Hui; Dave
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hui; Dave.The latest application filed is for "fine silver particle dispersion".
- Hui; Dave - Bristol GB
- Hui; Dave - Bristol South Gloucestershire GB
| Patent | Date |
|---|---|
| Fine silver particle dispersion Grant 11,450,447 - Hui , et al. September 20, 2 | 2022-09-20 |
| Fine silver particle dispersion Grant 11,441,010 - Teragawa , et al. September 13, 2 | 2022-09-13 |
| Fine silver particle dispersion Grant 11,227,702 - Teragawa , et al. January 18, 2 | 2022-01-18 |
| Fine silver particle dispersion Grant 11,072,715 - Hui , et al. July 27, 2 | 2021-07-27 |
| Fine Silver Particle Dispersion App 20200321139 - TERAGAWA; Shingo ; et al. | 2020-10-08 |
| Fine Silver Particle Dispersion App 20200317935 - Hui; Dave ; et al. | 2020-10-08 |
| Fine Silver Particle Dispersion App 20190100641 - TERAGAWA; Shingo ; et al. | 2019-04-04 |
| Fine Silver Particle Dispersion App 20190103200 - Hui; Dave ; et al. | 2019-04-04 |
| Flowable compositions with low temperature curing to form thermally conductive pathways in electronics type applications and methods relating thereto Grant 9,840,651 - Hui , et al. December 12, 2 | 2017-12-12 |
| Conductive metal composition Grant 9,245,665 - Hui , et al. January 26, 2 | 2016-01-26 |
| Conductive metal ink Grant 9,245,664 - Kirk , et al. January 26, 2 | 2016-01-26 |
| Flowable Compositions With Low Temperature Curing To Form Thermally Conductive Pathways In Electronics Type Applications And Methods Relating Thereto App 20160009976 - HUI; DAVE ; et al. | 2016-01-14 |
| Compositions For High Speed Printing Of Conductive Materials For Electronic Circuitry Type Applications And Methods Relating Thereto App 20150240103 - FARNHAM; WILLIAM BROWN ; et al. | 2015-08-27 |
| Conductive Compositions And Methods Relating Thereto App 20140349025 - HUI; DAVE ; et al. | 2014-11-27 |
| Conductive Metal Composition App 20140170334 - HUI; DAVE ; et al. | 2014-06-19 |
| Conductive Metal Ink App 20130142963 - KIRK; DANIEL ; et al. | 2013-06-06 |
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