Huey, Sidney
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huey, Sidney.The latest application filed is for "cmp platen with patterned surface".
- Huey, Sidney - Milpitas CA
- Huey; Sidney - Oakland CA
| Patent | Date |
|---|---|
| CMP platen with patterned surface App 20040053566 - Tolles, Robert D. ; et al. | 2004-03-18 |
| CMP platen with patterned surface Grant 6,592,438 - Tolles , et al. July 15, 2 | 2003-07-15 |
| Carrier head for providing a polishing slurry Grant 6,527,624 - Tolles , et al. March 4, 2 | 2003-03-04 |
| Utility wafer for chemical mechanical polishing Grant 6,361,405 - David , et al. March 26, 2 | 2002-03-26 |
| Utility wafer for chemical mechanical polishing App 20020028635 - David, Jeffrey D. ; et al. | 2002-03-07 |
| Conditioning fixed abrasive articles Grant 6,322,427 - Li , et al. November 27, 2 | 2001-11-27 |
| CMP platen with patterned surface App 20010005667 - Tolles, Robert D. ; et al. | 2001-06-28 |
| Method of post CMP defect stability improvement Grant 6,220,941 - Fishkin , et al. April 24, 2 | 2001-04-24 |
| CMP platen with patterned surface Grant 6,220,942 - Tolles , et al. April 24, 2 | 2001-04-24 |
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