Huang; Szu-Po

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Szu-Po.The latest application filed is for "3dic packaging with hot spot thermal management features".

Company Profile

8.28.31

Huang; Szu-Po - Taichung TW
HUANG; SZU-PO - TAICHUNG CITY TW
Huang; Szu-Po - Hsin-Chu TW
Huang; Szu-Po - Taipei N/A TW
Huang; Szu-Po - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package with embedded heat dissipation features Grant 11,133,237 - Hung , et al. September 28, 2	2021-09-28
3DIC Packaging with Hot Spot Thermal Management Features App 20210287956 - Hung; Wensen ; et al.	2021-09-16
3DIC packaging with hot spot thermal management features Grant 11,037,852 - Hung , et al. June 15, 2	2021-06-15
Semiconductor Device App 20200251427 - Kind Code	2020-08-06
Package With Embedded Heat Dissipation Features App 20200251398 - Kind Code	2020-08-06
Semiconductor device Grant 10,629,545 - Huang , et al.	2020-04-21
Package with embedded heat dissipation features Grant 10,629,510 - Hung , et al.	2020-04-21
3DIC Packaging with Hot Spot Thermal Management Features App 20200027809 - Hung; Wensen ; et al.	2020-01-23
3DIC packaging with hot spot thermal management features Grant 10,461,009 - Hung , et al. Oc	2019-10-29
3D semiconductor package interposer with die cavity Grant 10,446,520 - Jeng , et al. Oc	2019-10-15
Packaged semiconductor devices Grant 10,332,823 - Chen , et al.	2019-06-25
Packaged Semiconductor Devices App 20190122959 - Chen; Kim Hong ; et al.	2019-04-25
3DIC Packaging with Hot Spot Thermal Management Features App 20190096781 - Hung; Wensen ; et al.	2019-03-28
3DIC packaging with hot spot thermal management features Grant 10,157,813 - Hung , et al. Dec	2018-12-18
Methods of cooling packaged semiconductor devices Grant 10,157,818 - Chen , et al. Dec	2018-12-18
Package with Embedded Heat Dissipation Features App 20180269127 - Hung; Wensen ; et al.	2018-09-20
Semiconductor Device App 20180261554 - HUANG; KUAN-YU ; et al.	2018-09-13
Semiconductor packages with thermal management features for reduced thermal crosstalk Grant 10,062,665 - Chen , et al. August 28, 2	2018-08-28
3DIC package and methods of forming the same Grant 9,985,001 - Chen , et al. May 29, 2	2018-05-29
Package with embedded heat dissipation features Grant 9,978,660 - Hung , et al. May 22, 2	2018-05-22
3DIC packages with heat dissipation structures Grant 9,941,251 - Hung , et al. April 10, 2	2018-04-10
3D Semiconductor Package Interposer with Die Cavity App 20180026008 - Jeng; Shin-Puu ; et al.	2018-01-25
3DIC Packaging with Hot Spot Thermal Management Features App 20170345732 - Hung; Wensen ; et al.	2017-11-30
3D semiconductor package interposer with die cavity Grant 9,780,072 - Jeng , et al. October 3, 2	2017-10-03
3DIC packaging with hot spot thermal management features Grant 9,735,082 - Hung , et al. August 15, 2	2017-08-15
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same App 20170162542 - Chen; Kim Hong ; et al.	2017-06-08
3DIC Packages with Heat Dissipation Structures App 20170148767 - Hung; Wensen ; et al.	2017-05-25
Packages with thermal management features for reduced thermal crosstalk and methods of forming same Grant 9,595,506 - Chen , et al. March 14, 2	2017-03-14
3DIC Package and Methods of Forming the Same App 20170062391 - Chen; Kim Hong ; et al.	2017-03-02
Packages with thermal interface material on the sidewalls of stacked dies Grant 9,583,415 - Yu , et al. February 28, 2	2017-02-28
3DIC packages with heat dissipation structures Grant 9,576,938 - Hung , et al. February 21, 2	2017-02-21
3DIC package and methods of forming the same Grant 9,496,249 - Chen , et al. November 15, 2	2016-11-15
3DIC Packages with Heat Dissipation Structures App 20160284670 - Hung; Wensen ; et al.	2016-09-29
3D Semiconductor Package Interposer with Die Cavity App 20160254249 - Jeng; Shin-Puu ; et al.	2016-09-01
3D semiconductor package interposer with die cavity Grant 9,385,095 - Jeng , et al. July 5, 2	2016-07-05
3DIC packages with heat dissipation structures Grant 9,379,036 - Hung , et al. June 28, 2	2016-06-28
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same App 20160133602 - Chen; Kim Hong ; et al.	2016-05-12
Methods of Cooling Packaged Semiconductor Devices App 20160111350 - Chen; Kim Hong ; et al.	2016-04-21
Packages with thermal management features for reduced thermal crosstalk and methods of forming same Grant 9,269,694 - Chen , et al. February 23, 2	2016-02-23
3DIC Package and Methods of Forming the Same App 20160049389 - Chen; Kim Hong ; et al.	2016-02-18
Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices Grant 9,224,673 - Chen , et al. December 29, 2	2015-12-29
3DIC package and methods of forming the same Grant 9,184,128 - Hung , et al. November 10, 2	2015-11-10
Package with Embedded Heat Dissipation Features App 20150262904 - Hung; Wensen ; et al.	2015-09-17
3DIC packages with heat dissipation structures Grant 9,082,743 - Hung , et al. July 14, 2	2015-07-14
3DIC packages with heat sinks attached to heat dissipating rings Grant 9,076,754 - Hung , et al. July 7, 2	2015-07-07
3DIC Package and Methods of Forming the Same App 20150171006 - Hung; Wensen ; et al.	2015-06-18
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same App 20150162307 - Chen; Kim Hong ; et al.	2015-06-11
3DIC Packaging with Hot Spot Thermal Management Features App 20150155218 - Hung; Wensen ; et al.	2015-06-04
3DIC Packages with Heat Dissipation Structures App 20150108631 - Hung; Wensen ; et al.	2015-04-23
Packages with Thermal Interface Material on the Sidewalls of Stacked Dies App 20150108628 - Yu; Chen-Hua ; et al.	2015-04-23
3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings App 20150035135 - Hung; Wensen ; et al.	2015-02-05
3dic Packages With Heat Dissipation Structures App 20150035134 - Hung; Wensen ; et al.	2015-02-05
Method for forming nanometer scale dot-shaped materials Grant 8,911,821 - Lu , et al. December 16, 2	2014-12-16
Nano-metal Solution And Nano-metal Complex Grains App 20140318414 - Chiou; Kuo-Chan ; et al.	2014-10-30
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices App 20140252585 - Chen; Kim Hong ; et al.	2014-09-11
3D Semiconductor Package Interposer with Die Cavity App 20140217610 - Jeng; Shin-Puu ; et al.	2014-08-07
Method For Forming Nanometer Scale Dot-shaped Materials App 20100270516 - LU; Chun-An ; et al.	2010-10-28
Nano-metal Solution, Nano-metal Complex Grains And Manufacturing Method Of Metal Film App 20100166952 - Chiou; Kuo-Chan ; et al.	2010-07-01