loadpatents
Patent applications and USPTO patent grants for Huli; Lior.The latest application filed is for "methods for forming self-aligned contacts using spin-on silicon carbide".
Patent | Date |
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Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Carbide App 20220262679 - Sun; Junling ;   et al. | 2022-08-18 |
Directed Self-assembly App 20220236639 - Huli; Lior ;   et al. | 2022-07-28 |
Point-of-use dynamic concentration delivery system with high flow and high uniformity Grant 11,383,211 - Nasman , et al. July 12, 2 | 2022-07-12 |
Fabricating Three-dimensional Semiconductor Structures App 20220115399 - Chae; Soo Doo ;   et al. | 2022-04-14 |
Plasma treatment method to enhance surface adhesion for lithography Grant 11,243,465 - Park , et al. February 8, 2 | 2022-02-08 |
Extreme ultra-violet sensitivity reduction using shrink and growth method Grant 10,935,889 - Huli , et al. March 2, 2 | 2021-03-02 |
Point-of-use Dynamic Concentration Delivery System With High Flow And High Uniformity App 20200338510 - NASMAN; Ronald W. ;   et al. | 2020-10-29 |
Point-of-use Blending Of Rinse Solutions To Mitigate Pattern Collapse App 20200326628 - Huli; Lior ;   et al. | 2020-10-15 |
Selective atomic layer deposition (ALD) of protective caps to enhance extreme ultra-violet (EUV) etch resistance Grant 10,770,294 - O'Meara , et al. Sep | 2020-09-08 |
Dispense nozzle with a shielding device Grant 10,685,857 - Nasman , et al. | 2020-06-16 |
Selective Atomic Layer Deposition (ald) Of Protective Caps To Enhance Extreme Ultra-violet (euv) Etch Resistance App 20190393035 - O'Meara; David ;   et al. | 2019-12-26 |
High-purity dispense system Grant 10,403,501 - deVilliers , et al. Sep | 2019-09-03 |
High-precision dispense system with meniscus control Grant 10,354,872 - deVilliers , et al. July 16, 2 | 2019-07-16 |
Plasma Treatment Method To Enhance Surface Adhesion For Lithography App 20190187556 - Park; Wanjae ;   et al. | 2019-06-20 |
Methods of spin-on deposition of metal oxides Grant 10,141,183 - Mohanty , et al. Nov | 2018-11-27 |
Dispense Nozzle With A Shielding Device App 20180254202 - Nasman; Ronald ;   et al. | 2018-09-06 |
Method for etch-based planarization of a substrate Grant 9,991,133 - Pereira , et al. June 5, 2 | 2018-06-05 |
High-Purity Dispense System App 20180047562 - deVilliers; Anton J. ;   et al. | 2018-02-15 |
Method For Etch-based Planarization Of A Substrate App 20180047584 - Pereira; Cheryl ;   et al. | 2018-02-15 |
High-Precision Dispense System With Meniscus Control App 20180047563 - deVilliers; Anton J. ;   et al. | 2018-02-15 |
EUV resist etch durability improvement and pattern collapse mitigation Grant 9,791,779 - Huli October 17, 2 | 2017-10-17 |
Methods of Spin-on Deposition of Metal Oxides App 20170221704 - Mohanty; Nihar ;   et al. | 2017-08-03 |
Substrate backside texturing Grant 9,711,419 - Fonseca , et al. July 18, 2 | 2017-07-18 |
Dispense Nozzle With A Shielding Device App 20170110345 - Nasman; Ronald ;   et al. | 2017-04-20 |
Extreme Ultra-violet Sensitivity Reduction Using Shrink And Growth Method App 20160334709 - Huli; Lior ;   et al. | 2016-11-17 |
Substrate Backside Texturing App 20160141169 - Fonseca; Carlos A. ;   et al. | 2016-05-19 |
Euv Resist Etch Durability Improvement And Pattern Collapse Mitigation App 20160109804 - Huli; Lior | 2016-04-21 |
Substrate backside texturing Grant 9,281,251 - Fonseca , et al. March 8, 2 | 2016-03-08 |
Substrate Backside Texturing App 20160043007 - Fonseca; Carlos A. ;   et al. | 2016-02-11 |
EUV resist sensitivity reduction Grant 9,086,631 - Huli , et al. July 21, 2 | 2015-07-21 |
Track processing to remove organic films in directed self-assembly chemo-epitaxy applications Grant 8,975,009 - Somervell , et al. March 10, 2 | 2015-03-10 |
Substrate Backside Texturing App 20150044785 - FONSECA; Carlos A. ;   et al. | 2015-02-12 |
Euv Resist Sensitivity Reduction App 20140315135 - HULI; LIOR ;   et al. | 2014-10-23 |
Track Processing To Remove Organic Films In Directed Self-assembly Chemo-epitaxy Applications App 20140273472 - Somervell; Mark H. ;   et al. | 2014-09-18 |
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