Huelsmann; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huelsmann; Thomas.The latest application filed is for "solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound".

Company Profile

1.4.7

Huelsmann; Thomas - Berlin DE
Huelsmann; Thomas - Garching DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound Grant 10,219,391 - Sparing , et al. Feb	2019-02-26
Chuck, in particular for use in a mask aligner Grant 9,824,909 - Hansen , et al. November 21, 2	2017-11-21
Solution And Process For The Pre-treatment Of Copper Surfaces Using An N-alkoxylated Adhesion-promoting Compound App 20170086305 - SPARING; Christian ; et al.	2017-03-23
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound Grant 9,504,161 - Sparing , et al. November 22, 2	2016-11-22
Chuck, In Particular For Use In A Mask Aligner App 20150294890 - HANSEN; Sven ; et al.	2015-10-15
Method For Providing Organic Resist Adhesion To A Copper Or Copper Alloy Surface App 20140141169 - Huelsmann; Thomas ; et al.	2014-05-22
Solution And Process For The Pre-treatment Of Copper Surfaces Using An N-alkoxylated Adhesion-promoting Compound App 20140076461 - Sparing; Christian ; et al.	2014-03-20
Multilayer Printed Circuit Board Manufacture App 20120037312 - Sparing; Christian ; et al.	2012-02-16

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