Hugo; Stephen M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hugo; Stephen M..The latest application filed is for "heat sinks using memory shaping materials".

Company Profile

12.19.16

Hugo; Stephen M. - Stewartville MN
Hugo; Stephen M. - Rochester MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Detecting and correcting deficiencies in surface conditions for bonding applications Grant 11,268,809 - Bennett , et al. March 8, 2	2022-03-08
Tool for shaping contact tab interconnects at a circuit card edge Grant 11,245,238 - Younger , et al. February 8, 2	2022-02-08
Heat sinks using memory shaping materials Grant 11,175,100 - Lewis , et al. November 16, 2	2021-11-16
Heat Sinks Using Memory Shaping Materials App 20200355442 - Lewis; Theron L. ; et al.	2020-11-12
Facilitating reliable circuit board press-fit connector assembly fabrication Grant 10,677,856 - Hugo , et al.	2020-06-09
Method of making integrated die paddle structures for bottom terminated components Grant 10,679,926 - Hugo , et al.	2020-06-09
Detecting And Correcting Deficiencies In Surface Conditions For Bonding Applications App 20200141726 - BENNETT; JENNIFER ; et al.	2020-05-07
Tool For Shaping Contact Tab Interconnects At A Circuit Card Edge App 20200119507 - YOUNGER; Timothy P. ; et al.	2020-04-16
Dye and pry process for removing quad flat no-lead packages and bottom termination components Grant 10,593,601 - Bartsch , et al.	2020-03-17
Electromagnetic shielding of heat sinks with shape-memory alloy grounding Grant 10,575,448 - Lewis , et al. Feb	2020-02-25
Facilitating Reliable Circuit Board Press-fit Connector Assembly Fabrication App 20200057102 - HUGO; Stephen M. ; et al.	2020-02-20
Integrated die paddle structures for bottom terminated components Grant 10,559,522 - Hugo , et al. Feb	2020-02-11
Dye And Pry Process For Removing Quad Flat No-lead Packages And Bottom Termination Components App 20190157169 - Bartsch; Tim A. ; et al.	2019-05-23
Dye and pry process for removing quad flat no-lead packages and bottom termination components Grant 10,262,907 - Bartsch , et al.	2019-04-16
Testing printed circuit board assembly Grant 10,168,383 - Hoffmeyer , et al. J	2019-01-01
Testing Printed Circuit Board Assembly App 20180328980 - Hoffmeyer; Mark K. ; et al.	2018-11-15
Integrated Die Paddle Structures For Bottom Terminated Components App 20180301399 - Hugo; Stephen M. ; et al.	2018-10-18
Integrated die paddle structures for bottom terminated components Grant 10,083,894 - Hugo , et al. September 25, 2	2018-09-25
Laminate bond strength detection Grant 10,073,134 - Hugo , et al. September 11, 2	2018-09-11
Testing printed circuit board assembly Grant 10,048,312 - Hoffmeyer , et al. August 14, 2	2018-08-14
Increasing solder hole-fill in a printed circuit board assembly Grant 9,986,649 - Hugo , et al. May 29, 2	2018-05-29
Laminate bond strength detection Grant 9,910,085 - Hugo , et al. March 6, 2	2018-03-06
Integrated Die Paddle Structures For Bottom Terminated Components App 20180053711 - Hugo; Stephen M. ; et al.	2018-02-22
Laminate Bond Strength Detection App 20180045773 - Hugo; Stephen M. ; et al.	2018-02-15
Laminate Bond Strength Detection App 20170192051 - Hugo; Stephen M. ; et al.	2017-07-06
Integrated Die Paddle Structures For Bottom Terminated Components App 20170179004 - Hugo; Stephen M. ; et al.	2017-06-22
Increasing solder hole-fill in a printed circuit board assembly Grant 9,662,732 - Hugo , et al. May 30, 2	2017-05-30
Increasing Solder Hole-fill In A Printed Circuit Board Assembly App 20170142845 - HUGO; STEPHEN M. ; et al.	2017-05-18
Increasing Solder Hole-fill In A Printed Circuit Board Assembly App 20160297022 - Hugo; Stephen M. ; et al.	2016-10-13
Increasing solder hole-fill in a printed circuit board assembly Grant 9,427,828 - Hugo , et al. August 30, 2	2016-08-30
Increasing Solder Hole-fill In A Printed Circuit Board Assembly App 20160044791 - Hugo; Stephen M. ; et al.	2016-02-11
Heat transfer device for wave soldering Grant 9,232,664 - Hugo , et al. January 5, 2	2016-01-05
Heat transfer device for wave soldering Grant 9,148,962 - Hugo , et al. September 29, 2	2015-09-29
Heat Transfer Device For Wave Soldering App 20140182909 - Hugo; Stephen M. ; et al.	2014-07-03
Heat Transfer Device For Wave Soldering App 20140183250 - Hugo; Stephen M. ; et al.	2014-07-03

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