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Patent applications and USPTO patent grants for Hul-Chun; Hsu.The latest application filed is for "wick structure of heat pipe".
Patent | Date |
---|---|
Wick structure of heat pipe Grant 7,134,485 - Hul-Chun November 14, 2 | 2006-11-14 |
Wick structure of heat pipe Grant 6,997,244 - Hul-Chun February 14, 2 | 2006-02-14 |
Wick structure of heat pipe App 20060011327 - Hul-Chun; Hsu | 2006-01-19 |
Wick Structure Of Heat Pipe App 20060011328 - Hul-Chun; Hsu | 2006-01-19 |
End surface structure of heat pipe for contact with a heat source Grant 6,973,964 - Hul-Chun December 13, 2 | 2005-12-13 |
Wick structure of heat pipes App 20050022980 - Hul-Chun, Hsu | 2005-02-03 |
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