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name:-0.0055749416351318
name:-0.0011749267578125
Huang; Weng-Hsing Patent Filings

Huang; Weng-Hsing

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Weng-Hsing.The latest application filed is for "[memory device and method for fabricating the same]".

Company Profile
0.4.10
  • Huang; Weng-Hsing - Hsinchu TW
  • Huang; Weng-Hsing - Hsin-Chu TW
  • Huang, Weng-Hsing - Hsin-Chu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Memory device and method for fabricating the same
Grant 6,777,285 - Huang , et al. August 17, 2
2004-08-17
[memory Device And Method For Fabricating The Same]
App 20040110344 - Huang, Weng-Hsing ;   et al.
2004-06-10
Memory device structure with composite buried and raised bit line
Grant 6,710,381 - Huang , et al. March 23, 2
2004-03-23
Structure of a memory device and fabrication method thereof
App 20040031983 - Huang, Weng-Hsing ;   et al.
2004-02-19
Method for improving the reliability of flash memories
Grant 6,673,720 - Huang , et al. January 6, 2
2004-01-06
STI method for semiconductor processes
App 20030181048 - Huang, Weng-Hsing ;   et al.
2003-09-25
Method of fabricating a flash memory cell
App 20030181051 - Chang, Kent Kuohua ;   et al.
2003-09-25
Method for reducing random bit failures of flash memories
App 20030181007 - Huang, Weng-Hsing ;   et al.
2003-09-25
Method for reducing particles and defects during flash memory fabrication
App 20030181008 - Huang, Weng-Hsing ;   et al.
2003-09-25
Method for improving reliability of STI
App 20030181049 - Huang, Weng-Hsing ;   et al.
2003-09-25
Memory device with low resistance buried bit lines
Grant 6,624,460 - Huang , et al. September 23, 2
2003-09-23
Method for improving the reliability of flash memories
App 20030160241 - Huang, Weng-Hsing ;   et al.
2003-08-28
Method of forming a via of a dual damascene with low resistance
App 20020123219 - Laverty, Jerald ;   et al.
2002-09-05
Method of forming a three-dimensional polysilicon layer on a semiconductor wafer
App 20020055226 - Liu, Chen-Chin ;   et al.
2002-05-09

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