Huffman; Craig

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huffman; Craig.The latest application filed is for "dual metal gates using one metal to alter work function of another metal".

Company Profile

0.7.8

Huffman; Craig - Ashtabula OH
Huffman; Craig - Krugerville TX
Huffman; Craig - Ash Tavula OH
Huffman; Craig - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Variable pattern hanging microphone system with remote polar control Grant 8,483,412 - Statham , et al. July 9, 2	2013-07-09
Dual Metal Gates Using One Metal To Alter Work Function Of Another Metal App 20120256270 - Lee; Byoung H. ; et al.	2012-10-11
Dual metal gates using one metal to alter work function of another metal Grant 8,236,686 - Lee , et al. August 7, 2	2012-08-07
Mitigation of gate to contact capacitance in CMOS flow Grant 8,119,470 - Ekbote , et al. February 21, 2	2012-02-21
Variable Pattern Hanging Microphone System With Remote Polar Control App 20100296674 - Statham; Kelly ; et al.	2010-11-25
Formation of fully silicided gate with oxide barrier on the source/drain silicide regions Grant 7,737,015 - Kohli , et al. June 15, 2	2010-06-15
Dual Metal Gates Using One Metal To Alter Work Function Of Another Metal App 20090294867 - Lee; Byoung H. ; et al.	2009-12-03
Mitigation of gate to contact capacitance in CMOS flow App 20080230815 - Ekbote; Shashank Sureshchandra ; et al.	2008-09-25
Formation of fully silicided gate with oxide barrier on the source/drain silicide regions App 20080206988 - Kohli; Puneet ; et al.	2008-08-28
Gate electrode for FinFET device Grant 7,094,650 - Chaudhary , et al. August 22, 2	2006-08-22
Gate Electrode For Finfet Device App 20060160312 - Chaudhary; Nirmal ; et al.	2006-07-20
Etch back of interconnect dielectrics App 20040169279 - Farber, David G. ; et al.	2004-09-02
Etch Back Of Interconnect Dielectrics App 20040169280 - Farber, David G. ; et al.	2004-09-02
Etch back of interconnect dielectrics Grant 6,780,756 - Farber , et al. August 24, 2	2004-08-24

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