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Patent applications and USPTO patent grants for Huettner; Steven E..The latest application filed is for "three-dimensional microstructures".
Patent | Date |
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CTE compensation for wafer-level and chip-scale packages and assemblies Grant 10,847,469 - Vanhille , et al. November 24, 2 | 2020-11-24 |
Three-dimensional Microstructures App 20200076042 - Sherrer; David ;   et al. | 2020-03-05 |
Three-dimensional microstructures Grant 10,305,158 - Sherrer , et al. | 2019-05-28 |
Microwave Digital Phase Shifters App 20190020088 - Huettner; Steven E ;   et al. | 2019-01-17 |
Three-dimensional Microstructures App 20180069287 - Sherrer; David ;   et al. | 2018-03-08 |
Three-dimensional microstructures Grant 9,843,084 - Sherrer , et al. December 12, 2 | 2017-12-12 |
Cte Compensation For Wafer-level And Chip-scale Packages And Assemblies App 20170330836 - Vanhille; Kenneth J. ;   et al. | 2017-11-16 |
Three-dimensional Microstructures App 20160336639 - Sherrer; David ;   et al. | 2016-11-17 |
Three-dimensional microstructures Grant 9,413,052 - Sherrer , et al. August 9, 2 | 2016-08-09 |
Three-dimensional Microstructures App 20150380795 - Sherrer; David ;   et al. | 2015-12-31 |
Three-dimensional microstructures Grant 9,136,575 - Sherrer , et al. September 15, 2 | 2015-09-15 |
Smart power combiner Grant 8,952,752 - Huettner February 10, 2 | 2015-02-10 |
Three-dimensional Microstructures App 20140218131 - Sherrer; David ;   et al. | 2014-08-07 |
Multi-layer radial power divider/combiner Grant 8,319,583 - Huettner November 27, 2 | 2012-11-27 |
Multi-Layer Radial Power Divider/Combiner App 20110043301 - Huettner; Steven E. | 2011-02-24 |
Voltage variable attenuator Grant 5,349,312 - Huettner , et al. September 20, 1 | 1994-09-20 |
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