Hui; Hon Chiu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hui; Hon Chiu.The latest application filed is for "rotary bonding tool which provides a large bond force".
- Hui; Hon Chiu - Shatin N/A HK
- Hui; Hon Chiu - Hong Kong CN
- Hui; Hon Chiu - Kwai Chung CN
| Patent | Date |
|---|---|
| Die bonder providing a large bonding force Grant 8,651,159 - Wong , et al. February 18, 2 | 2014-02-18 |
| Rotary bonding tool which provides a large bond force Grant 8,016,010 - Ng , et al. September 13, 2 | 2011-09-13 |
| Rotary Bonding Tool Which Provides A Large Bond Force App 20110048648 - NG; Yin Fun ; et al. | 2011-03-03 |
| Die Bonder Providing A Large Bonding Force App 20100314050 - WONG; Sun Kuen ; et al. | 2010-12-16 |
| Apparatus and method for calibration of a dispensing system Grant 7,204,960 - Hui , et al. April 17, 2 | 2007-04-17 |
| Dispensation of controlled quantities of material onto a substrate Grant 6,991,825 - Hui , et al. January 31, 2 | 2006-01-31 |
| Apparatus and method for calibration of a dispensing system App 20040175832 - Hui, Hon Chiu ; et al. | 2004-09-09 |
| Dispensation of controlled quantities of material onto a substrate App 20030209560 - Hui, Hon Chiu ; et al. | 2003-11-13 |
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