14
Metal fill process for three-dimensional vertical NAND wordline
Grant 11,348,795 - Schloss , et al. May 31, 2
2022-05-31
Feature Fill With Nucleation Inhibition
App 20220102208 - Chandrashekar; Anand ;   et al.
2022-03-31
Tungsten Feature Fill
App 20210327754 - Chandrashekar; Anand ;   et al.
2021-10-21
Metal-containing Passivation For High Aspect Ratio Etch
App 20210242032 - COLINJIVADI; Karthik S. ;   et al.
2021-08-05
Tungsten feature fill
Grant 11,075,115 - Chandrashekar , et al. July 27, 2
2021-07-27
Feature fill with multi-stage nucleation inhibition
Grant 10,916,434 - Wang , et al. February 9, 2
2021-02-09
Systems And Methods For Homogenous Intermixing Of Precursors In Alloy Atomic Layer Deposition
App 20200407842 - FISHER; Ilanit ;   et al.
2020-12-31
Low Resistivity Films Containing Molybdenum
App 20200365456 - Thombare; Shruti Vivek ;   et al.
2020-11-19
Low resistivity films containing molybdenum
Grant 10,777,453 - Thombare , et al. Sept
2020-09-15
Depositing ruthenium layers in interconnect metallization
Grant 10,731,250 - Kim , et al.
2020-08-04
Metal Fill Process For Three-dimensional Vertical Nand Wordline
App 20200211853 - Schloss; Lawrence ;   et al.
2020-07-02
Feature Fill With Nucleation Inhibition
App 20200185273 - Chandrashekar; Anand ;   et al.
2020-06-11
Feature Fill With Multi-stage Nucleation Inhibition
App 20200185225 - Wang; Deqi ;   et al.
2020-06-11
Low Resistivity Films Containing Molybdenum
App 20200075403 - Thombare; Shruti Vivek ;   et al.
2020-03-05
Feature fill with multi-stage nucleation inhibition
Grant 10,580,654 - Wang , et al.
2020-03-03
Feature fill with nucleation inhibition
Grant 10,580,695 - Chandrashekar , et al.
2020-03-03
Forming low resistivity fluorine free tungsten film without nucleation
Grant 10,546,751 - Bamnolker , et al. Ja
2020-01-28
Tungsten for wordline applications
Grant 10,529,722 - Danek , et al. J
2020-01-07
Low resistivity films containing molybdenum
Grant 10,510,590 - Thombare , et al. Dec
2019-12-17
Manganese barrier and adhesion layers for cobalt
Grant 10,438,847 - Lai , et al. O
2019-10-08
Tungsten Feature Fill With Nucleation Inhibition
App 20190206731 - Chandrashekar; Anand ;   et al.
2019-07-04
Selective deposition of WCN barrier/adhesion layer for interconnect
Grant 10,283,404 - Na , et al.
2019-05-07
Tungsten feature fill with nucleation inhibition
Grant 10,256,142 - Chandrashekar , et al.
2019-04-09
Methods and apparatus for forming smooth and conformal cobalt film by atomic layer deposition
Grant 10,242,879 - Na , et al.
2019-03-26
Feature Fill With Multi-stage Nucleation Inhibition
App 20190080914 - Wang; Deqi ;   et al.
2019-03-14
Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide
Grant 10,229,826 - Tarafdar , et al.
2019-03-12
Tungsten Feature Fill
App 20190019725 - Chandrashekar; Anand ;   et al.
2019-01-17
Feature fill with multi-stage nucleation inhibition
Grant 10,170,320 - Wang , et al. J
2019-01-01
Depositing Ruthenium Layers In Interconnect Metallization
App 20180347041 - Kim; Do Young ;   et al.
2018-12-06
Methods And Apparatus For Forming Smooth And Conformal Cobalt Film By Atomic Layer Deposition
App 20180308701 - Na; Jeong-Seok ;   et al.
2018-10-25
Tungsten feature fill
Grant 10,103,058 - Chandrashekar , et al. October 16, 2
2018-10-16
Low Resistivity Films Containing Molybdenum
App 20180294187 - Thombare; Shruti Vivek ;   et al.
2018-10-11
Selective Deposition Of Wcn Barrier/adhesion Layer For Interconnect
App 20180286746 - Na; Jeong-Seok ;   et al.
2018-10-04
Feature Fill With Nucleation Inhibition
App 20180277431 - Chandrashekar; Anand ;   et al.
2018-09-27
Forming Low Resistivity Fluorine Free Tungsten Film Without Nucleation
App 20180240675 - Bamnolker; Hanna ;   et al.
2018-08-23
Tungsten For Wordline Applications
App 20180219014 - Danek; Michal ;   et al.
2018-08-02
Feature fill with nucleation inhibition
Grant 9,997,405 - Chandrashekar , et al. June 12, 2
2018-06-12
Method of forming low resistivity fluorine free tungsten film without nucleation
Grant 9,978,605 - Bamnolker , et al. May 22, 2
2018-05-22
Systems And Methods For Forming Low Resistivity Metal Contacts And Interconnects By Reducing And Removing Metallic Oxide
App 20180114694 - Tarafdar; Raihan ;   et al.
2018-04-26
Tungsten for wordline applications
Grant 9,953,984 - Danek , et al. April 24, 2
2018-04-24
Manganese Barrier And Adhesion Layers For Cobalt
App 20170330797 - Lai; Chiukin Steven ;   et al.
2017-11-16
Tungsten Feature Fill
App 20170278749 - Chandrashekar; Anand ;   et al.
2017-09-28
Method for void-free cobalt gap fill
Grant 9,748,137 - Lai , et al. August 29, 2
2017-08-29
Low temperature tungsten film deposition for small critical dimension contacts and interconnects
Grant 9,673,146 - Chen , et al. June 6, 2
2017-06-06
Tungsten feature fill
Grant 9,653,353 - Chandrashekar , et al. May 16, 2
2017-05-16
Method For Depositing Extremely Low Resistivity Tungsten
App 20170133231 - Bamnolker; Hanna ;   et al.
2017-05-11
Method Of Forming Low Resistivity Fluorine Free Tungsten Film Without Nucleation
App 20170117155 - Bamnolker; Hanna ;   et al.
2017-04-27
Deposition of low fluorine tungsten by sequential CVD process
Grant 9,613,818 - Ba , et al. April 4, 2
2017-04-04
Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor
Grant 9,595,470 - Bamnolker , et al. March 14, 2
2017-03-14
Method for forming tungsten film having low resistivity, low roughness and high reflectivity
Grant 9,589,835 - Chandrashekar , et al. March 7, 2
2017-03-07
Method for depositing extremely low resistivity tungsten
Grant 9,589,808 - Bamnolker , et al. March 7, 2
2017-03-07
Void free tungsten fill in different sized features
Grant 9,548,228 - Chandrashekar , et al. January 17, 2
2017-01-17
Deposition Of Low Fluorine Tungsten By Sequential Cvd Process
App 20160351401 - Ba; Xiaolan ;   et al.
2016-12-01
Feature Fill With Multi-stage Nucleation Inhibition
App 20160343612 - Wang; Deqi ;   et al.
2016-11-24
Tungsten For Wordline Applications
App 20160233220 - Danek; Michal ;   et al.
2016-08-11
Tungsten Feature Fill
App 20160190008 - Chandrashekar; Anand ;   et al.
2016-06-30
Low Tempature Tungsten Film Deposition For Small Critical Dimension Contacts And Interconnects
App 20160118345 - Chen; Feng ;   et al.
2016-04-28
Feature Fill With Nucleation Inhibition
App 20160093528 - Chandrashekar; Anand ;   et al.
2016-03-31
Tungsten Feature Fill With Nucleation Inhibition
App 20160071764 - Chandrashekar; Anand ;   et al.
2016-03-10
Method For Void-free Cobalt Gap Fill
App 20160056077 - Lai; Chiukin Steven ;   et al.
2016-02-25
CVD flowable gap fill
Grant 9,257,302 - Wang , et al. February 9, 2
2016-02-09
Tungsten feature fill
Grant 9,240,347 - Chandrashekar , et al. January 19, 2
2016-01-19
Low tempature tungsten film deposition for small critical dimension contacts and interconnects
Grant 9,236,297 - Chen , et al. January 12, 2
2016-01-12
Methods Of Filling High Aspect Ratio Features With Fluorine Free Tungsten
App 20150348840 - Bamnolker; Hanna ;   et al.
2015-12-03
Methods Of Preparing Tungsten And Tungsten Nitride Thin Films Using Tungsten Chloride Precursor
App 20150325475 - Bamnolker; Hanna ;   et al.
2015-11-12
Tungsten deposition process using germanium-containing reducing agent
Grant 9,159,571 - Humayun , et al. October 13, 2
2015-10-13
Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features
Grant 9,082,826 - Chandrashekar , et al. July 14, 2
2015-07-14
Method For Depositing Extremely Low Resistivity Tungsten
App 20150179461 - Bamnolker; Hanna ;   et al.
2015-06-25
Depositing tungsten into high aspect ratio features
Grant 9,034,768 - Chandrashekar , et al. May 19, 2
2015-05-19
Methods of forming tensile tungsten films and compressive tungsten films
Grant 9,034,760 - Chen , et al. May 19, 2
2015-05-19
Tungsten Feature Fill
App 20150056803 - Chandrashekar; Anand ;   et al.
2015-02-26
Pedestal Bottom Clean For Improved Fluorine Utilization And Integrated Symmetric Foreline
App 20150030766 - Lind; Gary B. ;   et al.
2015-01-29
Void Free Tungsten Fill In Different Sized Features
App 20150024592 - Chandrashekar; Anand ;   et al.
2015-01-22
Methods And Apparatuses For Void-free Tungsten Fill In Three-dimensional Semiconductor Features
App 20140349477 - Chandrashekar; Anand ;   et al.
2014-11-27
Systems and methods for controlling etch selectivity of various materials
Grant 8,883,637 - Jeng , et al. November 11, 2
2014-11-11
Method for depositing tungsten film with low roughness and low resistivity
Grant 8,853,080 - Guan , et al. October 7, 2
2014-10-07
Depositing tungsten into high aspect ratio features
Grant 8,835,317 - Chandrashekar , et al. September 16, 2
2014-09-16
Flowable film dielectric gap fill process
Grant 8,809,161 - Gauri , et al. August 19, 2
2014-08-19
Methods For Depositing Ultra Thin Low Resistivity Tungsten Film For Small Critical Dimension Contacts And Interconnects
App 20140162451 - Chen; Feng ;   et al.
2014-06-12
Tungsten Nucleation Process To Enable Low Resistivity Tungsten Feature Fill
App 20140154883 - Humayun; Raashina ;   et al.
2014-06-05
Methods And Apparatus For Cleaning Deposition Chambers
App 20140069459 - Guan; Yan ;   et al.
2014-03-13
Method For Depositing Tungsten Film With Low Roughness And Low Resistivity
App 20140073135 - Guan; Yan ;   et al.
2014-03-13
Method For Depositing Tungsten Film Having Low Resistivity, Low Roughness And High Reflectivity
App 20140017891 - Chandrashekar; Anand ;   et al.
2014-01-16
Flowable Film Dielectric Gap Fill Process
App 20140017904 - GAURI; Vishal ;   et al.
2014-01-16
Methods Of Forming Tensile Tungsten Films And Compressive Tungsten Films
App 20140011358 - Chen; Feng ;   et al.
2014-01-09
Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects
Grant 8,623,733 - Chen , et al. January 7, 2
2014-01-07
Depositing Tungsten Into High Aspect Ratio Features
App 20130330926 - Chandrashekar; Anand ;   et al.
2013-12-12
Tungsten Feature Fill
App 20130302980 - Chandrashekar; Anand ;   et al.
2013-11-14
Method for reducing tungsten roughness and improving reflectivity
Grant 8,551,885 - Chen , et al. October 8, 2
2013-10-08
Method for depositing tungsten film having low resistivity, low roughness and high reflectivity
Grant 8,501,620 - Chandrashekar , et al. August 6, 2
2013-08-06
Flowable film dielectric gap fill process
Grant 8,481,403 - Gauri , et al. July 9, 2
2013-07-09
Tungsten Feature Fill With Nucleation Inhibition
App 20130171822 - Chandrashekar; Anand ;   et al.
2013-07-04
Depositing tungsten into high aspect ratio features
Grant 8,435,894 - Chandrashekar , et al. May 7, 2
2013-05-07
Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics
Grant 8,409,987 - Chandrashekar , et al. April 2, 2
2013-04-02
Methods for forming all tungsten contacts and lines
Grant 8,367,546 - Humayun , et al. February 5, 2
2013-02-05
Systems And Methods For Controlling Etch Selectivity Of Various Materials
App 20130005140 - Jeng; Esther ;   et al.
2013-01-03
Method For Depositing Tungsten Film Having Low Resistivity, Low Roughness And High Reflectivity
App 20120164832 - CHANDRASHEKAR; Anand ;   et al.
2012-06-28
Depositing Tungsten Into High Aspect Ratio Features
App 20120115329 - Chandrashekar; Anand ;   et al.
2012-05-10
Thinning tungsten layer after through silicon via filling
Grant 8,153,520 - Chandrashekar , et al. April 10, 2
2012-04-10
Method for depositing tungsten film having low resistivity, low roughness and high reflectivity
Grant 8,129,270 - Chandrashekar , et al. March 6, 2
2012-03-06
Depositing tungsten into high aspect ratio features
Grant 8,124,531 - Chandrashekar , et al. February 28, 2
2012-02-28
Depositing tungsten into high aspect ratio features
Grant 8,119,527 - Chadrashekar , et al. February 21, 2
2012-02-21
Methods For Forming All Tungsten Contacts And Lines
App 20120040530 - HUMAYUN; Raashina ;   et al.
2012-02-16
Method For Depositing Thin Tungsten Film With Low Resistivity And Robust Micro-adhesion Characteristics
App 20120015518 - Chandrashekar; Anand ;   et al.
2012-01-19
Depositing Tungsten Into High Aspect Ratio Features
App 20120009785 - Chandrashekar; Anand ;   et al.
2012-01-12
Ternary tungsten-containing resistive thin films
Grant 8,062,977 - Ashtiani , et al. November 22, 2
2011-11-22
Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics
Grant 8,058,170 - Chandrashekar , et al. November 15, 2
2011-11-15
Methods for forming all tungsten contacts and lines
Grant 8,053,365 - Humayun , et al. November 8, 2
2011-11-08
VLSI fabrication processes for introducing pores into dielectric materials
Grant 7,972,976 - van den Hoek , et al. July 5, 2
2011-07-05
Depositing Tungsten Into High Aspect Ratio Features
App 20110159690 - Chandrashekar; Anand ;   et al.
2011-06-30
Flowable film dielectric gap fill process
Grant 7,888,233 - Gauri , et al. February 15, 2
2011-02-15
Methods For Depositing Ultra Thin Low Resistivity Tungsten Film For Small Critical Dimension Contacts And Interconnects
App 20100267235 - Chen; Feng ;   et al.
2010-10-21
Method For Forming Tungsten Contacts And Interconnects With Small Critical Dimensions
App 20100267230 - Chandrashekar; Anand ;   et al.
2010-10-21
Method For Depositing Thin Tungsten Film With Low Resistivity And Robust Micro-adhesion Characteristics
App 20100159694 - Chandrashekar; Anand ;   et al.
2010-06-24
Methods For Depositing Tungsten Films Having Low Resistivity For Gapfill Applications
App 20100144140 - Chandrashekar; Anand ;   et al.
2010-06-10
Method For Reducing Tungsten Roughness And Improving Reflectivity
App 20100055904 - CHEN; Feng ;   et al.
2010-03-04
VLSI fabrication processes for introducing pores into dielectric materials
Grant 7,629,224 - van den Hoek , et al. December 8, 2
2009-12-08
Methods For Forming All Tungsten Contacts And Lines
App 20090163025 - Humayun; Raashina ;   et al.
2009-06-25
Flowable film dielectric gap fill process
Grant 7,524,735 - Gauri , et al. April 28, 2
2009-04-28
Plasma detemplating and silanol capping of porous dielectric films
Grant 7,176,144 - Wang , et al. February 13, 2
2007-02-13
VLSI fabrication processes for introducing pores into dielectric materials
Grant 7,166,531 - van den Hoek , et al. January 23, 2
2007-01-23
Selective gap-fill process
Grant 7,074,690 - Gauri , et al. July 11, 2
2006-07-11
Method and apparatus for using surfactants in supercritical fluid processing of wafers
Grant 6,905,556 - Humayun , et al. June 14, 2
2005-06-14
Method and apparatus to remove additives and contaminants from a supercritical processing solution
Grant 6,805,801 - Humayun , et al. October 19, 2
2004-10-19
Method for removing photoresist and post-etch residue using activated peroxide followed by supercritical fluid treatment
Grant 6,800,142 - Tipton , et al. October 5, 2
2004-10-05
System for deposition of mesoporous materials
App 20040096586 - Schulberg, Michelle T. ;   et al.
2004-05-20
Method and apparatus for radiation enhanced supercritical fluid processing
Grant 6,715,498 - Humayun , et al. April 6, 2
2004-04-06

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