loadpatents
Patent applications and USPTO patent grants for HUANG; Tzu-Sung.The latest application filed is for "packaged semiconductor devices with wireless charging means".
Patent | Date |
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Packaged Semiconductor Devices With Wireless Charging Means App 20220166254 - YU; Chen-Hua ;   et al. | 2022-05-26 |
Semiconductor Structure And Method Of Fabricating The Same App 20220165675 - Huang; Tzu-Sung ;   et al. | 2022-05-26 |
Integrated Circuit Package and Method App 20220139839 - Yu; Chen-Hua ;   et al. | 2022-05-05 |
Packaged semiconductor devices with wireless charging means Grant 11,251,644 - Yu , et al. February 15, 2 | 2022-02-15 |
Semiconductor structure and method of fabricating the same Grant 11,244,906 - Huang , et al. February 8, 2 | 2022-02-08 |
Integrated circuit package and method Grant 11,227,837 - Yu , et al. January 18, 2 | 2022-01-18 |
Semiconductor Structure And Method Of Fabricating The Same App 20210366833 - Huang; Tzu-Sung ;   et al. | 2021-11-25 |
Semiconductor Device and Method App 20210358870 - Huang; Tzu-Sung ;   et al. | 2021-11-18 |
Semiconductor package and manufacturing method thereof Grant 11,133,269 - Lu , et al. September 28, 2 | 2021-09-28 |
Semiconductor device and method Grant 11,075,176 - Huang , et al. July 27, 2 | 2021-07-27 |
Integrated Circuit Package and Method App 20210225723 - Huang; Tzu-Sung ;   et al. | 2021-07-22 |
Semiconductor Packages And Methods Of Forming The Same App 20210225812 - Yu; Chen-Hua ;   et al. | 2021-07-22 |
Integrated Circuit Package and Method App 20210193582 - Yu; Chen-Hua ;   et al. | 2021-06-24 |
Semiconductor Package And Manufacturing Method Thereof App 20210118811 - Lu; Chun-Ti ;   et al. | 2021-04-22 |
Semiconductor packages and methods of forming the same Grant 10,971,477 - Yu , et al. April 6, 2 | 2021-04-06 |
Integrated circuit package and method Grant 10,950,519 - Huang , et al. March 16, 2 | 2021-03-16 |
Semiconductor Package and Method App 20210005554 - Huang; Tzu-Sung ;   et al. | 2021-01-07 |
Integrated Circuit Package and Method App 20200381325 - Huang; Tzu-Sung ;   et al. | 2020-12-03 |
Semiconductor device and method Grant 10,790,244 - Huang , et al. September 29, 2 | 2020-09-29 |
Semiconductor package and method Grant 10,784,203 - Huang , et al. Sept | 2020-09-22 |
Packaged Semiconductor Devices With Wireless Charging Means App 20200266664 - YU; Chen-Hua ;   et al. | 2020-08-20 |
Packaged semiconductor devices with wireless charging means Grant 10,651,675 - Yu , et al. | 2020-05-12 |
Hexagonal Semiconductor Package Structure App 20200144861 - Huang; Tzu-Sung ;   et al. | 2020-05-07 |
Hexagonal semiconductor package structure Grant 10,530,175 - Huang , et al. J | 2020-01-07 |
Semiconductor Device and Method App 20200006259 - Huang; Tzu-Sung ;   et al. | 2020-01-02 |
Semiconductor Packages and Methods of Forming the Same App 20190244935 - Yu; Chen-Hua ;   et al. | 2019-08-08 |
Semiconductor Package and Method App 20190148301 - Huang; Tzu-Sung ;   et al. | 2019-05-16 |
Semiconductor packages and methods of forming the same Grant 10,269,773 - Yu , et al. | 2019-04-23 |
Semiconductor Packages and Methods of Forming the Same App 20190103379 - Yu; Chen-Hua ;   et al. | 2019-04-04 |
Semiconductor Device and Method App 20190103370 - Huang; Tzu-Sung ;   et al. | 2019-04-04 |
Packaged Semiconductor Devices With Wireless Charging Means App 20190020212 - YU; Chen-Hua ;   et al. | 2019-01-17 |
Packaged semiconductor devices with wireless charging means Grant 10,097,030 - Yu , et al. October 9, 2 | 2018-10-09 |
Hexagonal Semiconductor Package Structure App 20180048177 - Huang; Tzu-Sung ;   et al. | 2018-02-15 |
Packaged Semiconductor Devices With Wireless Charging Means App 20170317023 - YU; Chen-Hua ;   et al. | 2017-11-02 |
Network interface card frame Grant 6,337,797 - Huang January 8, 2 | 2002-01-08 |
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