HUI; Dongxu
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUI; Dongxu.The latest application filed is for "boron-containing titanium-based composite powder for 3d printing and method of preparing same".
- HUI; Dongxu - Xi'an CN
| Patent | Date |
|---|---|
| Boron-containing Titanium-based Composite Powder For 3d Printing And Method Of Preparing Same App 20200399135 - LI; Shufeng ; et al. | 2020-12-24 |
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