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Patent applications and USPTO patent grants for HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD..The latest application filed is for "embedded silicon substrate fan-out type 3d packaging structure".
Patent | Date |
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Embedded silicon substrate fan-out type 3D packaging structure Grant 10,559,525 - Yu Feb | 2020-02-11 |
Embedded Silicon Substrate Fan-out Type 3d Packaging Structure App 20180366403 - YU; Daquan | 2018-12-20 |
Embedded Silicon Substrate Fan-out Type Packaging Structure And Manufacturing Method Therefor App 20180182727 - YU; Daquan | 2018-06-28 |
Wafer Level Packaging Structure Of High-pixel Image Sensor Chip App 20180138221 - WAN; Lixi ;   et al. | 2018-05-17 |
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