loadpatents
Patent applications and USPTO patent grants for Huang; Yao-Sheng.The latest application filed is for "dipoles in semiconductor devices".
Patent | Date |
---|---|
Dipoles In Semiconductor Devices App 20220310846 - Chang; Hsiang-Pi ;   et al. | 2022-09-29 |
Method For Forming Epitaxial Source/drain Features Using A Self-aligned Mask And Semiconductor Devices Fabricated Thereof App 20220278002 - Huang; Yao-Sheng ;   et al. | 2022-09-01 |
Spacer Structure For Semiconductor Device App 20220190137 - Wang; Chen-Han ;   et al. | 2022-06-16 |
Spacer structure for semiconductor device Grant 11,264,485 - Wang , et al. March 1, 2 | 2022-03-01 |
Semiconductor Device And Forming Method Thereof App 20210288166 - HUANG; Yao-Sheng ;   et al. | 2021-09-16 |
Semiconductor Structure App 20210280468 - CHANG; I-MING ;   et al. | 2021-09-09 |
Electronic apparatus with a temperature sensor Grant 11,039,554 - Pai , et al. June 15, 2 | 2021-06-15 |
Semiconductor structure and method of forming the same Grant 11,031,291 - Chang , et al. June 8, 2 | 2021-06-08 |
Semiconductor device Grant 11,024,723 - Huang , et al. June 1, 2 | 2021-06-01 |
Spacer Structure For Semiconductor Device App 20210126106 - WANG; Chen-Han ;   et al. | 2021-04-29 |
Semiconductor Device App 20200335608 - HUANG; Yao-Sheng ;   et al. | 2020-10-22 |
Semiconductor device and manufacturing method thereof Grant 10,707,333 - Huang , et al. | 2020-07-07 |
Semiconductor Structure And Method Of Forming The Same App 20200168507 - CHANG; I-MING ;   et al. | 2020-05-28 |
Electronic Apparatus And Passive Component Thereof App 20200060047 - Pai; Ting-Yu ;   et al. | 2020-02-20 |
Semiconductor Device And Manufacturing Method Thereof App 20200035811 - HUANG; Yao-Sheng ;   et al. | 2020-01-30 |
Integrated circuit wafer and integrated circuit die Grant 8,969,869 - Huang March 3, 2 | 2015-03-03 |
Ic Chip And Ic Chip Manufacturing Method Thereof App 20110272799 - Huang; Yao-Sheng | 2011-11-10 |
Integrated Circuit Wafer Dicing Method App 20110256690 - Huang; Yao-Sheng | 2011-10-20 |
Integrated Circuit Wafer and Integrated Circuit Die App 20110114950 - Huang; Yao-Sheng | 2011-05-19 |
Electronic Chip And Substrate Providing Insulation Protection Between Conducting Nodes App 20110103034 - Huang; Yao-Sheng ;   et al. | 2011-05-05 |
Mixed-mode Process App 20050158944 - Huang, Yao-Sheng ;   et al. | 2005-07-21 |
Mixed-mode process Grant 6,916,700 - Huang , et al. July 12, 2 | 2005-07-12 |
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