HUANG; Tai-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUANG; Tai-Yuan.The latest application filed is for "mass transfer method, mass transfer device and buffer carrier".
- HUANG; Tai-Yuan - Kaohsiung TW
- Huang; Tai-Yuan - New Taipei TW
- Huang; Tai-Yuan - New Taipei City TW
- HUANG; Tai-Yuan - Kaohsiung City TW
- Huang; Tai-Yuan - Kaohsiung County TW
- Huang; Tai-Yuan - Jiading Shiang TW
- Huang; Tai Yuan - Yunlin County TW
| Patent | Date |
|---|---|
| Mass Transfer Method, Mass Transfer Device And Buffer Carrier App 20210327731 - CHANG; Chih-Wen ; et al. | 2021-10-21 |
| Memory management method, memory storage device and memory control circuit unit Grant 10,871,914 - Lin , et al. December 22, 2 | 2020-12-22 |
| Data Writing Method, Memory Control Circuit Unit And Memory Storage Device App 20200341676 - Yang; Chieh ; et al. | 2020-10-29 |
| Memory Management Method, Memory Storage Device And Memory Control Circuit Unit App 20200210093 - Lin; Ping-Chuan ; et al. | 2020-07-02 |
| Semiconductor package device and method of manufacturing the same Grant 10,344,383 - Shih , et al. July 9, 2 | 2019-07-09 |
| Measurement equipment Grant 10,222,209 - Park , et al. | 2019-03-05 |
| Semiconductor Package Device And Method Of Manufacturing The Same App 20190040527 - SHIH; Chuan-Yung ; et al. | 2019-02-07 |
| Measurement Equipment App 20180128612 - Park; Seungbae ; et al. | 2018-05-10 |
| Measurement equipment Grant 9,891,048 - Park , et al. February 13, 2 | 2018-02-13 |
| Measurement Equipment App 20150211852 - PARK; Seungbae ; et al. | 2015-07-30 |
| Wafer and semiconductor package Grant 8,110,931 - Chang , et al. February 7, 2 | 2012-02-07 |
| Thermally enhanced package structure Grant 8,059,422 - Tong , et al. November 15, 2 | 2011-11-15 |
| Wafer And Semiconductor Package App 20100007004 - CHANG; Hsiao Chuan ; et al. | 2010-01-14 |
| Flip chip package process Grant 7,614,888 - Tong , et al. November 10, 2 | 2009-11-10 |
| Wafer structure with a buffer layer App 20090091036 - Chen; Chih-Hsing ; et al. | 2009-04-09 |
| Flip Chip Package Process App 20090087947 - Tong; Ho-Ming ; et al. | 2009-04-02 |
| Manufacturing Process And Structure Of A Thermally Enhanced Package App 20090075027 - Tong; Ho-Ming ; et al. | 2009-03-19 |
| Structure and method of forming metal buffering layer Grant 7,466,031 - Huang December 16, 2 | 2008-12-16 |
| Semiconductor package with a flip chip on a solder-resist leadframe Grant 7,253,508 - Liu , et al. August 7, 2 | 2007-08-07 |
| Real-time adjustable mechanism of shielding plate in sputtering vacuum chamber design App 20060278523 - Sheu; Geeng Jen ; et al. | 2006-12-14 |
| In-line coating/sputtering system with internal static electricity/dust removal and recycle apparatuses App 20060157345 - Huang; Tai-Yuan ; et al. | 2006-07-20 |
| Wafer level assembly package Grant 7,071,544 - Wang , et al. July 4, 2 | 2006-07-04 |
| Photosensitive Bonding Package Structure App 20060060765 - Huang; Tai-Yuan | 2006-03-23 |
| Structure and method of forming metal buffering layer App 20050266667 - Huang, Tai-Yuan | 2005-12-01 |
| Semiconductor package with a flip chip on a solder-resist leadframe App 20050133896 - Liu, Chien ; et al. | 2005-06-23 |
| Wafer level assembly package App 20040150119 - Wang, Chi-Yu ; et al. | 2004-08-05 |
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