Hubner; Holger

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hubner; Holger.The latest application filed is for "connecting element for a multi-chip module and multi-chip module".

Company Profile

0.17.12

Hubner; Holger - Baldham DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Connecting element for a multi-chip module and multi-chip module Grant 9,301,396 - Hubner , et al. March 29, 2	2016-03-29
Connecting Element for a Multi-Chip Module and Multi-Chip Module App 20140291003 - Hubner; Holger ; et al.	2014-10-02
Protected chip stack Grant 7,436,072 - Hubner , et al. October 14, 2	2008-10-14
Device and method for soldering contacts on semiconductor chips Grant 7,389,903 - Bergmann , et al. June 24, 2	2008-06-24
Component Grant 7,335,582 - Hubner February 26, 2	2008-02-26
Method for diffusion soldering App 20070205253 - Hubner; Holger	2007-09-06
Method for producing chip stacks Grant 7,253,530 - Hubner August 7, 2	2007-08-07
Semiconductor chip stack Grant 7,229,851 - Hubner June 12, 2	2007-06-12
Protected chip stack App 20060279002 - Hubner; Holger ; et al.	2006-12-14
Method for producing chip stacks App 20060055051 - Hubner; Holger	2006-03-16
Semiconductor chip stack App 20060001177 - Hubner; Holger	2006-01-05
Electronic component including a housing and a substrate Grant 6,930,383 - Hacke , et al. August 16, 2	2005-08-16
Method for contact-connecting an electrical component to a substrate having a conductor structure Grant 6,915,945 - Hubner July 12, 2	2005-07-12
Semiconductor component having a material reinforced contact area Grant 6,906,370 - Hubner , et al. June 14, 2	2005-06-14
Component App 20050121801 - Hubner, Holger	2005-06-09
Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent Grant 6,872,464 - Hubner , et al. March 29, 2	2005-03-29
Device and method for soldering contacts on semiconductor chips App 20040240865 - Bergmann, Robert ; et al.	2004-12-02
Method for contact-connecting an electrical component to a substrate having a conductor structure App 20040099366 - Hubner, Holger	2004-05-27
Method for aligning structures on a semiconductor substrate Grant 6,709,949 - Hubner March 23, 2	2004-03-23
Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent App 20040025976 - Hubner, Holger ; et al.	2004-02-12
Method for aligning structures on a semiconductor substrate App 20030171008 - Hubner, Holger	2003-09-11
Integrated circuit arrangement with a number of structural elements and method for the production thereof Grant 6,597,053 - Anthofer , et al. July 22, 2	2003-07-22
Electronic component including a housing and a substrate App 20030116840 - Hacke, Hans-Jurgen ; et al.	2003-06-26
Semiconductor testing apparatus Grant 5,969,534 - Hubner , et al. October 19, 1	1999-10-19
Semiconductor component for vertical integration and manufacturing method Grant 5,930,596 - Klose , et al. July 27, 1	1999-07-27
Method for production of a three-dimensional circuit arrangement Grant 5,902,118 - Hubner May 11, 1	1999-05-11
Method for producing a three-dimensional circuit arrangement Grant 5,706,578 - Hubner January 13, 1	1998-01-13

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