Huang; Yao-Sheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Yao-Sheng.The latest application filed is for "dipoles in semiconductor devices".
- Huang; Yao-Sheng - Kaohsiung City TW
- Huang; Yao-Sheng - Kaohsiung TW
- Huang; Yao-Sheng - New Taipei TW
- Huang; Yao-Sheng - New Taipei City TW
| Patent | Date |
|---|---|
| Dipoles In Semiconductor Devices App 20220310846 - Chang; Hsiang-Pi ; et al. | 2022-09-29 |
| Method For Forming Epitaxial Source/drain Features Using A Self-aligned Mask And Semiconductor Devices Fabricated Thereof App 20220278002 - Huang; Yao-Sheng ; et al. | 2022-09-01 |
| Spacer Structure For Semiconductor Device App 20220190137 - Wang; Chen-Han ; et al. | 2022-06-16 |
| Spacer structure for semiconductor device Grant 11,264,485 - Wang , et al. March 1, 2 | 2022-03-01 |
| Semiconductor Device And Forming Method Thereof App 20210288166 - HUANG; Yao-Sheng ; et al. | 2021-09-16 |
| Semiconductor Structure App 20210280468 - CHANG; I-MING ; et al. | 2021-09-09 |
| Electronic apparatus with a temperature sensor Grant 11,039,554 - Pai , et al. June 15, 2 | 2021-06-15 |
| Semiconductor structure and method of forming the same Grant 11,031,291 - Chang , et al. June 8, 2 | 2021-06-08 |
| Semiconductor device Grant 11,024,723 - Huang , et al. June 1, 2 | 2021-06-01 |
| Spacer Structure For Semiconductor Device App 20210126106 - WANG; Chen-Han ; et al. | 2021-04-29 |
| Semiconductor Device App 20200335608 - HUANG; Yao-Sheng ; et al. | 2020-10-22 |
| Semiconductor device and manufacturing method thereof Grant 10,707,333 - Huang , et al. | 2020-07-07 |
| Semiconductor Structure And Method Of Forming The Same App 20200168507 - CHANG; I-MING ; et al. | 2020-05-28 |
| Electronic Apparatus And Passive Component Thereof App 20200060047 - Pai; Ting-Yu ; et al. | 2020-02-20 |
| Semiconductor Device And Manufacturing Method Thereof App 20200035811 - HUANG; Yao-Sheng ; et al. | 2020-01-30 |
| Integrated circuit wafer and integrated circuit die Grant 8,969,869 - Huang March 3, 2 | 2015-03-03 |
| Ic Chip And Ic Chip Manufacturing Method Thereof App 20110272799 - Huang; Yao-Sheng | 2011-11-10 |
| Integrated Circuit Wafer Dicing Method App 20110256690 - Huang; Yao-Sheng | 2011-10-20 |
| Integrated Circuit Wafer and Integrated Circuit Die App 20110114950 - Huang; Yao-Sheng | 2011-05-19 |
| Electronic Chip And Substrate Providing Insulation Protection Between Conducting Nodes App 20110103034 - Huang; Yao-Sheng ; et al. | 2011-05-05 |
| Mixed-mode Process App 20050158944 - Huang, Yao-Sheng ; et al. | 2005-07-21 |
| Mixed-mode process Grant 6,916,700 - Huang , et al. July 12, 2 | 2005-07-12 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 