Patent | Date |
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Detecting and correcting deficiencies in surface conditions for bonding applications Grant 11,268,809 - Bennett , et al. March 8, 2 | 2022-03-08 |
Tool for shaping contact tab interconnects at a circuit card edge Grant 11,245,238 - Younger , et al. February 8, 2 | 2022-02-08 |
Heat sinks using memory shaping materials Grant 11,175,100 - Lewis , et al. November 16, 2 | 2021-11-16 |
Heat Sinks Using Memory Shaping Materials App 20200355442 - Lewis; Theron L. ;   et al. | 2020-11-12 |
Facilitating reliable circuit board press-fit connector assembly fabrication Grant 10,677,856 - Hugo , et al. | 2020-06-09 |
Method of making integrated die paddle structures for bottom terminated components Grant 10,679,926 - Hugo , et al. | 2020-06-09 |
Detecting And Correcting Deficiencies In Surface Conditions For Bonding Applications App 20200141726 - BENNETT; JENNIFER ;   et al. | 2020-05-07 |
Tool For Shaping Contact Tab Interconnects At A Circuit Card Edge App 20200119507 - YOUNGER; Timothy P. ;   et al. | 2020-04-16 |
Dye and pry process for removing quad flat no-lead packages and bottom termination components Grant 10,593,601 - Bartsch , et al. | 2020-03-17 |
Electromagnetic shielding of heat sinks with shape-memory alloy grounding Grant 10,575,448 - Lewis , et al. Feb | 2020-02-25 |
Facilitating Reliable Circuit Board Press-fit Connector Assembly Fabrication App 20200057102 - HUGO; Stephen M. ;   et al. | 2020-02-20 |
Integrated die paddle structures for bottom terminated components Grant 10,559,522 - Hugo , et al. Feb | 2020-02-11 |
Dye And Pry Process For Removing Quad Flat No-lead Packages And Bottom Termination Components App 20190157169 - Bartsch; Tim A. ;   et al. | 2019-05-23 |
Dye and pry process for removing quad flat no-lead packages and bottom termination components Grant 10,262,907 - Bartsch , et al. | 2019-04-16 |
Testing printed circuit board assembly Grant 10,168,383 - Hoffmeyer , et al. J | 2019-01-01 |
Testing Printed Circuit Board Assembly App 20180328980 - Hoffmeyer; Mark K. ;   et al. | 2018-11-15 |
Integrated Die Paddle Structures For Bottom Terminated Components App 20180301399 - Hugo; Stephen M. ;   et al. | 2018-10-18 |
Integrated die paddle structures for bottom terminated components Grant 10,083,894 - Hugo , et al. September 25, 2 | 2018-09-25 |
Laminate bond strength detection Grant 10,073,134 - Hugo , et al. September 11, 2 | 2018-09-11 |
Testing printed circuit board assembly Grant 10,048,312 - Hoffmeyer , et al. August 14, 2 | 2018-08-14 |
Increasing solder hole-fill in a printed circuit board assembly Grant 9,986,649 - Hugo , et al. May 29, 2 | 2018-05-29 |
Laminate bond strength detection Grant 9,910,085 - Hugo , et al. March 6, 2 | 2018-03-06 |
Integrated Die Paddle Structures For Bottom Terminated Components App 20180053711 - Hugo; Stephen M. ;   et al. | 2018-02-22 |
Laminate Bond Strength Detection App 20180045773 - Hugo; Stephen M. ;   et al. | 2018-02-15 |
Laminate Bond Strength Detection App 20170192051 - Hugo; Stephen M. ;   et al. | 2017-07-06 |
Integrated Die Paddle Structures For Bottom Terminated Components App 20170179004 - Hugo; Stephen M. ;   et al. | 2017-06-22 |
Increasing solder hole-fill in a printed circuit board assembly Grant 9,662,732 - Hugo , et al. May 30, 2 | 2017-05-30 |
Increasing Solder Hole-fill In A Printed Circuit Board Assembly App 20170142845 - HUGO; STEPHEN M. ;   et al. | 2017-05-18 |
Increasing Solder Hole-fill In A Printed Circuit Board Assembly App 20160297022 - Hugo; Stephen M. ;   et al. | 2016-10-13 |
Increasing solder hole-fill in a printed circuit board assembly Grant 9,427,828 - Hugo , et al. August 30, 2 | 2016-08-30 |
Increasing Solder Hole-fill In A Printed Circuit Board Assembly App 20160044791 - Hugo; Stephen M. ;   et al. | 2016-02-11 |
Heat transfer device for wave soldering Grant 9,232,664 - Hugo , et al. January 5, 2 | 2016-01-05 |
Heat transfer device for wave soldering Grant 9,148,962 - Hugo , et al. September 29, 2 | 2015-09-29 |
Heat Transfer Device For Wave Soldering App 20140182909 - Hugo; Stephen M. ;   et al. | 2014-07-03 |
Heat Transfer Device For Wave Soldering App 20140183250 - Hugo; Stephen M. ;   et al. | 2014-07-03 |