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HUANG; Tzu-Sung Patent Filings

HUANG; Tzu-Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUANG; Tzu-Sung.The latest application filed is for "packaged semiconductor devices with wireless charging means".

Company Profile
17.14.21
  • HUANG; Tzu-Sung - Tainan City TW
  • Huang; Tzu-Sung - Tainan TW
  • Huang; Tzu-Sung - Hsin-Chu TW
  • Huang; Tzu-Sung - Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Packaged Semiconductor Devices With Wireless Charging Means
App 20220166254 - YU; Chen-Hua ;   et al.
2022-05-26
Semiconductor Structure And Method Of Fabricating The Same
App 20220165675 - Huang; Tzu-Sung ;   et al.
2022-05-26
Integrated Circuit Package and Method
App 20220139839 - Yu; Chen-Hua ;   et al.
2022-05-05
Packaged semiconductor devices with wireless charging means
Grant 11,251,644 - Yu , et al. February 15, 2
2022-02-15
Semiconductor structure and method of fabricating the same
Grant 11,244,906 - Huang , et al. February 8, 2
2022-02-08
Integrated circuit package and method
Grant 11,227,837 - Yu , et al. January 18, 2
2022-01-18
Semiconductor Structure And Method Of Fabricating The Same
App 20210366833 - Huang; Tzu-Sung ;   et al.
2021-11-25
Semiconductor Device and Method
App 20210358870 - Huang; Tzu-Sung ;   et al.
2021-11-18
Semiconductor package and manufacturing method thereof
Grant 11,133,269 - Lu , et al. September 28, 2
2021-09-28
Semiconductor device and method
Grant 11,075,176 - Huang , et al. July 27, 2
2021-07-27
Integrated Circuit Package and Method
App 20210225723 - Huang; Tzu-Sung ;   et al.
2021-07-22
Semiconductor Packages And Methods Of Forming The Same
App 20210225812 - Yu; Chen-Hua ;   et al.
2021-07-22
Integrated Circuit Package and Method
App 20210193582 - Yu; Chen-Hua ;   et al.
2021-06-24
Semiconductor Package And Manufacturing Method Thereof
App 20210118811 - Lu; Chun-Ti ;   et al.
2021-04-22
Semiconductor packages and methods of forming the same
Grant 10,971,477 - Yu , et al. April 6, 2
2021-04-06
Integrated circuit package and method
Grant 10,950,519 - Huang , et al. March 16, 2
2021-03-16
Semiconductor Package and Method
App 20210005554 - Huang; Tzu-Sung ;   et al.
2021-01-07
Integrated Circuit Package and Method
App 20200381325 - Huang; Tzu-Sung ;   et al.
2020-12-03
Semiconductor device and method
Grant 10,790,244 - Huang , et al. September 29, 2
2020-09-29
Semiconductor package and method
Grant 10,784,203 - Huang , et al. Sept
2020-09-22
Packaged Semiconductor Devices With Wireless Charging Means
App 20200266664 - YU; Chen-Hua ;   et al.
2020-08-20
Packaged semiconductor devices with wireless charging means
Grant 10,651,675 - Yu , et al.
2020-05-12
Hexagonal Semiconductor Package Structure
App 20200144861 - Huang; Tzu-Sung ;   et al.
2020-05-07
Hexagonal semiconductor package structure
Grant 10,530,175 - Huang , et al. J
2020-01-07
Semiconductor Device and Method
App 20200006259 - Huang; Tzu-Sung ;   et al.
2020-01-02
Semiconductor Packages and Methods of Forming the Same
App 20190244935 - Yu; Chen-Hua ;   et al.
2019-08-08
Semiconductor Package and Method
App 20190148301 - Huang; Tzu-Sung ;   et al.
2019-05-16
Semiconductor packages and methods of forming the same
Grant 10,269,773 - Yu , et al.
2019-04-23
Semiconductor Packages and Methods of Forming the Same
App 20190103379 - Yu; Chen-Hua ;   et al.
2019-04-04
Semiconductor Device and Method
App 20190103370 - Huang; Tzu-Sung ;   et al.
2019-04-04
Packaged Semiconductor Devices With Wireless Charging Means
App 20190020212 - YU; Chen-Hua ;   et al.
2019-01-17
Packaged semiconductor devices with wireless charging means
Grant 10,097,030 - Yu , et al. October 9, 2
2018-10-09
Hexagonal Semiconductor Package Structure
App 20180048177 - Huang; Tzu-Sung ;   et al.
2018-02-15
Packaged Semiconductor Devices With Wireless Charging Means
App 20170317023 - YU; Chen-Hua ;   et al.
2017-11-02
Network interface card frame
Grant 6,337,797 - Huang January 8, 2
2002-01-08

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