Hui; Chong Chin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hui; Chong Chin.The latest application filed is for "redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements".

Company Profile

0.22.27

Hui; Chong Chin - Singapore N/A SG
Hui; Chong Chin - Braddel View SG
Hui; Chong Chin - Braddell View SG
Hui, Chong Chin - Tao Payoh SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Carrierless chip package for integrated circuit devices, and methods of making same Grant 9,673,121 - Corisis , et al. June 6, 2	2017-06-06
Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements Grant 8,749,050 - Lee , et al. June 10, 2	2014-06-10
Interposer structure with embedded capacitor structure, and methods of making same Grant 8,653,625 - Hui , et al. February 18, 2	2014-02-18
Redistribution Elements And Semiconductor Device Packages Including Semiconductor Devices And Redistribution Elements App 20130292810 - Lee; Choon Kuan ; et al.	2013-11-07
Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices Grant 8,486,825 - Lee , et al. July 16, 2	2013-07-16
Methods Of Forming Semiconductor Device Packages Including A Semiconductor Device And A Redistribution Element, Methods Of Forming Redistribution Elements And Methods For Packaging Semiconductor Devices App 20130059419 - Kuan; Lee Choon ; et al.	2013-03-07
Semiconductor device packages including a semiconductor device and a redistribution element Grant 8,288,859 - Lee , et al. October 16, 2	2012-10-16
Stacked die package for peripheral and center device pad layout device Grant 8,269,328 - Kim , et al. September 18, 2	2012-09-18
Semiconductor device packages and assemblies Grant 8,125,092 - Corisis , et al. February 28, 2	2012-02-28
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20110266701 - Wan; Ng Hong ; et al.	2011-11-03
Semiconductor Device Packages Including A Semiconductor Device And A Redistribution Element App 20110266696 - Lee; Choon Kuan ; et al.	2011-11-03
Stacked Die Package For Peripheral And Center Device Pad Layout Device App 20110062583 - Kim; Dalson Ye Seng ; et al.	2011-03-17
Packaged Ic Device Comprising An Embedded Flex Circuit, And Methods Of Making The Same App 20100320578 - Lee; Choon Kuan ; et al.	2010-12-23
Stacked die package for peripheral and center device pad layout device Grant 7,846,768 - Kim , et al. December 7, 2	2010-12-07
Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Grant 7,816,778 - Lee , et al. October 19, 2	2010-10-19
Build-up-package for integrated circuit devices, and methods of making same Grant 7,691,682 - Wan , et al. April 6, 2	2010-04-06
Upgradeable And Repairable Semiconductor Packages And Methods App 20090236735 - Corisis; David J. ; et al.	2009-09-24
Board-on-chip Type Substrates With Conductive Traces In Multiple Planes, Semiconductor Device Packages Including Such Substrates, And Associated Methods App 20090218677 - Kuan; Lee Choon ; et al.	2009-09-03
Carrierless chip package for integrated circuit devices, and methods of making same Grant 7,504,285 - Corisis , et al. March 17, 2	2009-03-17
Stacked Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20090011541 - Corisis; David J. ; et al.	2009-01-08
Novel Build-up-package For Integrated Circuit Devices, And Methods Of Making Same App 20090001551 - Wan; Ng Hong ; et al.	2009-01-01
Stacked Die Package For Peripheral And Center Device Pad Layout Device App 20080280396 - Kim; Dalson Ye Seng ; et al.	2008-11-13
Interposer Structure With Embedded Capacitor Structure, And Methods Of Making Same App 20080224292 - Hui; Chong Chin ; et al.	2008-09-18
Stacked die package for peripheral and center device pad layout device Grant 7,425,463 - Kim , et al. September 16, 2	2008-09-16
Packaged Ic Device Comprising An Embedded Flex Circuit, And Methods Of Making Same App 20080197460 - Lee; Choon Kuan ; et al.	2008-08-21
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20080136001 - Corisis; David J. ; et al.	2008-06-12
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20070249100 - Corisis; David J. ; et al.	2007-10-25
Carrierless chip package for integrated circuit devices, and methods of making same App 20070216033 - Corisis; David J. ; et al.	2007-09-20
Stacked device package for peripheral and center device pad layout device Grant 7,205,656 - Kim , et al. April 17, 2	2007-04-17
Stacked microelectronic devices and methods for manufacturing microelectronic devices App 20070045862 - Corisis; David J. ; et al.	2007-03-01
Stacked die package for peripheral and center device pad layout device App 20060246622 - Kim; Dalson Ye Seng ; et al.	2006-11-02
Stacked device package for peripheral and center device pad layout device App 20060197206 - Kim; Dalson Ye Seng ; et al.	2006-09-07
Method for fabricating a semiconductor package with multi layered leadframe Grant 6,972,214 - Kuan , et al. December 6, 2	2005-12-06
Method for fabricating a semiconductor package with multi layered leadframe App 20050087847 - Kuan, Lee Choon ; et al.	2005-04-28
Method for fabricating semiconductor component with multi layered leadframe Grant 6,835,599 - Kuan , et al. December 28, 2	2004-12-28
Semiconductor component having multi layered leadframe Grant 6,784,525 - Kuan , et al. August 31, 2	2004-08-31
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged Grant 6,781,248 - Hui , et al. August 24, 2	2004-08-24
Method for fabricating semiconductor component with multi layered leadframe App 20040130010 - Kuan, Lee Choon ; et al.	2004-07-08
Semiconductor package having multi-layer leadframe and method of fabrication App 20040080046 - Choon Kuan, Lee ; et al.	2004-04-29
Method for fabricating BOC semiconductor package Grant 6,638,792 - Hui , et al. October 28, 2	2003-10-28
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die Grant 6,507,114 - Hui , et al. January 14, 2	2003-01-14
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged App 20020172024 - Hui, Chong Chin ; et al.	2002-11-21
Method for fabricating BOC semiconductor package App 20020102831 - Hui, Chong Chin ; et al.	2002-08-01
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die App 20020100976 - Hui, Chong Chin ; et al.	2002-08-01
Die pad for integrated circuits App 20020070436 - Hui, Chong Chin ; et al.	2002-06-13

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