Huang; Ying-Jui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Ying-Jui.The latest application filed is for "bonding with pre-deoxide process and apparatus for performing the same".
Company Profile
7.38.46
- Huang; Ying-Jui - Zhubei City TW
- Huang; Ying-Jui - Zhubei TW
- Huang; Ying-Jui - Hsinchu County TW
- HUANG; YING-JUI - New Taipei TW
- Huang; Ying-Jui - Taipei TW
- Huang; Ying-Jui - Hsinchu Hsien TW
- Huang; Ying-Jui - Taipei City TW
- Huang; Ying-Jui - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Bonding with Pre-Deoxide Process and Apparatus for Performing the Same App 20220285310 - Yu; Chen-Hua ; et al. | 2022-09-08 |
| Bonding with pre-deoxide process and apparatus for performing the same Grant 11,342,302 - Yu , et al. May 24, 2 | 2022-05-24 |
| Aligning Bumps in Fan-Out Packaging Process App 20220130794 - Huang; Ying-Jui ; et al. | 2022-04-28 |
| Aligning bumps in fan-out packaging process Grant 11,217,555 - Huang , et al. January 4, 2 | 2022-01-04 |
| Method of fabricating semiconductor package structure Grant 11,139,177 - Hwang , et al. October 5, 2 | 2021-10-05 |
| Conductive micro pin Grant 11,101,232 - Huang , et al. August 24, 2 | 2021-08-24 |
| Semiconductor package structure Grant 11,094,561 - Hwang , et al. August 17, 2 | 2021-08-17 |
| Semiconductor Package Structure App 20200303214 - HWANG; Chien-Ling ; et al. | 2020-09-24 |
| Method Of Fabricating Semiconductor Package Structure App 20200303213 - HWANG; Chien-Ling ; et al. | 2020-09-24 |
| Method And Apparatus For Bonding Semiconductor Substrate App 20200227379 - Huang; Ying-Jui ; et al. | 2020-07-16 |
| Interconnect structure for semiconductor package and method of fabricating the interconnect structure Grant 10,679,866 - Hwang , et al. | 2020-06-09 |
| Moving Assistance Structure App 20200170136 - HUANG; YING-JUI | 2020-05-28 |
| Holding and release device for sliding chassis in server Grant 10,517,183 - Huang , et al. Dec | 2019-12-24 |
| Bonding with Pre-Deoxide Process and Apparatus for Performing the Same App 20190326251 - Yu; Chen-Hua ; et al. | 2019-10-24 |
| Protective housing and cover mechanism thereof Grant 10,306,962 - Huang | 2019-06-04 |
| Aligning Bumps In Fan-out Packaging Process App 20190103375 - Huang; Ying-Jui ; et al. | 2019-04-04 |
| Conductive Micro Pin App 20190074259 - HUANG; Ying-Jui ; et al. | 2019-03-07 |
| Fan fixing device Grant 10,151,326 - Huang Dec | 2018-12-11 |
| Method of manufacturing micro pins and isolated conductive micro pin Grant 10,115,690 - Huang , et al. October 30, 2 | 2018-10-30 |
| Integrated fan-out package and method of fabricating the same Grant 9,984,960 - Hwang , et al. May 29, 2 | 2018-05-29 |
| Pick-and-place tool for packaging process Grant 9,966,357 - Hwang , et al. May 8, 2 | 2018-05-08 |
| Electronic device Grant 9,904,810 - Huang February 27, 2 | 2018-02-27 |
| Fan fixing device Grant 9,898,057 - Huang February 20, 2 | 2018-02-20 |
| Docking station and mobile terminal with the same Grant 9,898,044 - Huang February 20, 2 | 2018-02-20 |
| Integrated Fan-out Package And Method Of Fabricating The Same App 20180025966 - Hwang; Chien-Ling ; et al. | 2018-01-25 |
| Docking Station And Mobile Terminal With The Same App 20170344062 - HUANG; YING-JUI | 2017-11-30 |
| Protective Housing And Cover Mechanism Thereof App 20170340078 - HUANG; YING-JUI | 2017-11-30 |
| Anti-tamper mechanism and electronic device using the same Grant 9,750,148 - Huang August 29, 2 | 2017-08-29 |
| Chip packages and methods of manufacture thereof Grant 9,735,130 - Pan , et al. August 15, 2 | 2017-08-15 |
| Anti-data theft structures and electronic devices with the same Grant 9,710,679 - Huang July 18, 2 | 2017-07-18 |
| Fan Fixing Device App 20170184126 - HUANG; YING-JUI | 2017-06-29 |
| Fan Fixing Device App 20170185114 - HUANG; YING-JUI | 2017-06-29 |
| Electronic Device App 20170154194 - HUANG; YING-JUI | 2017-06-01 |
| Anti-disassembly Protection Structure App 20170156224 - HUANG; YING-JUI ; et al. | 2017-06-01 |
| Anti-disassembly protection structure Grant 9,648,765 - Huang , et al. May 9, 2 | 2017-05-09 |
| Anti-data theft structures and electronic devices with the same Grant 9,614,307 - Fan , et al. April 4, 2 | 2017-04-04 |
| Cover operation mechanism Grant 9,560,778 - Huang January 31, 2 | 2017-01-31 |
| Anti-tamper device Grant 9,514,335 - Huang December 6, 2 | 2016-12-06 |
| Pillar bumps and process for making same Grant 9,449,931 - Lin , et al. September 20, 2 | 2016-09-20 |
| Method Of Manufacturing Micro Pins And Isolated Conductive Micro Pin App 20160254239 - HUANG; Ying-Jui ; et al. | 2016-09-01 |
| Chip packages and methods of manufacture thereof Grant 9,425,179 - Hwang , et al. August 23, 2 | 2016-08-23 |
| Interconnect Structure For Semiconductor Package And Method Of Fabricating The Interconnect Structure App 20160240451 - HWANG; Chien-Ling ; et al. | 2016-08-18 |
| Chip Packages And Methods Of Manufacture Thereof App 20160064355 - Pan; Kuo Lung ; et al. | 2016-03-03 |
| Anti-data Theft Structures And Electronic Devices With The Same App 20160066444 - FAN; CHIH-HSIANG ; et al. | 2016-03-03 |
| Chip Packages And Methods Of Manufacture Thereof App 20160064367 - Hwang; Chien Ling ; et al. | 2016-03-03 |
| Waterproof Door Structures And Devices With The Same App 20160060953 - HUANG; YING-JUI | 2016-03-03 |
| Anti-tamper Device App 20160055355 - HUANG; YING-JUI | 2016-02-25 |
| Anti-data Theft Structures And Electronic Devices With The Same App 20160055356 - HUANG; YING-JUI | 2016-02-25 |
| Anti-tamper device Grant 9,271,410 - Lin , et al. February 23, 2 | 2016-02-23 |
| Cover with an opening structure Grant 9,253,906 - Huang February 2, 2 | 2016-02-02 |
| Cover Operation Mechanism App 20150351269 - HUANG; YING-JUI | 2015-12-03 |
| Pick-and-Place Tool for Packaging Process App 20150333033 - Hwang; Chien Ling ; et al. | 2015-11-19 |
| Anti-tamper Device App 20150313027 - LIN; SHENG-YEN ; et al. | 2015-10-29 |
| Cover With An Opening Structure App 20150257292 - HUANG; YING-JUI | 2015-09-10 |
| Electrical charger for charging electronic device Grant 9,106,084 - Huang August 11, 2 | 2015-08-11 |
| Pick-and-place tool for packaging process Grant 9,105,760 - Hwang , et al. August 11, 2 | 2015-08-11 |
| Television system and method for managing applications therein Grant 8,964,120 - Huang , et al. February 24, 2 | 2015-02-24 |
| Pillar Bumps and Process for Making Same App 20140363966 - Lin; Cheng-Chung ; et al. | 2014-12-11 |
| Electrical Charger For Charging Electronic Device App 20140320066 - HUANG; YING-JUI | 2014-10-30 |
| Pillar bumps and process for making same Grant 8,823,166 - Lin , et al. September 2, 2 | 2014-09-02 |
| Innovative Multi-Purpose Dipping Plate App 20140048586 - Jang; Bor-Ping ; et al. | 2014-02-20 |
| Pick-and-Place Tool for Packaging Process App 20140030849 - Hwang; Chien Ling ; et al. | 2014-01-30 |
| Pick-and-place tool for packaging process Grant 8,546,802 - Hwang , et al. October 1, 2 | 2013-10-01 |
| Television System And Method For Managing Applications Therein App 20130194499 - Huang; Ying-Jui ; et al. | 2013-08-01 |
| Integrated Reflow and Cleaning Process and Apparatus for Performing the Same App 20130146647 - Liu; Chung-Shi ; et al. | 2013-06-13 |
| Pick-and-Place Tool for Packaging Process App 20130115752 - Hwang; Chien Ling ; et al. | 2013-05-09 |
| Thermal compressive bonding with separate die-attach and reflow processes Grant 8,317,077 - Hwang , et al. November 27, 2 | 2012-11-27 |
| Substrate Assembly Carrier Using Electrostatic Force App 20120227886 - Hsiao; Yi-Li ; et al. | 2012-09-13 |
| Method of forming semiconductor die Grant 8,258,055 - Hwang , et al. September 4, 2 | 2012-09-04 |
| Thermal compressive bond head Grant 8,177,862 - Hwang , et al. May 15, 2 | 2012-05-15 |
| Thermal Compressive Bonding with Separate Die-Attach and Reflow Processes App 20120111922 - Hwang; Chien Ling ; et al. | 2012-05-10 |
| Thermal Compressive Bond Head App 20120088362 - Hwang; Chien Ling ; et al. | 2012-04-12 |
| Pillar Bumps and Process for Making Same App 20120049346 - Lin; Cheng-Chung ; et al. | 2012-03-01 |
| Thermal compressive bonding with separate die-attach and reflow processes Grant 8,104,666 - Hwang , et al. January 31, 2 | 2012-01-31 |
| Conductive Bump For Semiconductor Substrate And Method Of Manufacture App 20120007230 - Hwang; Chien Ling ; et al. | 2012-01-12 |
| Method for fabricating a multilayer microstructure with balancing residual stress capability Grant 8,088,692 - Huang , et al. January 3, 2 | 2012-01-03 |
| Method For Fabricating A Multilayer Microstructure With Balancing Residual Stress Capability App 20110008962 - HUANG; Ying-Jui ; et al. | 2011-01-13 |
| Inclined Exposure Lithography System App 20100165316 - HUANG; YING-JUI ; et al. | 2010-07-01 |
| Inclined Exposure Lithography System App 20090161117 - HUANG; YING-JUI ; et al. | 2009-06-25 |
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