Huemoeller; Ronald P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huemoeller; Ronald P..The latest application filed is for "printed circuit board with integral heat sink for semiconductor package".
- Huemoeller; Ronald P. - Chandler AZ
| Patent | Date |
|---|---|
| Embedded electronic component package fabrication method Grant 7,977,163 - Huemoeller , et al. July 12, 2 | 2011-07-12 |
| Method of making a chip carrier package using laser ablation Grant 6,660,559 - Huemoeller , et al. December 9, 2 | 2003-12-09 |
| Printed circuit board with integral heat sink for semiconductor package Grant 6,507,102 - Juskey , et al. January 14, 2 | 2003-01-14 |
| Printed circuit board with heat spreader and method of making Grant 6,448,509 - Huemoeller September 10, 2 | 2002-09-10 |
| Printed circuit board with integral heat sink for semiconductor package App 20020043402 - Juskey, Frank J. ; et al. | 2002-04-18 |
| Moisture-resistant integrated circuit chip package and method Grant 6,372,540 - Huemoeller April 16, 2 | 2002-04-16 |
| Low-cost printed circuit board with integral heat sink for semiconductor package Grant 6,337,228 - Juskey , et al. January 8, 2 | 2002-01-08 |
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