Hudson; Guy F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hudson; Guy F..The latest application filed is for "methods for selective removal of material from wafer alignment marks".

Company Profile

0.31.17

Hudson; Guy F. - Boise ID
Hudson; Guy F. - Tucson AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and methods for selective removal of material from wafer alignment marks Grant 8,053,371 - Zahorik , et al. November 8, 2	2011-11-08
Contact integration method Grant 7,294,570 - Elliott , et al. November 13, 2	2007-11-13
Methods for selective removal of material from wafer alignment marks App 20070207613 - Zahorik; Russell C. ; et al.	2007-09-06
Methods for selective removal of material from wafer alignment marks Grant 7,244,681 - Zahorik, legal representative , et al. July 17,	2007-07-17
Method for controlling pH during planarization and cleaning of microelectronic substrates Grant 7,214,125 - Sharples , et al. May 8, 2	2007-05-08
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers Grant RE39,413 - Hudson , et al. November 28, 2	2006-11-28
Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 7,122,475 - Hudson October 17, 2	2006-10-17
Method for post chemical-mechanical planarization cleaning of semiconductor wafers Grant 7,045,017 - Gonzales , et al. May 16, 2	2006-05-16
Method For Controlling Ph During Planarization And Cleaning Of Microelectronic Substrates App 20060011585 - Sharples; Judson R. ; et al.	2006-01-19
Method for controlling pH during planarization and cleaning of microelectronic substrates Grant 6,913,523 - Sharples , et al. July 5, 2	2005-07-05
Apparatus for selective removal of material from wafer alignment marks Grant 6,889,698 - Zahorik , et al. May 10, 2	2005-05-10
Systems for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies App 20040229551 - Hudson, Guy F.	2004-11-18
Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate Grant 6,803,316 - Hudson , et al. October 12, 2	2004-10-12
Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies App 20040198194 - Hudson, Guy F.	2004-10-07
Apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies App 20040198195 - Hudson, Guy F.	2004-10-07
Method for controlling PH during planarization and cleaning of microelectronic substrates App 20040192174 - Sharples, Judson R. ; et al.	2004-09-30
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 6,794,289 - Hudson September 21, 2	2004-09-21
Contact integration method App 20040180535 - Elliott, Richard L. ; et al.	2004-09-16
Method for post chemical-mechanical planarization cleaning of semiconductor wafers App 20040089326 - Gonzales, David ; et al.	2004-05-13
Method for controlling pH during planarization and cleaning of microelectronic substrates Grant 6,716,089 - Sharples , et al. April 6, 2	2004-04-06
Contact integration method Grant 6,713,384 - Elliott , et al. March 30, 2	2004-03-30
Methods for selective removal of material from wafer alignment marks App 20040038543 - Zahorik, Russell C. ; et al.	2004-02-26
Polishing polymer surfaces on nonporous CMP pads App 20030207577 - Hudson, Guy F. ; et al.	2003-11-06
Method for post chemical-mechanical planarization cleaning of semiconductor wafers Grant 6,640,816 - Gonzales , et al. November 4, 2	2003-11-04
Method of removing material from a semiconductor substrate Grant 6,635,574 - Hudson , et al. October 21, 2	2003-10-21
Methods for selective removal of material from wafer alignment marks Grant 6,610,610 - Zahorik , et al. August 26, 2	2003-08-26
Contact integration article Grant 6,593,657 - Elliott , et al. July 15, 2	2003-07-15
Apparatus for selective removal of material from wafer alignment marks App 20030121538 - Zahorik, Russell C. ; et al.	2003-07-03
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies App 20020146907 - Hudson, Guy F.	2002-10-10
Method and apparatus for selective removal of material from wafer alignment marks App 20020144720 - Zahorik, Russell C. ; et al.	2002-10-10
Apparatus for controlling PH during planarization and cleaning of microelectronic substrates Grant 6,368,194 - Sharples , et al. April 9, 2	2002-04-09
Method and apparatus for selective removal of material from wafer alignment marks App 20020025687 - Zahorik, Russell C. ; et al.	2002-02-28
Method and apparatus for controlling pH during planarization and cleaning of microelectronic substrates App 20020019197 - Sharples, Judson R. ; et al.	2002-02-14
Method for post chemical-mechanical planarization cleaning of semiconductor wafers App 20020011255 - Gonzales, David ; et al.	2002-01-31
Method for post chemical-mechanical planarization cleaning of semiconductor wafers Grant 6,273,101 - Gonzales , et al. August 14, 2	2001-08-14
Polishing polymer surfaces on non-porous CMP pads App 20010007796 - Hudson, Guy F. ; et al.	2001-07-12
Method and apparatus for predicting process characteristics of polyurethane pads Grant 6,114,706 - Meikle , et al. September 5, 2	2000-09-05
Method and apparatus for selective removal of material from wafer alignment marks Grant 6,103,636 - Zahorik, deceased , et al. August 15, 2	2000-08-15
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers Grant 6,057,602 - Hudson , et al. May 2, 2	2000-05-02
Megasonic cleaning methods and apparatus Grant 6,006,765 - Skrovan , et al. December 28, 1	1999-12-28
Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers Grant 5,976,000 - Hudson November 2, 1	1999-11-02
Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad Grant 5,972,792 - Hudson October 26, 1	1999-10-26
Method for post chemical-mechanical planarization cleaning of semiconductor wafers Grant 5,894,852 - Gonzales , et al. April 20, 1	1999-04-20
Megasonic cleaning methods and apparatus Grant 5,849,091 - Skrovan , et al. December 15, 1	1998-12-15
Wafer backing member for mechanical and chemical-mechanical planarization of substrates Grant 5,830,806 - Hudson , et al. November 3, 1	1998-11-03
Method for post chemical-mechanical planarization cleaning of semiconductor wafers Grant 5,679,169 - Gonzales , et al. October 21, 1	1997-10-21
Quality control method for detecting defective polishing pads used in chemical-mechanical planarization of semiconductor wafers Grant 5,650,619 - Hudson July 22, 1	1997-07-22
Tape cartridge tape path Grant 5,297,755 - Felde , et al. March 29, 1	1994-03-29

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