Huang; Xin-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Xin-Hua.The latest application filed is for "conductive bond structure to increase membrane sensitivty in mems device".
Company Profile
15.58.65
- Huang; Xin-Hua - Xihu Township TW
- Huang; Xin-Hua - Changhua County TW
- Huang; Xin-Hua - Kihu Township TW
- Huang; Xin-Hua - Xihu Township, Changhua County N/A TW
Patent Activity
| Patent | Date |
|---|---|
| Conductive Bond Structure To Increase Membrane Sensitivty In Mems Device App 20220219973 - Lin; Hung-Hua ; et al. | 2022-07-14 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20220216052 - Huang; Xin-Hua ; et al. | 2022-07-07 |
| Substrate Loss Reduction For Semiconductor Devices App 20220130765 - Huang; Xin-Hua ; et al. | 2022-04-28 |
| 3d Trench Capacitor For Integrated Passive Devices App 20220115358 - Huang; Xin-Hua ; et al. | 2022-04-14 |
| Conductive bond structure to increase membrane sensitivity in MEMS device Grant 11,292,715 - Lin , et al. April 5, 2 | 2022-04-05 |
| Integrate rinse module in hybrid bonding platform Grant 11,282,697 - Huang , et al. March 22, 2 | 2022-03-22 |
| Substrate loss reduction for semiconductor devices Grant 11,222,849 - Huang , et al. January 11, 2 | 2022-01-11 |
| 3D trench capacitor for integrated passive devices Grant 11,211,362 - Huang , et al. December 28, 2 | 2021-12-28 |
| Patterning A Transparent Wafer To Form An Alignment Mark In The Transparent Wafer App 20210375780 - Huang; Xin-Hua ; et al. | 2021-12-02 |
| Simultaneous Bonding Approach For High Quality Wafer Stacking Applications App 20210335646 - Huang; Xin-Hua ; et al. | 2021-10-28 |
| Substrate Loss Reduction For Semiconductor Devices App 20210335713 - Huang; Xin-Hua ; et al. | 2021-10-28 |
| 3d Trench Capacitor For Integrated Passive Devices App 20210296283 - Huang; Xin-Hua ; et al. | 2021-09-23 |
| Deposition System For High Accuracy Patterning App 20210273167 - Liu; Ping-Yin ; et al. | 2021-09-02 |
| Apparatus For Bond Wave Propagation Control App 20210272928 - Huang; Xin-Hua ; et al. | 2021-09-02 |
| Simultaneous bonding approach for high quality wafer stacking applications Grant 11,094,575 - Huang , et al. August 17, 2 | 2021-08-17 |
| Apparatus for bond wave propagation control Grant 11,031,369 - Huang , et al. June 8, 2 | 2021-06-08 |
| Approach for ultra thin-film transfer and handling Grant 10,962,878 - Liu , et al. March 30, 2 | 2021-03-30 |
| Conductive Bond Structure To Increase Membrane Sensitivty In Mems Device App 20200407220 - Lin; Hung-Hua ; et al. | 2020-12-31 |
| Simultaneous Bonding Approach For High Quality Wafer Stacking Applications App 20200381283 - Huang; Xin-Hua ; et al. | 2020-12-03 |
| Integrate rinse module in hybrid bonding platform Grant 10,665,449 - Huang , et al. | 2020-05-26 |
| Novel Approach For Ultra Thin-film Transfer And Handling App 20200064730 - Liu; Ping-Yin ; et al. | 2020-02-27 |
| Apparatus For Bond Wave Propagation Control App 20200051950 - Huang; Xin-Hua ; et al. | 2020-02-13 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20200006052 - Huang; Xin-Hua ; et al. | 2020-01-02 |
| Approach for ultra thin-film transfer and handling Grant 10,509,312 - Liu , et al. Dec | 2019-12-17 |
| Apparatus for bond wave propagation control Grant 10,497,667 - Huang , et al. De | 2019-12-03 |
| Method of semiconductor wafer bonding and system thereof Grant 10,410,892 - Lu , et al. Sept | 2019-09-10 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 10,354,972 - Liu , et al. July 16, 2 | 2019-07-16 |
| Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same Grant 10,283,448 - Liu , et al. | 2019-05-07 |
| Novel Approach For Ultra Thin-film Transfer And Handling App 20190094682 - Liu; Ping-Yin ; et al. | 2019-03-28 |
| Apparatus For Bond Wave Propagation Control App 20190096848 - Huang; Xin-Hua ; et al. | 2019-03-28 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20190051628 - Liu; Ping-Yin ; et al. | 2019-02-14 |
| Method and apparatus for a semiconductor structure Grant 10,160,638 - Chu , et al. Dec | 2018-12-25 |
| Wafer bonding process and structure Grant 10,128,209 - Liu , et al. November 13, 2 | 2018-11-13 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 10,103,122 - Liu , et al. October 16, 2 | 2018-10-16 |
| Apparatus and method for wafer level bonding Grant 10,049,901 - Liu , et al. August 14, 2 | 2018-08-14 |
| Multiple Metal Layer Semiconductor Device and Low Temperature Stacking Method of Fabricating the Same App 20180226337 - Liu; Ping-Yin ; et al. | 2018-08-09 |
| Alignment systems and wafer bonding systems and methods Grant 10,037,968 - Huang , et al. July 31, 2 | 2018-07-31 |
| Method Of Semiconductor Wafer Bonding And System Thereof App 20180144999 - LU; KUAN-LIANG ; et al. | 2018-05-24 |
| Hybrid bonding mechanisms for semiconductor wafers Grant 9,960,129 - Liu , et al. May 1, 2 | 2018-05-01 |
| Apparatus and method for cleaning Grant 9,953,847 - Liu , et al. April 24, 2 | 2018-04-24 |
| Hybrid bonding system and cleaning method thereof Grant 9,917,069 - Liu , et al. March 13, 2 | 2018-03-13 |
| Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same Grant 9,887,155 - Liu , et al. February 6, 2 | 2018-02-06 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20170358551 - Liu; Ping-Yin ; et al. | 2017-12-14 |
| Apparatus and method for verification of bonding alignment Grant 9,842,785 - Huang , et al. December 12, 2 | 2017-12-12 |
| Structure and formation method of semiconductor device structure Grant 9,834,435 - Liu , et al. December 5, 2 | 2017-12-05 |
| Air trench in packages incorporating hybrid bonding Grant 9,786,628 - Chou , et al. October 10, 2 | 2017-10-10 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 9,748,198 - Liu , et al. August 29, 2 | 2017-08-29 |
| Alignment Systems And Wafer Bonding Systems And Methods App 20170243853 - Huang; Xin-Hua ; et al. | 2017-08-24 |
| Debonding schemes Grant 9,741,681 - Huang , et al. August 22, 2 | 2017-08-22 |
| Multiple swivel arm design in hybrid bonder Grant 9,735,033 - Huang , et al. August 15, 2 | 2017-08-15 |
| Bonding System And Associated Apparatus And Method App 20170207191 - HUANG; XIN-HUA ; et al. | 2017-07-20 |
| Semiconductor manufacturing method and associated semiconductor manufacturing system Grant 9,704,820 - Huang , et al. July 11, 2 | 2017-07-11 |
| Apparatus And Method For Wafer Level Bonding App 20170140955 - Liu; Ping-Yin ; et al. | 2017-05-18 |
| Alignment systems and wafer bonding systems and methods Grant 9,646,860 - Huang , et al. May 9, 2 | 2017-05-09 |
| Debonding Schemes App 20170077062 - Huang; Xin-Hua ; et al. | 2017-03-16 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20170069593 - Chou; Bruce C.S. ; et al. | 2017-03-09 |
| Apparatus and method for wafer level bonding Grant 9,576,827 - Liu , et al. February 21, 2 | 2017-02-21 |
| Apparatus And Method For Verification Of Bonding Alignment App 20170047260 - Huang; Xin-Hua ; et al. | 2017-02-16 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20170004964 - Huang; Xin-Hua ; et al. | 2017-01-05 |
| MEMS structures and methods for forming the same Grant 9,533,876 - Liu , et al. January 3, 2 | 2017-01-03 |
| Grinding wheel for wafer edge trimming Grant 9,527,188 - Huang , et al. December 27, 2 | 2016-12-27 |
| Wafer Bonding Process and Structure App 20160358882 - Liu; Ping-Yin ; et al. | 2016-12-08 |
| Multiple Swivel Arm Design in Hybrid Bonder App 20160351422 - Huang; Xin-Hua ; et al. | 2016-12-01 |
| Debonding schemes Grant 9,508,586 - Huang , et al. November 29, 2 | 2016-11-29 |
| Air trench in packages incorporating hybrid bonding Grant 9,502,396 - Chou , et al. November 22, 2 | 2016-11-22 |
| Apparatus and method for verification of bonding alignment Grant 9,478,471 - Huang , et al. October 25, 2 | 2016-10-25 |
| Hybrid Bonding System And Cleaning Method Thereof App 20160293567 - LIU; Ping-Yin ; et al. | 2016-10-06 |
| Integrate rinse module in hybrid bonding platform Grant 9,446,467 - Huang , et al. September 20, 2 | 2016-09-20 |
| Air trench in packages incorporating hybrid bonding Grant 9,443,796 - Chou , et al. September 13, 2 | 2016-09-13 |
| Wafer bonding process and structure Grant 9,425,155 - Liu , et al. August 23, 2 | 2016-08-23 |
| Multiple swivel arm design in hybrid bonder Grant 9,385,010 - Huang , et al. July 5, 2 | 2016-07-05 |
| Low Contamination Chamber for Surface Activation App 20160181073 - Liu; Ping-Yin ; et al. | 2016-06-23 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20160163684 - Chou; Bruce C.S. ; et al. | 2016-06-09 |
| Hybrid bonding and apparatus for performing the same Grant 9,331,032 - Liu , et al. May 3, 2 | 2016-05-03 |
| Debonding Schemes App 20160111316 - Huang; Xin-Hua ; et al. | 2016-04-21 |
| Low contamination chamber for surface activation Grant 9,293,303 - Liu , et al. March 22, 2 | 2016-03-22 |
| Apparatus and Method for Wafer Level Bonding App 20150357226 - Liu; Ping-Yin ; et al. | 2015-12-10 |
| Hybrid Bonding Mechanisms For Semiconductor Wafers App 20150357296 - LIU; Ping-Yin ; et al. | 2015-12-10 |
| Multiple Swivel Arm Design In Hybrid Bonder App 20150332939 - Huang; Xin-Hua ; et al. | 2015-11-19 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20150287694 - Liu; Ping-Yin ; et al. | 2015-10-08 |
| MEMS Structures and Methods for Forming the Same App 20150266722 - Liu; Ping-Yin ; et al. | 2015-09-24 |
| Hybrid bonding mechanisms for semiconductor wafers Grant 9,142,517 - Liu , et al. September 22, 2 | 2015-09-22 |
| Wafer Bonding Process and Structure App 20150243611 - Liu; Ping-Yin ; et al. | 2015-08-27 |
| Apparatus And Method For Verification Of Bonding Alignment App 20150233698 - Huang; Xin-Hua ; et al. | 2015-08-20 |
| MEMS structures and methods for forming the same Grant 9,054,121 - Liu , et al. June 9, 2 | 2015-06-09 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 9,048,283 - Liu , et al. June 2, 2 | 2015-06-02 |
| MEMS device and method of formation thereof Grant 9,034,677 - Huang , et al. May 19, 2 | 2015-05-19 |
| Apparatus And Method For Cleaning App 20150068552 - LIU; PING-YIN ; et al. | 2015-03-12 |
| Low Contamination Chamber for Surface Activation App 20150064810 - Liu; Ping-Yin ; et al. | 2015-03-05 |
| Alignment Systems and Wafer Bonding Systems and Methods App 20150044786 - Huang; Xin-Hua ; et al. | 2015-02-12 |
| Systems and methods of separating bonded wafers Grant 8,945,344 - Huang , et al. February 3, 2 | 2015-02-03 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20140264948 - Chou; Bruce C.S. ; et al. | 2014-09-18 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20140263586 - Huang; Xin-Hua ; et al. | 2014-09-18 |
| Hybrid Bonding and Apparatus for Performing the Same App 20140256087 - Liu; Ping-Yin ; et al. | 2014-09-11 |
| MEMS Device and Method of Formation Thereof App 20140248730 - Huang; Hsin-Ting ; et al. | 2014-09-04 |
| Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers Grant 8,809,123 - Liu , et al. August 19, 2 | 2014-08-19 |
| Methods for hybrid wafer bonding Grant 8,802,538 - Liu , et al. August 12, 2 | 2014-08-12 |
| Methods of bonding caps for MEMS devices Grant 8,790,946 - Huang , et al. July 29, 2 | 2014-07-29 |
| Method and Apparatus for a Semiconductor Structure App 20140191341 - Chu; Li-Cheng ; et al. | 2014-07-10 |
| Hybrid Bonding Mechanisms For Semiconductor Wafers App 20140117546 - LIU; Ping-Yin ; et al. | 2014-05-01 |
| Multiple Metal Layer Semiconductor Device And Low Temperature Stacking Method Of Fabricating The Same App 20140091438 - Liu; Ping-Yin ; et al. | 2014-04-03 |
| Grinding Wheel For Wafer Edge Trimming App 20140051336 - HUANG; Xin-Hua ; et al. | 2014-02-20 |
| Systems and Methods of Separating Bonded Wafers App 20140020818 - Huang; Xin-Hua ; et al. | 2014-01-23 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20140011324 - Liu; Ping-Yin ; et al. | 2014-01-09 |
| Three Dimensional Integrated Circuit Structures and Hybrid Bonding Methods for Semiconductor Wafers App 20130320556 - Liu; Ping-Yin ; et al. | 2013-12-05 |
| Method of fabricating a semiconductor device having recessed bonding site Grant 8,580,594 - Huang , et al. November 12, 2 | 2013-11-12 |
| Methods of Bonding Caps for MEMS Devices App 20130203199 - Huang; Xin-Hua ; et al. | 2013-08-08 |
| MEMS Structures and Methods for Forming the Same App 20130099355 - Liu; Ping-Yin ; et al. | 2013-04-25 |
| Mems Device And Method Of Formation Thereof App 20130037891 - Huang; Hsin-Ting ; et al. | 2013-02-14 |
| Fabrication method of a flexible capacitive pressure sensor Grant 8,250,926 - Yang , et al. August 28, 2 | 2012-08-28 |
| Design and fabrication method of a flexible capacitive pressure sensor App 20110005325 - Yang; Yao-Joe ; et al. | 2011-01-13 |
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